Quality Manager

ANGELO CUTULI +659******* or +1-734-***-**** • ************@*****.***

**** ******** **** ********* ** 48197

SENIOR EXECUTIVE / ENGINEERING / QUALITY / MANUFACTURING

Leader Strategic Planner Team Builder International & Multicultural Innovator Crisis Manager Automotive Electronics Microelectronics

Top performer in operational, quality, and engineering leadership roles, delivering excellence and sustainable performance improvements through innovation, technology, and best-in-class manufacturing methodologies. Partner with business units and manufacturing operations to execute strategic business initiatives; able to translate customer/market needs to product solutions and establish market differentiation through technology, innovation, and patented products/processes.

• Delivered a 90% reduction of quality excursion for semiconductor electronic devices over a two year period.

• Achieved 100% positive audit scores while managing field quality for major North American automotive customers.

• Reduced the cost of quality testing by 50% by creating a multiplexing matrix and low current power suppliers to maximize parallelism.

• Succeeded in diverse environments in 5 countries leveraging the ability to speak and write in English, Italian, and French.

Recognized for leadership, problem solving, and an ability to mobilize people behind big ideas. Gifted with a rare talent to function effectively on a strategic and tactical level simultaneously; results in a global vision while applying meticulous attention to detail.

EXPERIENCE AND ACHIEVEMENTS

STMicroelectronics 1990–PRESENT

PRODUCT ENGINEERING DIRECTOR 2008 PRESENT

AUTOMOTIVE DIVISION ASIA PACIFIC OPERATION, MUAR MALAYSIA/SINGAPORE

Manage 55 Product Engineers responsible for the development and debugging of hardware and software for the electrical testing and burn-in of semiconductor electronic devices for automotive applications. Define and implement quality controls, production cycle times, production costs and yield improvement plans. Communicate and coordinate with the production plant, division management, and sales offices in the qualification and ramp up of new products, introduction of new raw materials, improved production processes, and equipment.

Opportunity: Reduce the cost associated with testing semiconductor electronic devices while using existing equipment thus incurring no additional expenditures necessary to acquire new testing devices.

Actions: • Created a multiplexing matrix and low current power suppliers increasing the parallelism rate by 400% of our existing testers at 10% of the cost of the purchase of a new full tester.

Results: • 50% reduction in cost of testing.

Opportunity: • Decrease the quality excursion rate and reduce customer returns (PPM) related to assembly and final testing of microelectronic products sold to automotive market.

Actions: • Analyzed the process data of production lots from which quality excursion and customer returns were generated. Findings indicated abnormal yield and/or out layers in the distribution (histogram) of the electrical parameters reading.

• Based on analysis, hold limits were set for yield (SYA) and for each kind of reject (SBL) detected. If the hold limit number was reached, the production lot was halted and submitted to extra screening for quality. If the lot failed quality standards, the product was scrapped.

• Put in place a software program that tightened the limits of electrical tests based on the actual distribution of the lot under test rather than basing quality parameters on customer specification limits only. The method, known as Dynamic PAT, is already widely used in electrical wafer sorting, but it is typically not applied in final testing. The team was able to use the method in the final test calculating the tightened limits on a sample of 5% of the production lot.

Results: • Reduction to 0 of quality excursion rate and 70% reduction in customer returns.

Additional Achievements:

• Increased the size of the Product Engineering Team in Asia Pacific region from 20 to 50 people.

• 10% reduction of testing cycle time per year.

• 1% final test yield improvement per year; reached target of 98%.

• Introduced copper wire for automotive devices wire bonding.

STMicroelectronics CONTINUED

FIELD QUALITY SERVICE MANAGER 2004 2008

LIVONIA, MI

Led a team of 2 Field Quality Engineers responsible for the management of North America automotive customers quality requirements. Provided Technical Support for wafer fab, assembly, test related quality issues, and quality audits to all North America automotive customers. Customers included: Continental, Lear, Bosch, Autoliv, Hitachi, Visteon, Delphi, Sirius, and Takata.

Opportunity: One of the main targets, when performing failure analysis on customer returns, was failed microelectronic components and the cycle time or total time required to complete the analysis. The turnaround times were long due to the company having all its failure analysis laboratories in Europe. Therefore, it was very hard to reach the target cycle time of 14 calendar days on 90% of cases for our customers in USA as approximately 5 days were spent for the shipment of the component to the lab in Europe.

Actions: • Implemented basic failure analysis activities like bench testing, curve tracer testing, X-ray, and sonoscan by moving some very low cost equipment from Europe to the company office in the USA.

• Trained existing personnel to use the equipment and perform analysis.

• Created a very detailed database to correlate electrical defects with physical defects and appropriate corrective actions necessary.

Results: • 95% of the cases were closed by the newly created failure analysis lab in the US in less than 14 days without needing to send the parts to the lab in Europe.

• Reduction to 0 of quality excursion rate and 70% reduction in customer returns.

Additional Achievements:

• 50% reduction of PPM defects per year.

• 100% positive audit scores.

• Set up periodical review with key customers for the marketing use of quality improvement obtained by STM.

OPERATIONS MANAGER 2000 2004

CASABLANCA, MOROCCO

Directed a production unit of 120 people comprised of 80 operators, 30 technicians, and 10 engineers. Responsible for cost, productivity, technical, and quality aspects of a semiconductor assembly and test operation. Demonstrated expertise in the use of advance problem solving techniques for the investigation and solution of semiconductors fabrication process issues.

• 20% reduction of assembly and testing cost per year.

• 10% productivity increase per year.

• 2% assembly yield improvement in 4 years; reached target of 99.8%.

PRODUCT ENGINEER 1990 2000

CATANIA, ITALY

Developed test programs for semiconductor devices for automotive applications. Provided electrical characterization of semiconductor devices for automotive application. Supervised the transfer of new test programs to production plants and trained production personnel in their application.

• 90% of test program development projects completed on schedule.

• 100% test program transfers completed successfully.

EDUCATION

Diploma in Electronic ITIS G. FERRARIS ACIREALE, ITALY • 1988

LANGUAGES

English Fluent

French Fluent

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