Engineer Quality

DHIRENDRA PATHAK

*** ******** ***** **, *******, MO 63021; Tel: 636-***-****

Email: *****@*****.***

SUMMARY

Over 18 years of industry experience with highly diversified background including high volume

manufacturing, quality control, SPC implementation, and failure analysis. Strong focus on operational

issues, internal/external quality issues, and customer relationship management. Self-motivated, multi-

lingual, result-oriented individual with excellent analytical skills and ability to work and lead in team

environment. Very good communication and presentation skills. ASQ Six-Sigma Black Belt certification.

PROFESSIONAL EXPERIENCE

Jan'14 -- To date Express Scripts, Sr. Quality Consultant (contract)

St. Louis, Missouri

Analyst responsible for defining, developing, and coordinating the implementation of a quality

management system for FPS division. Responsibilities include:

. Reviewed current status of quality in terms of customer requirements, existing capabilities, and

gaps. Proposed QMS solution to meet customer/contractual requirements.

. Gained leadership alignment by demonstrating the need of a comprehensive QMS by

highlighting CoPQ, customer feedback, system issues, and need of process control.

. Provided training to internal business partners in basic quality tools and processes.

June'13 -- Dec'13 Express Scripts, Sr. Business Consultant (contract)

St. Louis, Missouri

Analyst responsible for analyzing and proposing improvements in the current business

processes/systems used in hiring temporary IT professionals. Responsibilities include:

. Reviewed current process used in Fieldglass system and interviewed various groups to gather

user requirements.

. Performed statistical analysis of historical data to understand variables and their interaction

affecting system performance.

. Developed SPC charts for controlling and monitoring process cycle-time.

Nov'11 -- Apr'13 Triumph Pharmaceuticals, Quality Assurance & Regulatory Affairs

St. Louis, Missouri – Quality & Supply Chain Manager

Manager responsible for all quality assurance, regulatory, and supply chain activities for manufacture of

oral health care products. Responsibilities and accomplishments include

. Approval of batch release, production and approval of validation and scale-up batches, stability

testing review and approval, root cause analysis of any customer complaints etc.

. Periodic audits and review of supplier base to ensure continual improvement in quality

performance.

. Developed ISO 9001 system documentation to streamline all business processes to improve

business performance.

Jan’ 10 – Oct'11 MEMC, Quality Engineering

St. Peters, Missouri – Quality Engineer (contract)

Quality Engineer responsible for metrology operations for epitaxial wafers. Responsibilities and

accomplishments include:

. Participated in the development of FMEA and Control plans as part of APQP process for

metrology operations.

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. Conducted MSA for metrology tools to ensure measurement data integrity.

. Directed internal quarterly audits and participated in yearly external TS16949 audits.

. Participated in MRB to disposition non-conforming material.

. Developed responses to customer quality issues (CAR, 8D) using teams of process engineers,

R&D, and manufacturing personnel.

Mar’ 08 – Dec’ 09 Harman International, Quality Engineering

Washington, Missouri – Sr. Supplier Quality Engineer

Quality Engineer responsible for in-coming and field quality issues for all parts used in automotive

products such as, infotainment systems, and amplifiers. Responsibilities and accomplishments include:

. Developed and implemented a matrix for measuring supplier’s performance. Established a team

of people from purchasing, design, process, and quality to define areas of improvement to

reduce DPPM levels for top 5 suppliers using six sigma methodologies.

. Managed a team of 1 engineer and 2 technicians to improve overall quality levels.

. Defined and implemented continuous improvement plans for items such as, cycle time for issue

closure, defect levels, and SPC implementation.

. Reviewed and approved supplier’s PPAP, process changes, and 8Ds.

. Participated in supplier audits.

Feb’ 07 – Feb’ 08 MEMC, Product Engineering

St. Peters, Missouri – Quality Engineer

Quality Engineer responsible for all wafer products for Intel corp. Responsibilities and accomplishments

include:

. Served as the primary interface to Intel for all issues related to quality, yield, and qualification of

various wafer products from design win through production release.

. Coordinated various bench-marking efforts for existing wafer products to define areas of

improvement.

. Provided response to customer quality issues by providing 8D using a team approach.

May’ 04 – Oct’ 06 Jazz Semiconductor, Supply Chain Management Group

Newport Beach, California – Customer Quality Engineer

Quality engineer responsible for 15 customer accounts (e.g. TI, Freescale) for total annual revenue of $

15M. Responsibilities and accomplishments include:

. Served as primary interface to customer for all issues related to their design, prototyping and

qualification efforts, from design win through production release.

