Engineer Manager
Resume:
ANDREW J. SCHOENBERG
Topsham, ME 04086
***********@*****.***
Summary of Experience
Thirty two (32) years of experience in materials engineering and polymer chemistry formulation, for the research,
development, implementation, and process of polymeric materials and composites. Extensive experience in new
product engineering, analytical characterization, laboratory management, engineering management, and composites
instructional education for engineers and undergraduates.
07/10/2011 Southern Maine Community College – A 7,800 student community college with 3 campuses
To including South Portland, and the new campus on the retired Brunswick Naval Air Station.
Present
DEPARTMENT CHAIRMAN COMPOSITES TECHNOLOGY: Responsible for the development
of the new Composites Technology Program, including industry partnership, curriculum development,
course instruction, and department staffing.
• Developed 25,000 sq.ft. program space, curriculum, course syllabi, and staffing of the
eleven core courses in the program. Taught the four major composite science courses.
• Designed, built, and director of the $1.8 Million dollar Composites Engineering and
Research Laboratory (CERL), which is a partnership contract facility for the composites
industry. The directive of the laboratory is to partner with regional composite companies to
address their engineering and applied research needs to allow them to be more productive
and competitive in the global composites marketplace.
09/2008 Fairchild Semiconductor South Portland, ME A $1.6 Billion dollar manufacturer of
to semiconductor devices. With manufacturing facilities throughout the U.S. and South
East
09/18/2010 Asia.
STAFF PROCESS DEVELOPMENT ENGINEER: Responsible for the process development,
materials selection, and quality characterization of several key process components for the new, state
of the art, Wafer Level Chipscale Packaging (WLCSP) manufacturing facility.
• Selected, characterized, developed appropriate processing and online control monitors for the
solder material to be used for first and second generation WLCSP manufacturing.
• Responsible for the copper electroplating process, chemistry, and online monitoring systems.
• Developed new, novel, characterization techniques for determining product performance and
robustness that resulted in 2 publications, and FEA modeling protocols.
11/2000 Fairchild Semiconductor South Portland, ME. A $1.6 Billion dollar manufacturer of
to semiconductor devices. With manufacturing facilities throughout the U.S. and South
East
4/11/2007 Asia.
MEMBER OF TECHNICAL STAFF – KEY TECHNOLOGIST: Designated as highest level
polymer and materials engineering resource for the entire Fairchild Semiconductor organization
(elected as Key Technologest 2004 to 2007).
• Developed and taught a one week class in Polymer chemisty, materials characterization,
failure mechanisms, and design for robustness. This course was taught at the Malaysia,
Phillippines, and China assembly facilities. Course was developed and published into an
interactive online e-learning for full corporate distribution.
• Designed, built, developed, staffed (3 engineers), and managed the first Polymer
Characterization laboratory within Fairchild Semiconductor.
• Hands on problem solving at all assembly sites for materials related issues. Recent (FY06)
successes includes the failure mechanism identification associated with a 65% yield for a
new package line that jeopardized the success of the entire program (targeted at > $2.5
million / annum). Corrective action resulted in a new sustainable yield of 95-98%. This
failure mechanism was identified through process characterization, materials
characterization and FEA modeling.
FAILURE ANALYSIS and RELIABILITY LABORATORY MANAGER: From 11/2000 to
07/2003 I was the manager of the engineering and technican staff for both the Failure Analysis and
Reliability Laboratories within the South Portland, Maine corporate headquarters. The Failure
Analysis Laboratory was responsible for characterization of customer return product, fabrication and
assembly related issues, and new product development. This laboratory consisted of state of the art
analytical equipment including; SEM/EDAX, TEM, SIMS, AUGER,EMMI, wet chemistry, and
advanced microscopy. The Reliability Laboratory consisted of all testing capability to insure
documented robustness of Fairchild devices.
1993 Pioneer Plastics Corp. Auburn, ME subsidiary of Panolam Industries
to A $180 Million manufacturer of decorative surfacing, composites, and polymer
resins.
