Krishna Vepa *****@***.***
SUMMARY PROFILE
Krishna Vepa has 15+ years of experience in semiconductor manufacturing, process development, equipment
development, green-field wafer facility build and ramp, and providing product/consulting/services to major
equipment suppliers, semiconductor manufacturers and foundries. He has been recognized for key
contributions for VC/industry funded start-ups, pre-public companies and $10B semi capital equipment company
stalwarts.
• 15+ years’ experience in materials processing, wafer manufacture and fab services including defect
detection/reduction; 24x7 high-volume, high ramp manufacturing; off-shore manufacturing; global capacity
planning; green-field fab planning/capital expenditure/build out and ramp; large team personnel
management; and factory optimization.
o As Manager, Manufacturing Technology for MEMC Electronic Materials –– Krishna was
responsible for manufacturing technology and project management of a 600-person, 24x7
manufacturing facility in Malaysia (25 direct reports plus 100+ indirect reports). He championed
Best Practices to improve yield by 3%, reduce manufacturing costs by 30%, and increased
capacity by 25% with a higher ASP product while maintaining product reliability and customer
satisfaction. Ramped factory at peak to approx. $50M and 300,000 wafer starts/month. Highest
profit contribution center in MEMC history.
o As Engineering and Business Manager for a Key Product Unit of Applied Materials, designed,
built and ramped up a green-field 50,000 wafer starts/month facility in Taiwan. Managed
business strategy for Wafer Service group, including $25M capital expenditure for plant design,
equipment selection, operations, staffing and start-up.
o As Sr Consultant, built paid service business for knowledge offerings from discovery to
generating SOW through solution delivery focus on clean energy. Worked with Applied
Materials solar customers to assess wafering yields, quality, output & productivity to drive down
costs. Developed consulting offerings through benchmarking, on-site assessments and
developed of software tools for resource monitoring/conservation.
• Successful track-record planning and implementing new business endeavors including fund
raising, intellectual property, joint development products, manufacturing facility design, capital
expenditure planning, equipment selection, operations management, staffing hiring/training, start-up,
and high-volume ramp.
2826 Hoya Common, Livermore, CA 94551
o As General Manager – Silicon Business Unit for Strasbaugh – a $75M manufacturer of
CMP tools – selected to lead spin-off and start-up of Wafer Solutions, a developer of
cluster tool sets for low-cost semiconductor manufacturing of 300mm substrates (Intel
was strategic partner and investor). As CTO and Co-Founder, built and managed
strategic alliances with Fortune 500 partners and led negotiations for intellectual property
and joint development projects. Directed product engineering and technology validation
for cluster tool (process, cleaning and in-line metrology) and raised over $6M from
strategic and financial investors. Fast-tracked tool prototype in 4 months
Business failed to get 2nd round financing due to 2000-2002 recession.
Technology spin-off for thin wafer handling in 3D IC applications.
As Sr. Engineering & Business Manager for Applied Materials, effected a turn-
around at contract vendor in Taiwan which had been recruited to supply
reclaimed test wafers for AMAT. Facility was unproductive as a result of
unmotivated employees, management disarray, cost mismanagement, etc.
Revamped staffing and operations, infused new technology and raised yields.
Increased wafer volume 5x (<5K wpm to over 22K wpm). Became supplier of
choice to leading manufacturers in Taiwan. Also in this role at AMAT, was
responsible for new 300mm state-of-the-art, green-field wafer facility in Taiwan.
Applied Materials management was pleased with results at contract
manufacturer, and decided to invest in a second facility. Designed facility layout,
built out new space, evaluated/bought equipment, developed processes,
managed integration, and qualified product with major customers including IBM-
Fishkill, TSMC and UMC. Hired and trained teams; managed 30 professionals
and 200 technicians. Ramped production to 50K wafers/mo (approx. $25M)
• Strong process expertise including Silicon Wafering, Wet Processes, Thin Films/CVD), Process
Automation, Contamination control, Data Analysis, DOE, Statistical Methods & Metrology/Vision
Systems
o Has > 10 patents
• Drives growth through technology and a strong focus on lean manufacturing, cost of
ownership reduction, benchmarking, sustainability, capex planning/execution and manufacturing
execution systems.
• Proven success optimizing asset utilization through best-in-class technology and
streamlining operations. Leverage process/engineering to lower manufacturing costs while
sustaining statistical process control, quality control, ISO certification, total quality management,
product reliability, customer satisfaction, plant uptime, production and safety.
Experience
APPLIED MATERIALS, Santa Clara, CA 2004 – 2013
Founding member of a client focused group evolving from value add service to a full fledged P/L consulting
practice dedicated to solve complex problems & challenged with a mission to expand Applied’s service footprint.
Consulting Practice Manager 2009 to 13
As a client facing practice manager, challenged to gain customer traction as a paid service for engagements from
discovery to generating SOW through solution delivery.
• Expanded consulting footprint by piloting a customized tool software development (multiple systems) for a
leading edge foundry. Extended revenue > $2.5M
20004 09
KPU Sr. Engineering & Business Manager
Applied’s $2B Service division wanted to increase customer penetration by expanding service portfolio.
Recruited to manage offshore vendor to supply test wafer services. Role grew to effect a turn around at contract
vendor.
• Grew service revenue to over $15M revenue in 18 months.
• Volume increase of production was 5X in this period (<5Kwpm to over 22Kwpm)
• Developed service strategy for follow on investments to include a $25M capex spend
• Designed, built & ramped up a green field 50kwpm wafer facility in Taiwan ($25M capex)
INDEPENDENT CONSULTANT, Livermore, CA 2002 04
Provided advanced wafer manufacturing and inspection solutions for KLA Tencor, Isonics Corporation for SOI
development and process development. Established and qualified vendor for a $1M (GM > 50%) valve refurb
business with leading customer
WAFER SOLUTIONS, INC., Fremont, CA 1999 02
Start up developer of cluster tool sets for low cost semiconductor manufacturing of 300MM substrates. Series B
funded by INTEL, Saint Gobain et. al . Directed product engineering and technology validation, for wafering cluster
tool development. Raised over $6M with strategic and financial investors
• Enabled low capital intensity business model by outsourced supply partnerships
• Fast tracked prototype build with advanced controls in 4 months
Business Manager Silicon Business Unit: 1999
STRASBAUGH, San Luis Obispo, CA
Business and sales development of newly formed business unit focused on ssolution delivery of silicon manufacturing
products CMP and Grinding systems. This situation led to co-founding Wafer Solutions
MEMC ELECTRONIC MATERIALS 1992-99
Held several situations rising from MTS to Sr. Tech Manager managing a $8MM technology budget and several
PhD level direct reports.
Manager, Manufacturing Technology, Kuala Lumpur, Malaysia 1996 98
Managed manufacturing technology, customer support and projects at a 600 person, 24/7 facility. Improved
overall yield by 3% and reduced manufacturing costs by 30%
• Increased capacity by 25% with higher ASP product
•Fast track management & startup of a 25% capacity expansion $4MM project.
MTS, Technology Group St. Peters, MO 1992 95
Education
• D.Sc. Applied Chemistry, University of Texas, Arlington, TX (PhD equivalent)
• BS Chemical Engineering, University of Madras, India