IT/Hardware/Software/Electronics/ and oter electronic device

JOEFREN V. JOSAFAT

Mobile no. 052*******

E-mail Address: ***********@*****.***

To obtain a position whereby experiences would be applicable in

contributing to the achievement of the company's goal with the allowance

to learn and to enhance my abilities as an individual.

Date of Birth : May 21,1985

Place of Birth : Iba, Zambales

Status : Married

Citizenship : Filipino

Current Address : Al Tajir Building (Aroos Damascus), Rigga, Deira,

Dubai, U.A.E

Tertiary : St. Columban College Philippines YR: 2002-

2007

COURSE : Bachelor of Science in Computer Engineering

November 15, 2006 - January 5,2007 Management Information

System

(IT/Hardware Management) OJT Subic Bay Freeport Zone

SBMA

Nov. 2007 - July 2011 Wistron Infocom Philippines

Position : JR ENGINEER Subic Bay

Freeport Zone SBMA

JR Engineer (Repair)

Work Description:

. Troubleshoot Defects of Mainboards of DELL, FUJITSU, ACER, HITACHI,

IBM,SONY

. Provide Failure analysis report for defective motherboards by signal

trace and pin to pin analysis for IC components in board level repair.

. Sort / Repair / Rework Defective Mainboards

. Full / Partial Function Testing

. BGA & X-RAY Process

. Power Sequence Creator of New Desktop Models

. Analyze and solve issues in production line regarding test, repair,

and quality control flow to meet required customer turnaround time for

replacing DOA (Dead On Arrival) motherboards.

. Attend trainings and experience-sharing sessions with local

engineers on failure analysis methods, soldering techniques, signal

and trace analysis, and the usage of relative repair equipment such as

debug card, multimeter, oscilloscope and BIOS programming.

. Perform other functions required by the Customer Service Department.

. Perform final analysis to Hard-to-Repair (HTR) motherboards for

scrap declaration and long lead-time boards specifically Dell, IBM,

Hitachi, Fujitsu and ACER motherboards.

. Perform new product introductory (NPI) repair analysis for new

models/products first launched to the production for repair process by

solving issues and common problems encountered by these motherboards,

such that a failure analysis report is made as a troubleshooting guide

for the repair engineers.

July 2011 - Dec. 2014 Honeywell Aerospace

Avionics

Position : Manufacturing Technician Malaysia SDN BHD

Repair Overhaul Technician

Assembly - level 1

Manufacturing Technician

. Proficient with electronics circuitry both digital and analog

electronics

. Highly trained in soldering in surface mount and thru-hole components

. Work with Supervisor in meeting Production Goals & Objectives

. Work with Engineers in resolving Production related issues

. Coach & assist Assemblers/ /Technicians in verification of test

failures

. Strive for continuous improvement

. Ability to read schematics diagram/circuitry

. Knowledge in Basic workmanship standards/Component configuration

. Data entry using computer interface for SAP

. Good communication & Interactive skills

. Can work independently with minimum supervision

. Understand product function by model and failure categories

. Use correct skills/tools to solve defect board

. Knowledge in using instrument such as oscilloscope, power supply,

Communication Test Set and multimeter and other circuitry analyzer

. Perform Product Testing according to Engineering Bulletin, Acceptance

Test Procedure and Integrated Test

Repair & Overhaul Technician

. Perform a preliminary inspection of the unit to include fault

isolation, disassembly, cleaning and component inspection.

. Determine the material and order parts required for maintenance.

. Ability to understand applicable Department of Civil Aviation

Regulations, customer and repair/overhaul requirements for products.

. Ability to use specific test and measurement equipment for products.

. Ability to remove, troubleshoot, repair and install

components/Electromechanical components approved by Federal Aviation

Administration (FAA)

. Be involved in investigations related to product failures, escapes and

defects.

Assembly - level 1

. Perform a visual inspection of the Circuit Card Assembly(CCA) and all

the material

needed to build the product

. Escalate to Product Quality Engineer(PQE) if found any incoming defect

before performing the task

. Assembly the unit according to Work Instruction (WI) and Aero PDM

Soldering, Can read Schematic Diagram

SAP (ERP), Programming C, C++, Visual Basic, HTML, Photoshop Software,

Networking, System Administration, Microsoft Office, Hardware Repair &

Software Troubleshooting such as NOTEBOOK, DESKTOP, LCD TV, SERVER, Hand

Pocket Device, Aerospace Avionics product such as PACE & Cardset, AFMC

and other electronics device. Knowledge in Electrical and

Electromechanical.

Internal Trainings:

. ESD Awareness program

. Production and Assembly Process

. Material Familiarization and Handling

. Circuit Board Level Soldering

. ROHS - Restriction on the Use of Certain Hazardous Substances in

Electrical and Equipment

. SAP(ERP)

. Microsoft Office

. QMS

. SOLDERING TRAINING

. Honeywell Aerospace Avionics Malaysia

. WISTRON INFOCOM PHILIPPINES

Subic Bay Freeport Zone SBMA

I hereby certify that all statement and information contained

herein are true and correct to the best of my knowledge and belief.

JOEFREN V. JOSAFAT

APPLICANT

O B J E C T I V E

P E R S O N A L I N F O R M A T I O N

E D U C A T I O N A L ATTAINMENT

W O R K E X P E R I E N C E

S K I L L S AND A B I L I T TIES

Contact this candidate