engineer

Glenn Tessmer

***** *** ***** *****, ******, TX 75248 214-***-**** ******@*****.***

SUMMARY:

Leadership – Managed process development engineering teams of 8, 10 and 12 people resulting in over

$50M annual savings.

– Acting Process Engineering Manager of 20 while primary was on FMLA

– Acting Quality Manager for 10 months while primary was hired

Individual – Process engineer experienced across all phases of business including research,

development, pilot line, mass production and transfer of mass technology to Asia. A Six Sigma Black

Belt with LEAN, quality, statistical process control, continuous improvement and quality experience

EXPERIENCE:

United Copper Industries, Denton, TX 2012-2014

Process Engineer

- Managed $1.4M Annual Operating Plan projects for copper rod quality improvement which resulted in

best-in-class performance. Internal customer’s run speed increased effectively lowering product cost.

- Management Operating System implementation provided daily Safety, Quality and Productivity metrics,

deltas and actions to the executive team. Weekly Pareto and action items addressed quality and

productivity deltas to plan. Safety findings are addressed immediately.

- Established and led a corporate level quality alert process to resolve repetitive customer complaints by

verifying the defect, finding root cause, implementing and validating corrective actions.

- Determined the copper rod manufacturing process controls necessary to meet the critical-to-customer

requirements. Evaluated and purchased $500k laboratory instrumentation required to monitor quality and

provide industry standard Certificates of Compliance against the ASTM copper rod specification.

- Identified “cracking nylon” THHN wire defect root cause and through DOE increased process margin by

raising the quench temperature. 2015 capital equipment modifications will further increase Cp.

Diodes Incorporated, Plano, TX 2010-2012

Customer Quality Engineer

Worldwide continuous improvement process engineer converting from gold to copper wire bonding.

Travelled quarterly to China to train new staff. The qualification of copper wire saves > $5M annually.

Expedited USA technical customer claims through root cause analysis and corrective actions to continuously

improve products and the customer relationship. Utilized the automotive 8D report format.

Coordinated failure analysis, reliability test, product, field applications, sales, and manufacturing engineers to

resolve customer design-in, questions, issues and failures.

Prepared reliability test plans for new products, reviewed the product qualification and reliability test results

against automotive requirements, and granted the product production release as either “commercial” or

“automotive”.

DRS Technologies, Dallas, TX 2008-2010

Senior Process Engineer

Modified PECVD processes to be compatible with Vanadium Oxide (VOx) and InGaAsP based

microbolometers enabling the introduction of a dual band product to the market place.

Led Gauge Repeatability and Reproducibility (GR&R) measurement system analysis on film stress, film

thickness, scanning electron microscopy and product final test tools. Results were the electron microscope

resolution needed improvement and the product final test measurement was out of calibration. Final test tool

calibration increased product yield by eliminating false negatives.

Led the critical dimension target and control team. A new technology development method linking current

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and desired production capability to R&D has improved new product launch performance.

Identified lithography process margin issues and drove lithography set-up changes that reduced rework,

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improved process margin and increased manufacturing yield. Recognized infrared camera “picture

framing” defect as lithographic process margin issues. Recognized infrared camera reference pixel

failures as a dense-isolated bias defect and changed design layout eliminating the failure mechanism and

improving product performance. Improved focus set-up change reducing rework, improving process

margin and increasing yield.

Texas Instruments, Dallas, TX 1995-2008

Senior Member of the Technical Staff

- Managed a group of 4 process engineers and 4 process technicians and drove a fundamental process

methodology change in the definition of transistor gate critical dimension (CD). This new process

revolutionized TI’s transistor control, increased yield 12% points, reduced rework by 10x and cut gate

process cycle time by 70%. This process has been implemented worldwide for all CMOS technologies

released since 1998.

- World Wide Packaging Copper Wire Bond process development owner traveling to Japan, Taiwan and

Malaysia to work with TI engineers and OEMs on cooper wire bond reliability and qualification. Replaced

gold wire with copper wire has saved Texas Instruments more than $50M annually. The significance of

this work was recognized by election to Senior Member Technical Staff.

- Collaborated with the transistor R&D team recommending a semiconducting crystal change to combat

Intel’s technological advance, stained gate transistor, which was released 4 years earlier than TI

expected. I countered Intel’s brute force process by simply rotating the semiconducting crystal 45 degrees

to take advantage of the lower electron effective mass in that crystal direction. Significantly faster

transistors at no additional cost!

- Developed, patented and released to production a copper oxide reduction process with in-situ silicon

nitride (SiN) passivation. This eliminated copper interconnect corrosion and enabled the production of

copper interconnect products. This process is in place at all TI CMOS copper interconnect factories.

- Developed, patented and released to production a nickel corrosion reduction process prior to deposition

of the silicide passivation layer. This work allowed the development of high performance 0.15 micron

nickel silicide transistors by greatly reducing contact resistance.

- Developed and released to production a new SiN/SiO2/TiN plasma etch process combining two

processes into a single machine. A 33% reduction in new tool purchases resulted.

- Released Texas Instrument’s first automated model based process to production. Mass production

dielectric thin film deposition Statistical Process Control (SPC) was linked to an exponentially weighted

moving average process model to automatically adjust run-to-run process parameters. Process capability,

Cpk, was increased to greater than 2.67.

- Traveled to Texas Instruments packaging groups in Malaysia, Taiwan and Japan as an instructor in Si

CMOS wafer fab processes, Si technology integration and the effects of Si processing on packaging.

- TI Worldwide Quality Group “Red Team”. This team of 5 addressed TI’s top tier customers’ quality issues.

The team worked directly with customers such as Bosch, Sun Microsystems and Delphi to quickly and

professionally resolve issues

- Pilot line dielectric deposition team leader of 6 engineers and 4 technicians.

EDUCATION:

- Six Sigma Black Belt Certificate, Air Academy

- M.S., Applied and Engineering Physics, Cornell University, NY

- M.S., Electrical Engineering, Union College, NY

- B.S., Physics, Union College, NY

- Eagle Scout, Boy Scouts of America

ACADEMIC HONOR SOCIETIES:

Tau Beta Pi (Engineering)

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Eta Kappa Nu (Electrical Engineering)

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Sigma Pi Sigma (Physics)

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Sigma Xi (Research)

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