GAU RAN G V I D YAD HAR J O S H I

• **, Grand Blvd., Apt#9, Binghamton, NY 13905 • 607-***-**** • acafpw@r.postjobfree.com

OBJECTIVE

Looking for a position of a Quality/Reliability engineer in packaging

EDUCATION

Binghamton University, State University of New York, Watson School of Engineering, NY

Master of Science in Mechanical Engineering Tentative: Oct’ 2013

University of Mumbai, India

Bachelor of Engineering in Mechanical Engineering May 2011

TECHNICAL SKILLS

• Lean Six Sigma(Green belt)- SUNY at Binghamton June 2013

• Equipments/Applications : Board level testing: Tensile testing system, Drop testing, Thermal cycling, Vibration

Joint level testing: strength & shear fatigue, printers/pick and place/reflow, solder paste inspection, shadow moire

Failure analysis: Cross sectioning with SEM & dye/pry

• Softwares: ANSYS-APDL, ANSYS Workbench, Comsol, Pro-Engineer/CREO, Lab-view, Minitab16, MATLAB

PROFESSIONAL EXPERIENCE

Universal Instruments & Department of Mechanical Engineering, SUNY at Binghamton Binghamton, NY

visit: http://www.uic-apl.com/student-development

Research Project Assistant Dec’ 2012- present

• Worked on projects for the ‘Advanced Research in Electronics Assembly’(AREA) consortium and customers of ‘Universal

Instruments’ that required manufacturing test board assemblies along with performing Highly Accelerated Life Testing(HALT) and

FMEA

• Manufactured electronic assemblies with stencil/flux printing, balling. Programmed stencil printers, pick and place and reflow

ovens. Executed experiments for HALT: Thermal cycling, bend, drop/shock, vibration and strength/fatigue life tests adhering to

IPC/JEDEC standards and DOE to identify failures in packages and statistically compute their reliability. Performed dye and pry /

cross sectioning with SEM for failure analysis

• Drafted reports and presentations through integration of data/results for the consortium

Department of System Sciences and Industrial Engineering, SUNY at Binghamton Binghamton, NY

Research Project Assistant May 2012- Aug’ 2012

• Performed Finite Element Analysis using ANSYS-APDL to calculate elastic/plastic strains and stresses in characterization of the

behaviour of creep in SAC-BGA packages

TECHNICAL COURSES

Electronics packaging, Finite Element Analysis, Mechanics of composite materials, Advanced Engineering Mathematics

PUBLICATIONS visit: http://www.uic-apl.com

• AREA consortium presentation: PCB pre-stress & Pad Cratering - A modified test method June 2013

• AREA consortium report: Vibration Testing Method for Circuit Board Solder Joint Reliability May 2013

• AREA consortium presentation: Effect of Pre-stressing on PCB Pad Cratering using spherical bend test June 2013

• AREA consortium presentation: Vibration testing and Failure Analysis Circuit Board Solder Joint Reliability June 2013

LEADERSHIP EXPERIENCE

Indian Graduate Student Organization (IGSO) Binghamton, NY

Senator Oct’ 2012- May 2013

• Gathered funds from the Graduate Student Organization for cultural fests and other social activities on campus

• Allocated responsibilities and funds to other hosts/coordinators and provide support in the hosting of events

Mechanical Engineering Students’ Association (MESA) Mumbai, India

General Secretary May 2010- May 2011

• Managed sports, academic and other events on campus and negotiated with sponsors to gather funding for the same

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