Junpeng Feng

** ******* ***, ******, ** ***** 617-***-**** acea5s@r.postjobfree.com

EDUCATION

Northeastern University, Boston, MA, U.S.A

Graduation: Dec. 2013

. M. S. in Electrical Engineering

. Relevant courses: RF Integrated Circuit Design, Analog Integrated

Circuit Design,

Solid State Devices, VLSI Design,

MEMS.

Shenyang University of Technology, Shenyang, Liaoning, P.R.CHINA

Jul. 2009

. B.S. in Electrical Engineering

. Relevant courses: Analog Circuit Analysis, Digital Circuit Analysis,

Circuit Analysis,

C Programming, Signal and System, MCS-

51single chip assembler language,

Principle of Automatic Control,

Electromechanics, DC/AC Motor Control.

TECHNICAL SKILLS

CAD software: Cadence Spectre, Cadence Virtuoso Schematic Editor, Cadence

Layout Editor, Calibre tools, HSpice,

PSpice, MATLAB SIMULINK, Protel 99SE.

PCB Design tool: KiCad.

Operating systems: Windows, Linux, Mac OS.

Desktop Application: Microsoft Office.

Computer languages: C/C++, Assembly language for MCS-51.

THESIS RESEARCH

. Temperature sensor for on-chip measurement of gain and power dissipation

of RF circuits.

. Finished the design, simulation, tapeout, PCB design, soldering,

measurements.

. Familiar with TSMC 0.18 m CMOS technology and Dongbu 0.11?m CMOS

technology.

. Know how to use Spectre of Cadence tools for layout and simulation.

. Learned the transimpedance amplifier (TIA) design.

. New temperature sensor design with low power consumption (0.6mW), wider

dynamic range and higher sensitivity than previous versions.

. Obtained analog IC design, tapeout, and measurement experience.

PROJECTS

A. Sample and Hold design (Ongoing)

. Design a Sample-and-Hold for a 500MHz input signal and 1GHz sampling

frequency.

B. High gain amplifier design

. Use of Miller compensation.

. Class AB output stage design (open-loop gain: 92dB).

. Three-stage amplifier design with 0.18?m TSMC CMOS technology.

. Common-mode feedback (CMFB) to stabilize the operating point.

C. Attenuator Design for OTA

. Attenuate the voltage swing from Vpp=1.2V to Vpp=40mV.

. Limited error on different corner of process variation and under

-30 C~85 C.

. Voltage regulator with bias current control circuit.

D. Common-Gate LNA with Gm-boosting

. Finished its design and layout using 0.18?m CMOS technology.

. Operating at 2GHz.

E. Double-balanced Mixer Design

. Input baseband signal: 990MHz, Output signal: 10MHz, Local Oscillator:

1GHz.

. Conversion gain: 12.58dB at 10MHz, Noise Figure: 16.64dB, IIP3:3.06dBm.

F. Low power, low phase noise VCO design

. Tuning range:1.73GHz-2.2GHz

. Power consumption: 1.967mW, Total Harmonic Distortion (THD): 5.36%.

. Phase noise: -80.1dBc/Hz at 10KHz offset, -128.1dBc/Hz at 1MHz offset.

F. 16-bit multiplier

. Implemented in 90nm CMOS technology.

. Finish its Layout and DRC, LVS checking in Cadence.

. Verified using HSpice.

G. Doubly-fed Induction Motor Flux Linkage Optimization (Undergraduate

Project)

. Learned the skills of Simulink simulation under MATLAB.

. Optimized and stabilized the flux linkage of doubly-fed induction

motor.

. Understand the approach of using doubly-fed motor in Hybrid-Electric

Vehicle.

CONFERENCE/WORKSHOP PUBLICATION

Accepted:

J. Feng and M. Onabajo, "A wide dynamic range temperature sensor for On-

Chip power monitoring", submitted to 2013 IEEE North Atlantic Test Workshop

(NATW).

JOURNAL PUBLICATION

Invited and Accepted:

J. Feng and M. Onabajo, "Wide dynamic range CMOS amplifier design for RF

signal power detection via electro-thermal coupling," Springer J.

Electronic Testing (JETTA): Theory and Applications, vol. 30, no. 1, pp.

101-109, Feb. 2014.

POSTER PRESENTATION

J. Feng and M. Onabajo, "A Wide Dynamic Range Temperature Sensor For On-

Chip Power Monitoring," Research and Scholarship Expo, Northeastern

University, March, 2013.

JOURNAL/CONFERENCE REVIEW

Journal reviewer for:

Nanoscience and Nanotechnology Letters, ISSN: 1941-4900 (Print); EISSN:

1941-4919 (Online).

Conference reviewer for:

ACM (Association of Computer Machinery) Great Lakes Symp. on VLSI

(GLSVLSI), 2014.

Contact this candidate