Mustafa Muhammad
Kitchener, ON Institute
Canada N2E 2K1 for Quantum Computing
Phone: 226-***-**** University of Waterloo
Email: ************@*****.*** 200 University Ave W
Waterloo, ON, Canada N2L 3G1
HIGHLIGHTS / EXPERIENCES
Background:
Strong background in micro and nano-scale Semiconductor Device, Process, Yield,
and Development Engineering.
Silicon Wafer Processing, Thin Films Deposition and Characterization; ALD,
MOCVD, PECVD, PVD.
Hands-on experience in broad semiconductor technologies, troubleshooting,
laboratory set-up, experiment design.
Expertise in deposition techniques, optical coatings, vacuum systems, plasma
process, etching, lithography, device physics, device packaging, and
characterization.
Equally good in research, hands-on engineering, team work, training, and
communication works.
Can-do and result oriented.
Work Eligibility Sponsorship, and Relocation:
I am a Canadian citizen and eligible to work in the U.S. under TN visa
category. I do not require sponsorship. I am willing to relocate with own
expense.
Project and Lab Management:
Broader knowledge and hands-on experience in diverse semiconductor-fab industry
applications and products.
Tactical and strategic thinking, organizational management and leadership
skills.
Project management, research project design and execution, and project
close-out; maintaining lab user and supplier relation, sourcing lab materials
and equipments.
Proactive coordination, collaboration, and administrative support.
Well familiar with standards for integrated safety management, Environment
Health and Safety, Quality Assurance policies applied to Clean Room fabrication
facilities.
Documentation and document control. Have basics of cost estimation, bill of
materials, and quoting knowledge
Training and Collaboration:
Trained graduate students in low temperature transport measurement techniques
and device fabrication in clean rooms.
Collaboration and maintaining good communications with internal and academic
peers from outside institutions.
Thin Films Deposition/Processing:
Deposition and characterization of Thin Films of metals and dielectric/high-k
dielectric/metal-oxide; Sputter and E-beam evaporation PVD, ALD, MOCVD, PECVD;
Lift-off process.
Thin Films Characterization/Metrology:
Thin films characterization using Profilometer, Filmetrics, Ellipsometer,
Scanning Electron Microscope (SEM), AFM and I-V measurements.
Device Fabrication and Characterization:
Nine years of experience with device fabrication and characterization.
Metal and oxide/dielectric device; III-V semiconductors, metal-oxide/CMOS
device.
Semiconductor-superconductor hybrid devices, InAs/InGaAs, InAs/GaSb, and
GaAs/AlGaAs semiconductors with 2DEG for device fabrication.
Expertise in vacuum systems and vacuum pumps.
Low signal low noise electrical measurements, device packaging.
Lithography and Etching:
Experience with Lithography techniques, Photomasks design with Autocad.
Dry Etching, Wet Chemistry, and Plasma Process Development:
Computer Skills:
Data analysis, Simulation, Computer Controlled Data Acquisition, Matlab,
Labview, Python, C++; Origin, Mathcad, SQL, Microsoft Office package and
Autocad.
Related Technical Skills:
Hands on experience on process development, Instrumentation and Automation,
Troubleshooting, Wire Bonding, Packaging, Yield Engineering, Root Cause Failure
Analysis. Low temperature experiments, electronic/low temperature transport
measurements.
General Skills:
Excellent verbal and written communication skills and research proposal
writing.
Strong interpersonal, professional presentation, attention to detail, judgment
and decision-making skills.
A team-player, quick learner. Organizing, prioritizing, and remaining flexible
with respect to job duties. Able to work with tight deadlines and under
pressure.
Willing to learn and take initiative, strong work ethic and ability to work
effectively in a team environment
WORK EXPERIENCE
1. Research Engineer: August 2011 - September 2013. Institute for
Quantum Computing, University of Waterloo, Ontario, Canada.
2. Research Associate: July 2008 - June 2011. National Institute for
Nanotechnology (NINT), University of Alberta, Canada:
3. PhD: 2008, Experimental Condensed Matter Physics: University of
Cincinnati, USA:
4. Internship: March 2003 - May 2003. CEA, Saclay, France:
5. Internship: May 2003 - August 2003, The University of Glasgow,
U.K.
SCHOLARSHIPS
. University Graduate Scholarship, University of Cincinnati, USA.
. University Scholarship, Shahjalal University of Science and Technology,
Bangladesh.
EDUCATION
. Ph.D. Experimental Condensed Matter Physics, University of Cincinnati,
USA
. M.S. Physics, University of Cincinnati, USA
REFERENCES WILL BE PROVIDED UP ON REQUEST