TONG WENG
*****@*******.***
607-***-**** *** Lake Street 1D, Ithaca, NY 14850
EDUCATION
Cornell University, School of Operations Research and Information Engineering, Ithaca, NY Dec 2013
Candidate for Master of Engineering in Systems Engineering
Cumulative GPA: 3.71, Six Sigma Black Belt Certification
Harbin Institute of Technology, Honors School, Harbin, China July 2012
Bachelor of Engineering in Electrical Engineering and Automation
EXPERIENCE
GE GLOBAL RESEARCH CENTER, Shanghai, China May 2013 – Aug 2013
Manufacturing Engineer
Provided the ‘should cost’ material, overhead and labor cost and tooling investment of 32 GE Healthcare CT parts
and 8 MR parts for management using manufacturing cost analytic software aPriori and DFM in BDI
Utilized DFA software in BDI to conduct two product tear-downs and give the assembly cost & labor time of water
tank and filter system in GE Water
Built a manufacturing cost analytic tool using MS Excel and VBA to provide cost analysis & estimation report for
clients with only simple and basic inputs
FOAMEX INTERNATIONAL INC. Media, PA Sep 2012 – May 2013
Manufacturing Engineer
Analyzed current production & sales volume, manufacturing cost, factory capacity etc. among 4 different plants and
formulated the production yield curve for each product form using data processing tools of R and MS Access
Built the mathematical model using linear programming and implemented it by MS Excel VBA to optimize the
production & shipping strategy through analysis of production yield, freight cost and plant location distribution
Brought an overall cost saving of $77,384.72 to the company after production & shipping consolidation and
provided management with a production optimization tool for any product form to support decision making
FORMULAR SAE, CORNELL UNIVERSITY, Ithaca, NY Sep 2012 – Dec 2012
Manufacturing Engineer
Analyzed the manufacturing and reliability of suspension and drive-train subsystems using tools of Failure Mode
and Effect Analysis (FMEA) and Fault-Tree Analysis (FTA) to find fragile components and technical causes
Identified factors contributing most to the failure of components through statistical process control, design of
experiment (DOE) and data analysis
Decreased subsystem failure probability by 40% by improving engineering design and component manufacturing
INTEL CORPORATION, Shanghai, China Dec 2009 – July 2010
Project Team Leader
Fulfilled the work of data processing and data analysis from output of the 3-axis accelerometer and programmed
the SCM using Assembly Language and C
Developed relevant skills such as Digital Electronics through self-study as the only sophomore to meet the project
goal and timeline effectively
Set the work scope and timeline for the team, motivated and coordinated teammates as well as communicated with
professors and Intel
SKILLS
aPriori DFM/DFA VBA Supply Chain Project Management SQL Mathematical Model Building Assembly
Language MATLAB Microsoft Excel & PowerPoint English (fluent) Mandarin Chinese (fluent)
ACTIVITIES
President of Student Union Lecturer in International Academic Forum in Singapore Teacher in Ithaca Chinese
School Volunteer in Inaugural Ceremony of Alumni Association of Nanyang Technological University Travel