David S. Courage, Sr.

***A Pelham Street

Methuen, Massachusetts 01844

Telephone: 978-***-****

E-mail: acfd4s@r.postjobfree.com

Summary

Semiconductor/MEMS Assembly Engineering Professional with progressive, direct, hands on experience in

Process Development, Sustaining and Equipment Engineering, as a Technician, Prototype Assembly Lab

Supervisor, Engineering Assistant and Engineer. Proven ability to support and lead cross-functional teams and

provide training, mentorship and technical leadership to Operators, Technicians, Engineers and Management

personnel. Co-Inventor on several MEMS Assembly Patents.

Experience

1980 – 2013 Analog Devices Incorporated

2007 – 2013 Senior MEMS Assembly Process Engineer; Worldwide Manufacturing Wilmington,

Massachusetts

Provided Technical Leadership and Training to fellow Engineers and Management,

during the transfer of MEMS from the Cambridge Micromachined Products Division

to Worldwide Manufacturing in Wilmington

o Team Member/Technical Lead on numerous production troubleshooting

activities (onsite and remote), often requiring equipment reconfiguration and

tooling redesign

o Team Leader for the implementation and documentation of Best Known

Assembly Practices at offshore Assembly Subcontractors

o Managed the Qualification of Lead Free Hermetic Packaging for MEMS

Devices

o Technical Review Board Leader for MEMS Assembly

o Front and Back End Materials Review Board Representative for Assembly

Engineering

o Managed the initial Production implementation of MEMS Microphone Wafer

Blade Dicing

o Assembly Engineering Representative on key Customer reviews and

presentations

1997 – 2007 MEMS Assembly Process Engineering Assistant and Assembly

Prototype Lab Supervisor; Micromachined Products Division Cambridge,

Massachusetts

Managed the successful transfer of High Volume MEMS Manufacturing to Offshore

Assembly Subcontractor

o Equipment Purchase, Buy-off and Transfer

o Provided Onsite training to Engineers, Technicians and Manufacturing

personnel on Process and Equipment Set Up and Sustaining

o Documentation Systems (Process Set Up and Control and Equipment Set Up,

Control and Maintenance)

Technical Leader on Process Sustaining and Yield Improvement Programs

Managed Engineering Teams responsible for New Product Introductions from

Prototype through implementation to High Volume Manufacturing

Co-Inventor on several MEMS Wafer Dicing Patents

o Managed Projects from Feasibility through Proof of Concept, including the

design, procurement and testing of Custom Equipment, Tooling and Materials

Managed onsite MEMS Prototype Assembly Lab and Electrical Test Equipment

Maintenance

o Hired and trained Assembly personnel (Operators and Technicians)

o Managed day-to-day lab activities

1988 - 1997 Senior Process Engineering Technician; Wilmington Manufacturing

Developed, documented and implemented processes for MEMS Device Production

Assembly in Wilmington

o Uncapped MEMS Die Prep, Die Attach, Wire Bond, Seal, etc.

Completed numerous equipment buy-offs, both domestic and abroad

o Dicing Saws, Custom MEMS Die Prep Systems, Die Attach, Wire Bond and

Belt Furnaces (OBO/LFE and Seal)

Created and Managed all Equipment and Process Documentation

1986 - 1987 Senior Production Technician; Microelectronics Division Wilmington,

Massachusetts

Responsible for the Setup, Programming, Preventive Maintenance and Repair of

Hybrid Assembly Equipment including; Die Attach (Epoxy), Wire Bond (Aluminum

Wedge and Gold Ball), Seal (Solder and Seam Seal) and Environmental Test Systems

1980-1986 Senior Assembly Technician; Semiconductor Division Wilmington, Massachusetts

Responsible for the Setup, Programming, Preventive Maintenance and Repair of

Monolithic I.C. Assembly Equipment including; Manual and Automatic Dicing Saws,

Die Attach (Eutectic and Epoxy), Aluminum Wire Bond, Seal (Solder and Resistance

Welding) and Environmental Test Systems

Patents

Method and device for protecting micro electromechanical systems structures during dicing of a wafer(Link)

United States Patent Number 6,946,326

Issued September 20, 2005

Method and device for protecting micro electromechanical systems structures during dicing of a wafer(Link)

United States Patent Number 6,946,366

Issued September 20, 2005

Method and device for protecting micro electromechanical systems structures during dici ng of a wafer(Link)

United States Patent Number 7,022,546

Issued April 4, 2006

Education

Sylvania Technical School Waltham, Massachusetts

Graduate in Computer Electronics curriculum

Miscellaneous/Keywords

MEMS, Hermetic Packaging, Wafer Dicing (Blade and Laser), Die Attach (Eutectic,

Epoxy, Silver Glass), Alphasem, Datacon, Wire Bond (Aluminum, Gold), K&S, Hesse

Mechatronics, Optical Inspection, Seal (Solder, Glass, Resistance Welding, Seam Seal),

BTU & RTC Belt Furnaces, Laser Marking, Microsoft Office, Lotus Freelance Graphics,

WordPro, Adobe Frame Maker, Photoshop, Acrobat, PROMIS. Zero Defects,

Automotive

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