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Technician High School

Location:
Ambavaram, AP, 523112, India
Posted:
March 02, 2015

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Resume:

CURRICULUM VITAE

[pic]

OBJECTIVE:

RAVI To obtain a position that will enable me to use my

PINGULA strong organizational skills, educational

background and ability to work well with people,

Email: and also keep in touch with the emerging

****.****@*****.*** technologies so that I can move easily with day to

***********@*****.*** day developments in the Organization.

Contact No: ACADEMIC QUALIFICATIONS:

+919*********

Permanent Address:

P.RAVI S/O Sarvesu, Completed (ITI) VOCATIONAL ELECTRONICS from Govt

junior College, Chintalapudi.

T.CH.R.Palem(post),

Lingapalem(mandal), One year professional DIPLOMA in Hardware &

ELURU,W.G.Dist. -534462. Networking Administrator.

Contact Address:

P.Ravi Completed SSC from Z P high school, Dharma Gudem

H.No: LIG:90, (2001).

APIIC Colony, Moula-Ali,

Hyderabad-40 TECHNICAL SKILLS:

Personal profile: Operating systems : Micro soft Windos XP

Date of Birth : 14-jun-1985

Gender : Male .

Nationality : Indian

Marital Status : Married Packages : MS-OFFICE.(Micro

Languages Known: soft word)

(Speaking & writing) Excel and Power point) And

1. Telugu Ms-Windows.

2. English

3. Hindi

JOB PROFILE & WORK EXPERIENCE

1. Organization: LAMPEX ELECTRONICS LTD (Liquid Crystal Display

(LCDs)

. I am working in this organization Oct 01st 2005 to Nov

9th2009(4 years,4months)

. Designation: SMD SOLDERING TECHNICIAN.

2. . Organization: ICSA (India) ltd (smart energy meter (SEM)

manufacturing) working in this organization Nov 10th 2009 to 23rd

Feb 2012 (2years, 3months)

. Technician in Production Energy Meter PCB's assembling,

. Hardware testing & Electronic Trouble shooting,

. Designation: SMD SOLDERING SENIOR TECHNICIAN.

3. Organization: ACL(Apollo Computing Laboratories)

I am working in this organization (Feb 24th 2012 to Till Date)

. SMD P C B Soldering

. Unit Wiring

. Designation: SMD SOLDERING HARDWARE TECHNICIAN.

NATURE OF WORKS

. Assembling of Embedded based PCBs which includes SMD Components.

. SMD Soldering for the all types of Packages (SOIC, QFP, SOT).

. SMD Soldering for 0201, 0402, 0603, 0805, 1206 & 2512 component

packages.

. SMD Micro controller Soldering (360 pin 0.2micron pitch soldering).

. Assembling CCSC (A4) & CCSC (A5) & miu V3 & FOLC & Bisa & PCBs

Soldering.

. Harness wiring A5&A4 MISAEL Internal Unite wiring

. Soldering & Crimping of connectors & wires wiring, cabling &

Harnessing of Units & Test Jigs

DECLARATION:

I consider myself a good team played with

excellent interpersonal skills and good communication abilities. I am

confident and full of enterprise and initiative. My strongest

characteristics are my ability to adapt to any situation, ability to learn

things fastened a highly discerning mind.

I hereby declare that the above -disclosed particulars are genuine to the

best of my knowledge and belief.

Place:

Date:

(P.Ravi)



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