Engineer Process

Ahsan Rizvi

*** *** ****** **** 518-***-****

Albany, NY 12206 **************@*****.***

SUMMARY

A well organized, result-focused professional with measurable successes in new and changing environments in highly

regulated industries. Coordinate with Manufacturing Engineering of Fab8 300mm Cleanroom to set daily

goals/priorities, project statuses, and qualification timelines in thin film module (PVD). Develop and drive process

improvements on material and equipment to meet quality, reliability, cost, yield, productivity and manufacturability

requirements. Energetic, eager to learn new technologies, good communication skills, and willing to relocate

Skills include:

• •

Work on continuous improvement projects to optimize Support engineering and development activities

processes with regards to process stability and wafer to achieve the desired WIP turns and cycle time

yield. goals.

• •

Working with Technology development Process Analyze defects on all PVD tools. Develop and

Integration team for development of 20nm process follow corrective actions to minimize and

flow. eliminate. Submit & present DFS reports to

• Hands-on operation of all metallization equipment upper high level management meetings

representing PVD.

(AMAT/Novellus). Tool Platforms: Applied Materials

•

Endura, LAM Research /Novellus-INOVA and Strong computer skills including Microsoft

ALTUS, Levitech, Canon Anelva. Office, Word, Excel & PowerPoint

PROFESSIONAL EXPERIENCE

GLOBALFOUNDRIES FAB8, MALTA, NY, USA August 2012 - Present

Process Engineer for Thin Films Manufacturing

Process Engineering

• Working knowledge on CuBs, Silicides, High-K, W Dep, Contact formation

• Involved in Process improvement and optimization of 32/28nm Manufacturing

• Provide direct leadership to Maintenance Tech’s/Process Tech’s on shift.

• Coordinate PMs and Tools Qualifications based on priorities.

• Conduct daily meetings and passdown with management and shift teams for effective transfer of tool

status and reduction of down time.

• Coordinate with Manufacturing Operations to review daily goals/priorities, project statuses, and

qualification timelines.

Design of Experiments (DOE) methodologies

• Developed a quadratic equation for self pedestal height adjustment in relation to the thickness.

• DOE temperature matrix to study the relationship between heater temp & wafer resistivity sigma.

• System comparisons and chamber matching on new startup tools.

• Performed experiment with senior process engineer to reduce degas temp on AMAT CuBS that helped in

reducing cycle time on each wafer.

• DOE analyses of whisker particles after new Aluminum Target/Kit install.

Defects Analysis

• Analyze defects on all PVD tools and follow corrective actions to minimize it.

• Submit & present DFS reports to upper high level management meetings representing PVD.

• Work closely with DYE Team (Baseline defect team) and OOC team (excursion defects), communicating

understanding of defects, joint efforts on defect reduction and decision making of baseline defect versus

OOC event.

Training/Assistance

• Assisted TD Engineering counterparts & Equipment Engineers with offline processing, troubleshooting.

• Conduct training for Maintenance Tech’s, Process Tech’s & new hires for better understanding of

processes owned by thin films. Assisted Equipment Owners on writing & updating operating

procedures/specifications.

AHSAN RIZVI PAGE 2

• Developed E3 models to monitor tool/chamber irregular performance by checking Trace Data for wafer

processing.

IBM T.J. WATSON RESEARCH CENTER, YORKTOWN HEIGHTS, NY January 2011 – July 2012

Semiconductor Process Engineer

• Develop and characterize thin films (Ta, TaN, Cu, Ti, TiN, Al, Silicide, HfO2, Al2O3, W) deposition

processes in support of many research projects in areas ranging from extreme scaling of CMOS, Photovoltaic

and other exploratory/next generation devices such as MRAM, NVM, PCM, DNA Sequencing etc.

• Operation and maintenance of 200 mm production-scale thin film deposition tools in a research/pilot

fabrication facility.

• Optimize and drive improvements for processes and recipes to meet quality, reliability, yield, process

stability, and productivity requirements. Engineering analysis by applying principles SPC to film processes.

• Hands-on experience using Applied Materials Endura PVD system, Novellus CVD system and Cambridge

Nanotech Fiji ALD system for thin film process development and deposition.

• PECVD processes for SiN and Oxide using Applied Materials CENTURA systems.

• Manage tools qualification and perform target change/qualification in thin film deposition tools.

• Responsible for WIP (Work in Progress) in thin film/metal deposition sector and in RIE (Reactive Ion

Etching) sector. Hands on experience on Reactive Ion Etching processes using end-point systems in AMAT

Etch Centura ICP/DPS tool.

• Run etch processes for oxide, nitride, dielectric and polymer materials in ICP, CCP and Microwave

plasma chambers of AMAT Centura system. Maintain etch tool by monitoring contamination, cleaning

chambers and periodic qualification.

• Metrology and analysis using SEM, 4-point probe, Stylus based surface profiler and Ellipsometry

measurement. Perform FM check on chambers in thin film deposition tools.

• Calibrate etch rate of various chemicals. Perform oxide and Cu etching to requested thickness before

metal deposition using different chemistries.

• Train new engineers on thin film deposition tools and various FEOL/BEOL platforms.

EDUCATION

Master of Science in Nanoscale Science

College of Nanoscale Science and Engineering, State University of New York, Albany, NY

December 2009

PROFESSIONAL DEVELOPMENT

TOOL PLATFORMS PROCESS EXPERIENCE METROLOGY EXPERIENCE

AMAT ENDURA Physical vapor Deposition(PVD) Four point probe, Ellipsometry

LAM/NOVELLUS Chemical Vapor Deposition Scanning Electron Microscopy(SEM)

• INOVA Atomic Layer Deposition(ALD) Rutherford backscattering Spectroscopy

• ALTUS

Lithography- Spin Coating Optical Microscope

LEVITECH RTA

Dry & Wet Etching Atomic Force Microscopy

CAMBRIDGE NANOTECH

Rapid Thermal Annealing(RTA) Auger Electron Spectroscopy

ALD SYSTEM

Thermal Oxidation, PECVD, LPCVD X-ray Photoelectron Spectroscopy

FSI INTERNATIONAL

E-beam lithography/Optical lithography Profilometery

IT Skills

Xsite, SiView, SPACE, Fabview, Setup.FC Tool view, Linux and Windows Operating Systems

ARMOR, DFS, Yield Manager, ICase, E3, RMS, L-Edit C/C++, Java, Visual Basic

UNIX

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