11/2000
8/1/96 RESINS TECHNICAL MANAGER: Responsible for all Research and
Development
to programs and all technical issues related to the chemistries for all 4 Pioneer
Divisions.
11/2000 Responsibilities include the development and support of new polyester based products for Powder
Coatings Industry, Polyols for urethane and elastomer products, Amino based
chemistries for decorative surfacing products, and phenolic resins for decorative
composites. Direct Reports: 5 Professionals, and 3 Technicians
• Responsible for the development of new chemistries required to re-engineer an entire
product line for one of the three major profit centers. Estimated cost savings as a result
of this chemistry change is $1 Million per year.
• Responsible for the design and development of a new product line of PET based polyester
resins for the Powder Coating Industry. One product has customer projections of 3 million
pounds of usage during the first year of commercialization.
1/4/93 TECHNICAL MANAGER / ANALYTICAL LABORATORY MANAGER:
to Responsible for the major Research and
Development programs relating to, new product 8/1/96 development, new chemistry
formulation, process development, second sourcing, and
reverse engineering. Responsible for all the activities associated with the management of
laboratory. Laboratory responsible for testing of major raw materials, in
process a chemistries, final
product performance, process trouble shooting, reverse engineering
of competitive products, and all environmental testing including industrial hygiene
sample, and waste water analyses. Full time
2
direct reports: one senior level analytical chemist,
one senior level process engineer, and one laboratory analytical chemist.
• Developed the chemistry system and process for the generation of an entire product family
for a continuous lamination production line in the Morristown Tennessee facility. Initial
projected sales for one product is $1 Million per year.
Responsible for the design and construction of a new laboratory facility, including
the purchase and setup of a Gas Chromatography/MS laboratory. Instrumentation includes;
Thermal Analysis, FT- IR, HPLC, and complete GC equipment necessary to run VOA and
semi-VOA methods for EPA waste water analysis. Environmental Lab. has full state
certification for waste water analysis.
8/89 Emerson & Cuming, Inc., Lexington, Mass
to A $50 Million division of W. R. Grace
12/28/92
1991 MANAGER OF THE CONDUCTIVE MATERIALS GROUP/SENIOR
to RESEARCH ENGINEER:
12/92 Responsible for all the activities related to the organization, development,
application, and implementation of programs
designated as Conductive Materials. Full time direct
reports: one senior level chemist, and on senior technician.
• Responsible for the materials, application, and process development of a Conductive
Surface Mount Adhesive (CSMA). Utilized as a replacement for solder in
component mounting during circuit board manufacturing.
1989 SENIOR MATERIALS ENGINEER: Responsible for the research and
development,
to customer interaction, and product implementation of new conductive materials
1991 primarily for the Electronic Industry. These new
products are extensively characterized and documented
for Quality Control and the generation of MSDS, and pricing.
• Developed solderable conductive, thermoplastic system for the use in Tantalum Capacitor
manufacturing. Estimated usage of one customer and one application is $2 Million per year.
• Developed conductive, thermosetting, coating and adhesive system for chip capacitor
application. System designed to reduce processing time from 2.5 hours to 30 minutes.
Product usage estimation for one customer is $750,000 per year.
1988 Allen-Bradley Electronic Component Division, El Paso, Texas
to A $70 Million division of Rockwell International
1989
SENIOR MATERIALS ENGINEER: Responsible for the development,
characterization, and process
implementation of optimized conductive ink systems.
Development of new metallization technologies and characterization, control, and
documentation of molding thermoplastics.
Responsible for the design, acquisition,
and implementation of advanced analytical capabilities for this facility.
3
1984 Multiwire Division, Hicksville, New York
to A $18 Million division of Kollmorgen Corporation, producing advanced electronic
1988 packaging.
1988 MATERIALS ENGINEERING SUPERVISOR: Responsible for all aspects
related to materials including; dry end process,
Quality Control, vendor control, and new
process and materials development. Full time direct reports: 4 engineers and 3
technicians.
