SHAOMING ZHU

*** ***** **, **** *********, NY****1 acd7nk@r.postjobfree.com 631-521-

0883(cell) /631-***-****(home) US Citizen

OBJECTIVE Seeking R&D/Process development/process

improvement /Failure analysis/Quality assurance

engineer position

PROFESSIONAL Fourteen years experiences in semiconductor

PROFILE devices and process research, design, development, new

process integration to manufacturing, process

management and improvement, with a strong academic

background on material science field. Outstanding

track record of problem solving and project release to

increase revenue. Strong self motivated with records

proven dedication to task assignment.

EXPERIENCES Sensitron Semiconductor

Deer Park, NY 7/1999-4/2013

A leading manufacturer of high reliability power

electronic solutions. Markets served include the

complete spectrum of high reliability markets in

space, aerospace, and defense.

Sr. Process Engineer (9/2009-4/2013)

Conducted customer products specification evaluation

and review. Interfaced with customer, and wrote

manufacture technical requirements including device

test travelers for custom specific products.

Conducted many process improvement projects to speed

up the productivity, enhance quality and reduce cost.

Conducted glass package production line trouble

shooting and products failure root-cause analysis,

wrote analysis reports which led to corrective actions

to eliminate product failures and enhance products

reliability.

Established annealing process for different glass

package products and glass stress measurement criteria

to control product internal stress and provide

baseline reliability.

Production Manager (1/2005-8/2009)

Conducted management for high reliability power device

production lines (glass-sleeve and glass frit).

Conducted new device manufacture process design,

workflow planning, scheduling, raw material

procurement, labor force training, products shipment

and customer service.

Conducted manufacturing process control for reducing

cost and increasing yield. Internal/External

manufacturing process coordinating, trouble shooting.

Conducted processes oversee/control of photo

groove(photolithography), metal evaporation

deposition, die bonding, device glass package firing

and sealing.

Conducted process SPC monitoring, Oversaw production

QA process for electrical test before product

shipping.

Maintained and updated BOM for production line.

Worked with Government MIL-PRF-19500 auditing

procedure.

Sr. Design Engineer(7/1999-12/2004)

Initialized and completed company's glass-sleeve

device package production line for high reliability

power devices production. Established complete

processes by resolving techniques of die bonding,

glass cracking, under-plate blistering, glass

bubbling, hermetic seal, electrical failures, etc.

Glass-sleeve production line added series new products

to the company production category, and generated

significant avenue.

Designed and qualified following products for the

glass-sleeve production line per Mil-prf-19500:

Zener 5w diodes (1N4958 ~1N4989).

Fast switch diode device (1N6638,1N6640, 1N6642).

Zener 1.5w devices (1n4478~1n4494).

TVS 500W(1n6102 & A -1n6137&A).

Schottky fast switch diodes(1n5819-1, 1n5819ur-1).

Wrote specification for wafer dicing, chip inspection,

chip cleaning, component loading, sealing profiling

and dap-sealer operation, SPC monitoring, and final

microscope inspection.

Supervised manufacturing process including

Overseen daily assembly production operation.

Conducted JANTXV and TX level screening tests.

Performed production failure analysis and corrective

actions.

Conducted raw materials purchasing, inventory

updating, product BOM maintaining.

Worked with sales for customer service.

Familiarized with reliability test group A, group B,

Group C, and Group E of MIL-PRF-19500 and many

MIL-STD-750 methods

Magneto-optics Laboratory

Center for polymers at engineered Interfaces

Dept. Of Materials Science & Engineering

State University of New York at Stony Brook.

8/1995-6/1999

Ph.D. Research

Performed research in developing polymer mask for

nanofabrication and transferring nano-pattern into

magnetic thin film to realize high density storage

media. Conducted extensive research in thin film of

polymer, metal deposition, etching, characterization,

and property measurement that involved intensive

activities of using high vacuum technology. The focus

of the research was also extended on microscopic

characterization of magnetic nanostructure and

magnetic property measurement. The primary research

achievements are:

Developed self assembled polymer masking technology,

which can be used to make nanostructures on metal and

silicon substrates.

Made nano-scale Co island structure by self assembled

polymer masking and Broad ion beam etching technique.

Developed magneto-resistive device using patterned

magnetic nanostructures.

Performed microscopic magnetic characterization of

submicron and nanometer Co islands using MFM.

Performed magnetic property measurement using VSM.

Practiced metal thin film deposition technique with

E-beam evaporation and Magnetron sputter coating.

Ceramic Engineering Laboratory,

Tokyo Institute of Technology, Tokyo, Japan

1/1995-8/1995

Visiting Scientist

Made initiation in synthesizing SrFeO3 polycrystalline

thin film by hydrothermal electrochemical method.

Practiced thin film electrochemical deposition, and

electrochemical theories.

EDUCATION

Ph. D in Material Science and Engineering

State University of New York at Stony Brook

M.S. in Metal Materials

Institute of Metal Research, Chinese Academy of

Sciences

B.S. in Physics

Wuhan University, China

PATENTS &

PUBLICATIONS Co-authored three patents and six technical papers

KNOWLEDGE

AND SKILLS Materials analysis, Characterization and Measurement:

Surface and interface characterization of materials by

AFM (Contact or tapping mode).

Crystallographic analysis of materials by x-ray

diffraction.

Qualitative and quantitative elemental analysis by

Auger Microscopy, SEM/EDX, SIMS, and FTIR.

Micro structural Characterization of materials by SEM,

TEM, and Optical Microscope

Film thickness measurement by Stylus Profilometer, and

Elipsometry

Lean Manufacture Training Certificates

AutoCAD, SolidWorks

HONOR AWARDS Graduate Council Fellowship, SUNY at Stony Brook 1998.

Scholarship of Japanese Bureau of Education 1995.

ACTIVITIES

Members of IEEE, Materials Research Society.

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