Engineer Process

HERBERT HOUSE

**** ***** ******* *****, ****, NC 27502 Cell: 303-***-****

********@*****.***

Professional Summary

Results-oriented Senior Process Engineer specializing in high-level problem

solving, process efficiency and day-to-day maintenance in microelectronics

manufacturing environments. I have routinely used troubleshooting skills to

eliminate down-time on process lines and tools. Experienced with

Statistical Process Control (SPC) software and MS Excel to define and

improve process capabilities. Trained in Six Sigma and Lean Manufacturing.

Trained as ISO 9001 auditor. Experienced in micro-electro-mechanical

systems (MEMS) metal deposition processes. Expert in several electro- and

electroless plating processes used in microelectronic fabrication. I can

make a positive impact on your manufacturing and/or research and

development processes to increase yields and reduce costs. Experience in

wastewater pretreatment in manufacturing environments. Experience with Reel-

to-Reel Plating practices.

Work History

Laird Durham, Inc., Durham, NC 05/2009 to

03/2014

Senior Process Engineer

. Created, developed, and implemented multiple metal plating processes to

enable production of thin film thermoelectric devices. The new processes

improved device quality, performance, and yields by 30%. [Au, Sn, Cu,

NiP, Ni, SnPb]

. Integrated electroplating processing with thin-film deposition and

processing of evaporated seed metals. [TiCuTi, CrAu, TiAuTi, Ti] This

included multiple designs [masks] and integration with photolithography

films. [AZ4620, SIPR-7123, and lift-off processing]

. Developed the required metrology techniques to evaluate electroplating

processing including thickness via stylus profilometry, and critical

dimension using optical-based microscope metrology [Pax-It].

. Instituted a periodic assessment of plating bath chemistries and tracked

additives needed. Also developed a plating database to track bath usage

for predictive maintenance.

. Site Environmental, Health, and Safety Engineer (EHS). Responsible for

30+ individuals on-site, handled safety certification and coordinated self-

contained breathing apparatus (SCBA) training.

. Actively worked on ISO audits and certified as internal auditor.

Significant contributor in driving the organization to ISO9001

certification.

. Worked with a team for outsourcing the processing of components used in

the assembly of thin-film thermoelectric devices. This will result in

decreased operating costs and increased productivity for the site.

. Significant contributor to the development of a stable metal to semi-

metal (semiconductor) electrical contact system. This led to a stable

material system exceeding the Telcordia GR-468-CORE specifications

[Thermal Age: 85 C, 2000 hr; Power Cycle: 0.8A, 5 sec ON/5 sec OFF, 85 C,

2000 cycles; Thermal Cycle: -40 C to 85 C, 10 sec transition, 500 cycles].

. Wrote operating procedures, certification documents, metrology procedures

& maintenance instructions and trained multiple technicians in proper

electroplating practice.

HERBERT HOUSE

Sun Microsystems, Inc., Louisville, CO.

06/2004 to 04/2009

Senior Process Engineer

. Successfully implemented innovative copper plating process in

manufacturing of micro data storage devices.

. Improved device yield by increasing plated structure uniformity from 30%

non-uniformity down to 2% non-uniformity.

. Experienced in NiFe plating, anodizing, metal etching, chemical

mechanical polish (CMP), and photolithography processes.

. Certified in lean manufacturing and Six Sigma Process.

Lexmark, Inc., Boulder, CO 05/2001 to

04/2004

Manufacturing Engineer

. Technical leader in development of new water based toner technology for

manufacturing of printer cartridges.

. Successfully implemented pilot plant trials of new toner manufacturing

technology.

. Experienced in wastewater process control and management.

Uyemura International, Inc., Longmont, CO

08/1997 to 10/2000

Technical Service Engineer

. Managed key customer accounts in high volume circuit board and

microelectronic device manufacturing sites across Western United States.

. Employed experience on technical solutions in a timely and effective way

to reduce customer process down times.

. Expert in metal finishing areas including: gold (hard and soft), copper

(acid and electroless), tin, nickel (bright, satin, and electroless).

. Designed and implemented several plating lines (manual and computer

controlled)

Education

1990: MBA, Business Administration, St. Edward's University, Austin, TX

1976: Bachelor of Science, Chemistry, Michigan Technological University,

Houghton, MI

Granted US Patent (2008): 7,403,359. "Method for protecting against

corrosion in a GMR sensor

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