• Designed and implemented SPC and vendor feed back mechanism for incoming materials.
Net result: Reduced incoming materials rejection rate from 95% to less than 5% for one
material type.
• Developed and implemented new lamination procedure for encapsulation, Net result:
Reduction in materials cost from greater than $600,000 to $150,000.
1987 MATERIALS ENGINEER GROUP LEADER: Directed technical support to .
to Materials Process Engineering and Quality Control. Responsible for new
materials
1988 development and product support
• Identified, characterized, designed, developed, and implemented new material into
manufacturing facility. Four (4) month deadline for initial implementation from
conception, due to product need. Net result: Project successful, allowing
manufacturing to continue unimpeded.
1984 MATERIALS PROJECT ENGINEER GROUP LEADER: Responsible for the
to design, development, characterization, application, and all phases of
production and
1987 control for the polymeric materials used in the development of a new concept in
circuit generation. Responsibilities included all
supplier, customer, and production interaction
or those aspects of the project related to materials. Full time direct reports: 1
engineer, and 2 technicians.
• Developed complete materials package for this project including UV curable, Laser
activating, adhesive and laser ablative insulation material.
• Instituted instrumental analysis capabilities within project and facility including; Thermal
Analysis, LC, GPC, UV-VIS and SEM/EDAX
• 3 patents received for materials and process.
1982 Oak Technology Inc., Hoosick Falls, New York
to Manufacturing and development complex (6 facilities) for Electronic Grade
Materials.
1984
1984 MANUFACTURING ENGINEER: Responsible for all engineering of epoxy,
polyimide, acrylic, and some Teflon
products. Major processes included epoxy and
polyimide prepreg treating, and laminate production.
4
1982 MATERIALS PROJECT ENGINEER: Responsible for new product
development,
to and implementation.
1984
• Developed unique resin system from formulation to implementation, for
specialized electronic industry application.
1981 Multiwire Division, Glen Cove, New York
to A $28 Million division of Kollmorgen Corporation
1982
MATERIALS ENGINEERING ASSOCIATE: Responsible for second
sourcing and production process engineering of
epoxy prepreg systems, polyesters, chemical
resistive films, and FR-4 laminate.
EDUCATION B.S. in Environmental Biology, Minor in Chemistry, May 1981
University of Maryland, College Park, 1/79 to 5/81
Alfred University, Alfred, NY 9/76 to 1/78
Graduate Studies Program Plastics Engineering
University of Massachusetts at Lowell, Lowell Mass 9/89 to
12/92
Masters of Science in Plastics Engineering 12/92
Thesis topic " Blend Characterization of Poly(B-Hydroxybutyrate-co-B-
Hydroxyvalerate) and Poly(E-Caprolactone)"
Research Associate- for the Polymer Degradation Research Consortium
at U. Mass Lowell 1992
ADDITIONAL EDUCATION Additional undergraduate engineering courses and numerous career
related technical courses and seminars. Including a 40 hour course in
Management Techniques, and a course in
paper manufacturing.
PATENTS 4,859,807 " Wire Scribed Circuit Boards and Method of Manufacture"
4,642,321 " Heat Activatable Adhesive for Wire Scribed Circuits"
4,711,026 " Method of Making Wires Scribed Circuit Boards"
PUBLISHED ARTICLES
" Conductive Adhesive as a Soldering Alternative", Electronic Packaging
and Production,
November 1991
" Characterization of Polymer Blend Homogeneity For P(HB-co-HV) and
PCL 787", Polymer Degradation
Research Consortium, limited distribution, Feb. 1992
" Biodegradation of Blends of Poly B-Hydroxybutyrate and Poly E-
Caprolactone", Fall 1992 ACS Polymeric
Materials Science and Engineering Proceedings Preprint
5
" Treater Process Monitoring by Pressure Differential Scanning
Calorimetry (PDSC) ", Plastic Laminates
Symposium, TAPPI proceedings, Summer 1994
“ Separating out “Free” and “Chemically Bound” Water From the
Standard Treater Volatile Test”, Plastic
Laminates Symposium, TAPPI proceedings, Europe 1995
“ New Test Method For the Characterization of Paper / Melamine
Reactivity”, Plastics Laminates Symposium,
TAPPI proceedings, Summer 1996
“Powder Coating on Wood Substrates – An Overview of the Existing Technology and Challenges”,
Plastics Laminates Symposium, TAPPI proceedings, Summer 2000
“Characterization and Modeling of Solubility and Diffusivity after JEDEC Prescribed Baked
Conditioning Vs. Vacuum Desiccation for Mold Compounds”, The 55th Electronic Components and
Tecnology Conference, May 31, 2005
“ New Elevated Temperature Mold Compound Adhesion Test Method Using A Dynamic Mechanical
Analyzer”, Thermochimica Acta, Elsevier, February 20, 2006
“ The Experimental and Numerical Investigation on Shear Behavior of SAC405 WLCSP Solder
Ball”, the 60th Electronic Components and Technology Conference, May 2010.
