DANIEL C. PANZICA
Summary: Global Executive previously responsible for operations, end-to-end product quality, product
engineering, product launches, new factory start-up, manufacturing engineering, supplier engineering, customer
interlocks, manufacturing engineering, and business improvement initiatives.
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25+ years in quality and manufacturing Extensive factory start-up and turnaround
management in the electronics industry experience
• •
20+ years International experience, 7 years as Social and Environmental Responsibility and
expatriate in Malaysia, 6+ years in China Compliance
• •
Worldwide customer support experience including Total Quality Management, QMS, 6 sigma, lean
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consumer, and OEM/ODM. Supplier qualification and certification
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Extensive experience outsourcing manufacturing. Supply chain cost reduction
• •
Extensive Supplier, Contract Manufacturing, and Reliability engineering
Internal assessment expertise. • Failure analysis
• Extensive PLM - NPI/product release experience • Test Engineering (component, modules, systems)
Motorola Mobility, a Google Company, Tianjin, China
Mobile Phone OEM
(Aug ‘13 – present)
Contractor
Supply Chain Development, Fulfillment, Quality
Responsibilities include Supplier Development, Fulfillment, Component/Module Qualification, NPI, and Quality for MotoX,
MotoG, and Ultra products.
Source Photonics, Chengdu, China
Optical Components Manufacturer
(June ’11 – July ‘13)
Sr. Vice President Quality (Chief Quality Officer)
Sr. Vice President of Operations
Responsibilities include leading all aspects of Quality and Reliability Engineering from supplier to customer, throughout the
product lifecycle.
• Established and deployed the Quality Safety Nets which include burn in, OQC, ORT, ORM, and ODVT. The
testing helped to reduce RMA’s 50% while significantly improving quality ratings at key customers.
• Established weekly quality reviews which focused on field, reliability and OQC failures.
• Improved the packing workflow reducing touches 20%, simplifying the process resulting in zero packing errors in
Q4 2011.
• Reduced DL headcount per units shipped 15% YoY through process simplification, automation, and streamlined line
layout.
• Coordinated a myriad of line engineering projects that led to 15% improvement in first pass yields.
• Overhauled the Product Lifecycle Management system revising deliverables while instituting a formal phase review
process.
• Overhauled organization structure in Chengdu replacing key executives while hiring my replacement for the
Operations leadership role.
Foxconn Corporation, Shenzhen, China
Original Design/Contract Manufacturer (Sept ’07 – June ‘11)
Vice President CMMSG GFO Quality & Engineering
Vice President CMMSG Quality Division
Responsibilities include New Product Introduction, End-to-end Quality (Supplier, factory, regulatory, reliability, TQM, customer
support), and Industrial Engineering for CMMSG supporting several large global customers totaling in excess of $20B in sales. I
supported Global Operations with sites in Canada, USA, Mexico, Brazil, Czech Republic, and inland China.
I worked out of the Shenzhen China complex. Products include assembly and test of desktop computers, workstations, servers,
printers, notebooks, and game systems.
• Led the flawless start up of Microsoft’s Xbox console and accessories. Responsible for factory quality, reliability,
supplier qualification, IP Security, and Foxconn verticals. UPH, yield, and OBA targets have been exceeded with
zero escalations. This was new business for Foxconn.
10725 E. Palomino, Scottsdale, AZ 85258, USA Skype: dan.panzica Email: aca1nh@r.postjobfree.com
Home Phone: +1-480-***-**** USA Mobile +1-818-***-**** China Mobile +86-182-****-****
DANIEL C. PANZICA
• Established a set of aligned Key Performance Indicators (KPI’s) for all GFO factories,
• Improved GFO Global factory productivity and quality KPI’s between 5%-40% during ‘’08, ’09. Techniques used
included benchmarking best practices, lean, and 6-sigma. KPI’s improved in all sites including: Scrap, UPPH, test
yields, DL-IDL/unit, BOM cost, and field DPPM.
• Established the common tooling, assembly and test process for desktop/notebook operations..
• Improved key customer rating score 33% from 2007 to 2009 driven by significantly reducing warranty cost.
• Reduced supplier related defects by 30% by improving packaging, establishing global commodity teams, forcing 3rd
party OBA, and partnering with our customer’s suppliers and purchasing team.
• Supporting GFO factory deployment of Social-Environmental Responsibility (SER) programs, Business Continuity
planning, risk-assessment, IP Security, internal drills, safety, and third party assessment/certification.
SUMCO Corporation, Phoenix, Arizona
Silicon Wafer Manufacturer (Jul ’04 – Aug ‘07)
Director of Quality
Directed the end-to-end Quality Systems for SUMCO’s Silicon Wafer (Discrete & CMOS) manufacturing operations in the
United States. Responsibilities included aligning all quality systems for three sites: quality assurance, quality control, ISO/TS,
metrology, failure analysis, supplier quality, customer support, and analytical services laboratory.
• Led the Global deployment advanced factory multi-tiered process control systems leading to the Hewlett Packard,
TSMC, and Intel Supplier of the Year recognition. The Phoenix and Albuquerque operations improved their Intel
supplier ratings (MCAT) 26% and achieved Intel’s level 3 (highest) supplier certification.
