Process Control
Resume:
STEPHANIE j. tUCKER
Melbourne, Florida 32935
***********@***.***
OBJECTIVE To obtain a challenging position that allows me to utilize my current skills to assist in advancing a
business that offers a stable employment opportunity. I am also eager to learn new skills and
technological advancements.
SKILLS & ABILITIES Many years of experience in the semiconductor industry in the following three areas, wafer
grinding and polishing, wafer fabrication in both the etch and photo resist areas.
Team Leader/Product Coordinator with strong problem solving, team dynamics, and situational
leadership abilities.
EXPERIENCE INTERSIL CORPORATION
Palm Bay, Florida 32905
Wafer Fabrication Technologist
09/1999-12/17/2013
• Iridia Etcher
Gasonics dual chamber etcher, used to independently to remove a layer of photo resist
without penetrating the lower layer.
• P5000 Etchers
• Four chamber dry etcher, used for etching poly, trench, oxide and metal processes.
• Centura Etcher
Four chamber dry etcher, used for etching poly, metal and oxide processes.
• Critical Dimension measurement tools. Nano Spec, UV1250/MGAGE
To ensure the die limits are within engineering’s Statistical Process Control.
• FSI wafer cleaning technology.
Cleaning system used to eliminate photo resist particles and oxide growth on the
Wafers.
• Auto wet bench/Manual wet bench
Mix and use complex chemical etches to precisely control removal of dielectric and silicon layers
on semiconductor wafers.
• Coordinate with all shifts to ensure continuous workflow and daily production goals are
met.
• Perform weekly qualifications on process equipment to ensure that they are in statistical
process control.
• Train new employees in certain areas.
• Interact with engineering to resolve product issues.
• Security Clearance:
CCI security clearance (Controlled Cryptographic Items)
ITAR clearance (International traffic in arms Regulations)
• Certification of Completion for Statistical Process Control Training.
• Received four letters of appreciation on my performance reviews, for the rating
of Significantly Exceeded Standard.
PAGE 1
HARRIS SEMICONDUCTOR
Palm Bay, Florida 32905
10/22/1979-08/1999
Wafer Fabrication Technologist
• Wafer grinding and polishing
To reduce wafers from their original thickness during chip fabrication to the required
thickness, using Disco and 7aa grinders.
• Spin Coaters/Perkin Elmer Projection Mask Aligner/Photolithography developer/High and
low power microscope inspections.
Deposition of photosensitive photo resist on the wafers, then exposed by mask aligner
and developed. Inspected to ensure all circuits exposed.
• Post Hard Bake
Used to harden the photoresist on the wafers before the etching process is started.
• Deep Ultra Violet Light Bake (DUV)
Infrared bake process for chemically amplified lithography.
• Auto wet bench/Manual wet bench.
Mix and use complex chemical etches to precisely control removal of dielectric and
silicon layers on semiconductor wafers.
• Quad Etcher
Four chamber dry etch process, used for Trench, Poly and oxide processing.
• AME 8330 dry etchers for Metal/oxide plasma etching.
Plasma etching for a more defined and uniform etch.
• Aura Strippers/Descum
Used for photoresist removal on an etched wafer. Descum process for removing
residual photoresist in the trenches on the wafer.
EDUCATION BREVARD COMMUNITY COLLEGE AND HARRIS CORPORATION
Palm Bay, Florida Graduated 1992
Specialized Employee Education (S.E.E.) program.
Microelectronics Manufacturing Technology (Industrial Operations)
COMMUNICATION Worked closely with the oncoming shift to update them on the daily schedule.
LEADERSHIP Production Coordinator, ensure continuous workflow and daily production goals are met.
REFERENCES JUDITH DUNCAN
2620 Grant Street
Melbourne, Florida 32901
Home phone 321-***-****
FAITH POKORNY
714 Diplomat Avenue S.E.
Palm Bay, Florida 32909
Home Phone 321-***-**** Cell Phone 321-***-****
PAGE 2
PAGE 3
Contact this candidate