“High Speed Shear Testing of WLCSP Solder Alloys, and the Correlation to JEDEC Board Drop
Testing”, Symposium on Polymers, May 13, 2010.
“Buyer Beware … of the Broker”, Soundings Magazine, February 2010 Edition
“So, What’s it Like to be Hit by Lightning”, Latitudes and Attitudes Seafaring Magazine,
January 2011 Edition
“The Blinding Dream”, Points East magazine, April 2011 Edition
“The Surveyor Did What”, Points East magazine, Pending Publication
2011
“ Darwins Law of Natural Selection - Cruisers Edition”, Points East
Magazine,
Pending Publication November 2011
“ Adhesion in Microelectronics” – Editors: K.L. Mittal and Tanweer Ahsan – Co-
author;
Andrew Schoenberg, Chapter : “Thermal and Related Techniques for the
Characterization
Of Package Stresses and Mold Compound to Leadframe Adhesion”, Wiley-Scrivener, July 2014
PRESENTATIONS
" Thermal Characterization of Polymeric Materials", Sept. 1991 full day
seminar to 35 professionals at W.R. Grace Dewey
and Almy
" Biodegradation of Blends of Poly B-Hydroxybutyrate and Poly E-
Caprolactone", Fall 1992 ACS Polymeric
Materials Science and Engineering Symposia
6
" Treater Process Monitoring by Pressure Differential Scanning
Calorimetry (PDSC) ", Plastic Laminates
Symposium, TAPPI meeting, Atlanta Ga., Summer 1994
“ Pioneer Chemistry Club”, designed, developed, and taught, bi-weekly
internal educational course at
Pioneer Plastics Corp. for 25 professionals for 6 months of 1994
“ Separating out “Free” and “Chemically Bound” Water From the
Standard Treater Volatile Test”, Plastic
Laminates Symposium, TAPPI, Heidleberg Germany, 1995
“New Elevated Temperature Mold Compound Adhesion Test Method Utilizing Dynamic Mechanical
Analysis”, NATAS Conference 2004, October 5, 2004
“Characterization and Modeling of Solubility and Diffusivity after JEDEC Prescribed Baked
Conditioning Vs. Vacuum Desiccation for Mold Compounds”, The 55th Electronic Components and
Tecnology Conference, May 31, 2005
“ Polymer Chemistry, Characterization Techniques, Failure Mechanisms and Design for Quality”
one week course given to three assembly sites (Malaysia, Phillippines, China) 2004 - 2006
“Characterizing Molded Package Stress Using Tensile Modulus Measurements”, 2006 Symposium
on Polymers, May 03, 2006
“Polymer in Packaging”, E-Learning online course for Fairchild Semiconductor, March 2007
“High Speed Shear Testing of WLCSP Solder Alloys, and the Correlation to JEDEC Board Drop
Testing”, Symposium on Polymers, May 13, 2010.
“Reducing Styrene Emissions in Composites Using Fatty Acid Monomers”, ACMA 2012, February
23, 2012
7
Contact this candidate