• One of the Executive Champions of the Internal Kaizen (GAP) processes. This program is focused on completing
the merger and consolidation of the Sumitomo and Mitsubishi Silicon Manufacturing operations. Deployed 20
international teams (USA and Japan) focused on identifying best practices, standardization, productivity, and yield
improvements resulting in a 5% reduction in manufacturing costs throughout the company. Led a group of 5 black
belts to support this activity. Completed projects includes:
o Reduced specification registration cycle time from 25 to 3 days
o Virtually eliminated shipping errors
o Establishing Global correlation for critical Metrology
CORNICE, Boulder, Colorado/ Dongguan, China
Storage Element (Small form-factor HDD) Start-up
Managing Director Asian Operations (Oct ‘03 – Jul ‘04)
• Directed Asian Operations including sub-contractor (SAE) manufacturing and quality for Cornice.
• Set-up the Cornice China business (Representative Office), opened the Cornice office, and established the
Technology Center (Reliability and Failure Analysis Lab) in Chang An, China.
• Successfully led the qualification of the Manufacturing Subcontractor by Philips, Creative, Rio, and Sony.
• Investors were unable to continue funding.
PANZICA & ASSOCIATES, Scottsdale Arizona (Jan ‘02– Oct ‘03)
Consulting, Factory Operations, Quality, and Entrepreneurial Opportunities
• Established a consulting company focused with assisting companies qualify and ramp product lines in Asia.
• Clients included Microsoft, BenQ, and Phillips Electronics.
• Led Microsoft funded engineering/manufacturing effort to develop low cost storage product for Home and
Entertainment Division. Focus on China manufacturing cluster for components and final assembly. Hired 5
associates to support this project.
XYTERRA CORPORATION, Scottsdale, Arizona
Blade Server Start-up
Sr. Director of Operations (May ‘01 – Jan ‘02)
• Directed Operations including manufacturing, supply chain and quality for Xyterra. Xyterra was a High-end Blade
Server start-up company. Investors were unable to continue funding.
10725 E. Palomino, Scottsdale, AZ 85258, USA Skype: dan.panzica Email: aca1nh@r.postjobfree.com
Home Phone: +1-480-***-**** USA Mobile +1-818-***-**** China Mobile +86-182-****-****
DANIEL C. PANZICA
DELL CORPORATION, Round Rock, Texas
Transactional Products Group (Dimension)
Director of Quality (May ‘00 – Apr ‘01)
Directed and coordinated Quality, Reliability, and Customer Experience for Dell’s Dimension P.C. brands ($10B/yr sales)
worldwide. The scope included supporting all phases of the product life cycle from design through end of life. Total number of
direct reports was 27 including 6 Black Belts. Functions included: manufacturing, sustaining engineering, platform quality
engineers, and International Product Support (IPS) engineers.
WESTERN DIGITAL CORPORATION, Kuala Lumpur, Malaysia
High Volume Hard Disk Drive Manufacturing
Senior Director of Quality and Reliability (Jul ‘97 – May ‘00)
Senior Director of Engineering
Developed, implemented, and directed the Quality Systems Departments for Disc Drive and SMT PCBA manufacturing
operations in Malaysia. Responsible for all quality functions supporting four factories: quality assurance, quality control, ISO
9000, reliability engineering, failure analysis, analytical services laboratory, and training. I was the direct customer interface in
the factory for qualifications, failure analysis, and issue containment/closure.
• Deployed factory improvements that drove Customer ratings at key five OEM’s from 5 of 6 to 1 or 2 of 6.
SEAGATE TECHNOLOGIES, Penang, Malaysia
High Volume Recording Head Manufacturing and Assembly
Senior Director of Quality and Reliability (1993 - 1997)
Senior Director of Program Management
Developed, implemented and directed the Quality Systems Departments (1100 direct reports) for Seagate’s three slider, HGA,
HSA, and motor manufacturing sites in Malaysia (15,000 employees). Accountable for all quality functions, skills training,
reliability engineering, analytical services, and failure analysis.
APPLIED MAGNETICS CORPORATION, Goleta, California
High Volume Magnetic Recording Head Manufacturing and Assembly
Director of Quality, Thin Film Wafer Fab, Slider Fab, Assembly
Director of Quality, Ferrite Recording Heads
Manager of Slider Manufacturing Operations (1983 –
1993)
PHILIPS - SIGNETICS CORPORATION, Orem Utah
Section Head, Quality Control (Fab, Sort) (1978
-1983)
Area Production Supervisor, Diffusion
EDUCATIONAL BACKGROUND AND PROFESSIONAL DEVELOPMENT
• B.S. Biology, St. Bonaventure University, New York
• United States Marine Corps, 1st Lieutenant
• U.S.M.C., Officer Candidate School, The Basic School, Communication Electronics School
• M.S. Systems Management, University of Southern California, 1985
• Phil Crosby's Quality College
• Dr. Deming's Quality/Productivity Seminar
• Certified Quality Engineer Course, California State University, Northridge
• A.S.Q.C. Certified Quality Engineer
• Luftig & Warren’s 5 week SPC/6 Sigma Course
• ISO 9000 Lead Assessor Course
• Frontline Communispond, Communication Skills for Senior Executive Course
• Dell BPI Black Belt Champion Course
10725 E. Palomino, Scottsdale, AZ 85258, USA Skype: dan.panzica Email: aca1nh@r.postjobfree.com
Home Phone: +1-480-***-**** USA Mobile +1-818-***-**** China Mobile +86-182-****-****
DANIEL C. PANZICA
• Six Sigma Black Belt Certification Course, Fisher School of Business, Ohio State University
10725 E. Palomino, Scottsdale, AZ 85258, USA Skype: dan.panzica Email: aca1nh@r.postjobfree.com
Home Phone: +1-480-***-**** USA Mobile +1-818-***-**** China Mobile +86-182-****-****