Engineer Administrative Assistant

Peggy J. McKay

Boulder Creek, CA *****

408-***-**** cell

831-***-**** home

Objective: Hands on role in process technology with emphasis in photolithography

process fabrication or new process development.

Highlights:

• Led successful high visibility photolithography cost reduction project at

TI/Silicon Systems

• Samsung Semiconductor employee of the year for development of

submicron gate photolithography process

• 6 years focus on submicron photolithography process development

• 20 years engineering and manufacturing experience with wide range of Si

and GaAs wafer process techniques including evaporator and sputter metal

deposition, chemical vapor deposition of dielectrics, wet etch, reactive ion

etch and through wafer via reactive ion etch

October 6, 2011 to Present

Engineering Technician – Thermo Fisher Scientific

Major responsibilities:

• Manufacturing and assembly of extremely intricate x ray tube components

in clean room environment.

• Glass blowing of tube envelopes, furnace operation, vacuum brazing, laser

and spot welding.

• SPC, sustaining of process, lean manufacturing methods.

• Assisting in R & D development of new design devices, process

documentation creation.

• Continuous Process Improvement Team

September 2007 to October 2011

Taliesin Handworks – Owner, designer textile arts and crafts

April 2002 to September 2003:

Zwerling Physical Therapy

Administrative assistant – medical services

June 1995 to March 1998

Texas Instruments – Sr. Staff Photolithography Engineer

Major responsibilities:

• Daily over site and sustaining of photolithography in class 10 clean room

• Created equipment analysis test plans for defect density study, implemented

regular qualification procedures, implemented auto equipment shut down

with SPC.

• Determined parameters for automated process recipe and tracking system

(PROMIS).

• Spear headed new chemical qualification and reduction of photo resist

usage resulting in major cost reduction for the company.

• Utilized SEM for detailed photoresist geometry sidewall height

measurements.

• Design test procedures for new equipment qualification and acceptance.

• Calibration of DNS coater developer system and Canon 10X i line and G

line steppers.

• Participate on 0.5 um BiCMOS process development team.

January 1982 to June 1995:

Samsung Electronics – (Harris Microwave) – Sr. Process Engineer

Major responsibilities:

• Sustaining and supervision of photolithography department of GaAs class

100 clean room.

• Scheduling of production.

• SEM inspection for analysis of process issues.

• Sustaining and operation of process equipment such as: Stepper, contact

alignment, Perkin & Elmer Sputter/thin films, e beam evaporators, plasma

etch. PECVD deposition, ion milling, RIE etch, wet etch, electrical test,

wafer thinning and scribe and break.

1975 to 1982

Watkins Johnson – Process Technician

Major responsibilities:

• Process and development of GaAs FET devices.

• Photolithography wet/dry etch, epi growth, thin film sputter.

Education:

• A.S. Electronics Technology – Cabrillo College

Proficient with Microsoft Word, Excel, Power Point

Extensive experience in clean room practices and protocol

References available upon request

Contact this candidate