Sunil Lingampalli

***** ****** ** ** **, Email:

acd09f@r.postjobfree.com

Little Elm,Texas-75068. Phone:

940-***-****

Summary of Skills:

• 3+ years of professional experience in product design, development

and testing in Healthcare, Electronics and Automotive domains.

• Proficient using 2D and 3D CAD such as Solid Works, Auto CAD,

P ro-E, CATIA.

• Extensive Finite Element Analysis (FEA) experience with

s tructural, thermal and computational f luid dynamics analytical

domains using Ansys, Fluent and Star CCM+.

• Have research experience in application of Electronic Packaging

t heories.

• Researched BGA, SOS, Flip Chip and different types of IC

packages.

• Hands on experience with milling, drilling, lathe machines, welding

a t a machine shop.

• Performed experiments on the instruments as per the protocols in

order to test the prototypes.

• Knowledge in dynamic system analysis, hydraulics and strength of

materials and good understanding of Geometric Dimensioning &

Tolerance (GD&T).

• Published research thesis paper at SEMI THERM 28 conference in

San Jose, CA, USA.

• Excellent technical presentation skills. U tilized MS-Office Word,

E xcel and Power Point for technical reports, data analysis and

reviews.

• Extensive analytical and problem solving skill. Eager to learn new

t hings, enjoy working in a team environment and sharing

k nowledge.

P rofessional Experience:

Sunil Lingampalli 1

M echanical The rmal Engineer, (Contract position)

GE Health Care, Waukesha, WI Ma r/2013

– Nov/2013

• Designed and assembled CT (Computed Tomography) Scan Room’s

w ith all the necessary equipment’s (CT Machine, Patient Bed,

Server Unit, HVAC Unit) according to customer specifications using

P ro-E.

• Performed extensive fini te element analysis to evaluate

temperature distribution and air f low across the Scan Room’s using

A nsys Icepak and Fluent.

• Performed fini te element simulations to verify and validate PCB

boards thermal stability specifications using Ansys Icepak.

M echanical Design Engineer, (Contract position)

F lextronics I n te rnational, Plano, TX Sep/2012 –

M a r/2013

• Designed and developed 3D CAD models for prototype automated

l iquid dispensing machines as per customer specification using

Solid Works.

• Collaborated with manufacturing team on the shop f loor on

assembling parts.

• Designed and built test prototype used for verification and

validation of specifications and user needs.

• Worked extensively drafting technical project reports, installation

p roducers and testing procedures.

• Facilitated and actively participated in product design and

development team meeting involving multiple stakeholders

( internal and external).

• Researched suppliers and vendors for parts used to build the liquid

d ispensing machines.

Research Assistant,

University of Texas at Arlington, TX Aug/2011 –

Sep/2012

• Worked with the research students under my professor for setting

u p the lab (Air f low bench, test r igs) and ran extensive CFD

s imulations using Ansys Icepak and using Ai r Flow Bench.

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Solid Works & Star CC M+:

• Formula-1 Race Car End Plate Design: Worked on racing car front

wing along with end plate design to improvise the down force and

divert the f low over the ti re by extending the end plate edges of the

front wing along the width of the ti re, which in turn decreased the

turbulence over the ti re by 80%, increased the down force by 0.5g

and this lead to quick acceleration along the corners.

• Designed wheel, wing and 3D models of end plate and front wing

assembly using Solid Works and performed CFD analysis using Star

CCM+.

Ansys Icepak:

Data Center Cooling

• Designed system racks, perforated tiles, overhead circulating fans

and CRAC units in data center in Icepak

• Performed Thermal and CFD analysis using Icepak.

• Performed design optimization and sensitivity analysis on system

r acks by changing the perforations of the tiles and also changing the

a ir f low of the overhead fans.

Thermal Enhancement of Stacked Dies Using Thermal Vias

• Designed and thermally analyzed three different stacking

architectures (Spacer Die, Pyramid Die, Rotated Die) used in

electronic components such as cell phones, computers etc using the

concepts of Electronic Packaging.

Graduate Assistant,

U niversity of Texas at Arlington, TX Aug/2010

– J ul/2011

• Provided software technical assistance to students.

• Performed system maintenance and t roubleshooting on lab

computers and prin ters.

• Managed asset allocation (desktops, laptops) for the students at

u niversity.

Sunil Lingampalli 3

J unior Design Engineer,

K usalava Ltd, I ndia

A ug/2008 – Dec/2008

• Developed 3D and 2D CAD design of Automotive Cylinder L iners

and Piston Heads using Pro-E and Auto CAD.

• Created detailed design drawing for parts and sub-assemblies

u tilizing best practices of GD&T.

• Performed extensive simulation and physical verification testing of

d ifferent design prototypes to meet product specifications.

• Trained on machining process which included milling, drilling and

l athe machines.

Undergrad P roject

P ro-E:

• Designed a step-climbing Robot capable of climbing steps of

d ifferent dimensions.

• Designed 3D model of a Step Climber parts and sub-assemblies

using Pro-E.

• Created detailed manufacturing drawings using Pro-E for parts and

sub-assemblies for prototype builds.

• Performed kinematic motion analysis to simulate robot climbing

w ith different step heights.

Conference Papers:

• SEM I T H ER M 28 San Jose, CA, USA: “Performance

Optimization of Mul ti-Core Processor using Core Hopping –

T hermal and Structural”. Sunil L ingampalli, Fahad Mi rza, Dereje

A gonafer University of Texas at Arlington, TX, USA,

M aste r’s Thesis:

Performance Optimization of M ulti-Core P rocessor using Core

H opping Thermal-Structu ral Analysis.

• Core hopping is used as a means of reducing processor chip

temperature by having data threads jump, or hop from a hotter core

to cooler core, thereby distributing the heat.

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• Core hopping is analyzed for a 16-core processor chip, which is

optimized as a function of chip temperature distribution.

• Designed 3D CAD model of the Chip, Heat Sink, Thermal In terface

M aterial, Solder Material and Mother Board using Ansys Icepak.

• Performed extensive thermal analysis (free connective heat

t ransfer) and design optimization utilizing User Defined Functions

( UDF’s) in Ansys Fluent.

• Performed Finite Element Structural Analysis of processor chip

assembly using Ansys Work Bench to evaluate its structural

i ntegrity based on thermal stresses imported from f luent.

Education Qualifications:

Masters of Science in Mechanical Engineering

A ug – 2011

University of Texas at Arlington, Texas, USA

GPA: 3.0/4

Bachelors of Technology in Mechanical Engineering

M ay – 2008

Acharya Nagarjuna University, Guntur, AP, India.

GPA: 3.5/4

Relevant Course Work:

Thermodynamics & Heat Transfer, Fini te Element Analysis,

Computational Fluid Dynamics, CAD/CAM, Engineering Mechanics &

D ynamics, Structural Aspects of Design, Machine Drawing, Mechanical

E ngineering Analysis, Production Planning and Control, Project

M anagement, Metallurgy and Material Sciences, Manufacturing

Technology, Fundamentals & Computer Techniques of Electronic

packaging.

Software P roficiency:

Sunil Lingampalli 5

• Auto CAD, Solid Works, Pro-E (Wild Fire 3.0 & 4.0), Ansys 11,

A nsys Work Bench, Ansys Icepak, Ansys Fluent, CATIA, Star

CCM+ CD Adapco.

• MS- Office (Word, Excel, Power Point).

• C, C++, MAT LAB.

References:

• Will be furnished upon request.

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