. Served as primary interface for all quality and reliability issues on production parts. Coordinated

activity with the yield and engineering teams to resolve product related parametric and yield

issues.

. Coordinated failure analysis activities to resolve field failures.

. Coordinated with logistics, operations and quality organization to set up customer quarterly

business reviews and factory audits.

Jul’ 02 – Apr’ 04 Texas Instruments, Logic & Wireless Business Group,

Dallas, Texas – Quality & Reliability Engineer

Lead engineer responsible for defining and implementing quality and reliability requirements for worldwide

production of logic and wireless semiconductor products. Responsibilities and accomplishments include:

. Developed and implemented qualification and reliability requirements for worldwide wafer

fabrication and assembly operations for 0.25 and 0.18 um semiconductor technologies.

. Participated in IPC and JEDEC standards committee conferences to review draft

standards in the area of reliability testing standards.

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. Led a virtual team of engineers from Japan, Taiwan, Philippines, and US to

transfer assembly production capacity from a plant in Japan to the plants in

Philippines and Taiwan.

. Defined and implemented quality and reliability requirements for emerging

technologies, such as, lead-free materials and green-mold compounds.

Jul’ 96 – Jun’02 Texas Instruments, Silicon Technology Development,

Dallas, Texas – Process Engineer

. Researched, developed and implemented diffusion and ion-implantation process technologies for

0.25 and 0.18 um semiconductor technologies. Coordinated the design and execution of

experiments with process integration group to understand transistor performance issues.

Analyzed parametric and yield data to understand process margin and implemented required

process changes.

. Authored two internal research papers one of which was adopted for manufacturing the next

silicon technology node. The first paper discussed the relationship between Silicon-di-oxide

growth and Argon ion-implantation in Silicon. The second paper proved the advantages of chain

ion-implantation process to reduce the cycle time for manufacturing a typical silicon

semiconductor product. This method of chain ion-implantation was adopted in all manufacturing

facilities worldwide resulting in substantial savings for the company (~ $ 40 M).

. Successfully executed a project involving technology transfer from US to a wafer fabrication plant

in South Korea. Achieved the product quality and output goals before the deadline resulting in

improved time-to-market performance.

. Effectively managed a team of four technicians and six operators to run day-to-day operations for

ion-implantation, diffusion, and wet-clean process modules resulting in meeting or exceeding the

quality and output goals.

. Implemented statistical process controls (six-sigma) in ion-implantation, and diffusion process

modules to maintain acceptable quality of products.

Aug’88 – Dec’ 89 United Technologies Automotive, Dearborn, Michigan -

Metallurgist

Lead engineer responsible for technical operational issues in manufacturing wire harnesses for various

automotive customers. Accomplishments include:

. Developed and implemented solutions for various engineering problems, such as, creep,

corrosion, and fracture etc., encountered in manufacturing wire harnesses for automotive

customers (GM, Ford, and Chrysler).

. Led a team of technicians and operators to implement quality control procedures in four

manufacturing plants, resulting in 15% quality improvement as measured by defective parts in a

given batch of parts.

. Developed and presented engineering plans to external and internal customers for qualifying

automotive components.

. Surveyed and evaluated various vendors for setting up a failure analysis laboratory in-house.

July’ 83 – Jan’86 Bhilai Steel Plant, Bhilai, India - Junior Manager

Manager responsible for managing a team of technical personnel in achieving quality and output goals.

Accomplishments include:

. Managed a team of twelve manufacturing personnel involved in the production of pig iron.

Implemented manufacturing and quality control procedures to achieve or exceed productivity and

quality goals consistently.

. Developed and taught an engineering class to educate technicians and operators about blast

furnace operation.

EDUCATION

M.B.A., Southern Methodist University,

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Ph.D. (Materials Science & Engineering), North Carolina State University.

M.S. (Electrical Engineering), North Carolina State University.

M.S. (Materials Science & Engineering), North Carolina State University.

B.S. (Metallurgical Engineering), University of Roorkee, India.

SKILLS

. Statistical Data Analysis (e.g. MiniTab, JMP), SAP, and MS Office Applications.

. Eaton GSD High Current and High Energy Implanters, Varian Mid-current implanters, RTP

Systems, TEL Furnaces, LPCVD, and related metrology tools, e.g. Tencor SP1, 4-pt probe,

MCLT, TXRF measurements, SPV, FTIR, ADE Ultragage, SSM C-V measurements.

. Failure Analysis techniques (SEM, TEM, X-ray, Auger, SIMS, DSC, DTA, TGA, etc.).

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