Carl N. Garcia, MSME

Schaumburg, IL ***** 847-***-****

www.linkedin.com/in/carlgarciamsme ac9shd@r.postjobfree.com

MANUFACTURING PROCESS DEVELOPMENT ENGINEER

Skilled in manufacturing processes and materials to support product and highly automated manufacturing engineering. Innovative problem solving and troubleshooting using analytical skills for identifying root causes and finding solutions. Sent to suppliers and factories to investigate, trouble shoot, and resolve difficult production problems, including developing and improving production processes. Authored 16 patent disclosures and received 5 patent / invention awards. Honored with 40+ written and monetary awards.

TECHNICAL SKILLS

SMT PCB Assembly Adhesives and Materials Motorola Six Sigma DMAIC and DFSS Black Belt Skills

Design for Manufacturing (DFM) Design for Assembly (DFA) Continuous Improvement SPC Gage R&R 8D, PFMEA, FMEA, Root Cause Failure Analysis Cross-Functional Teaming Mentoring and training

2D CAD 3D CAD FTIR, SEM and Optical Microscopy X-Ray Imaging and Failure Analysis

Technical Process Documentation MS Office (Word, Excel, PowerPoint, Project, Visio) Minitab

PROFESSIONAL EXPERIENCE

MOTOROLA MOBILITY LLC, Chicago, IL

Distinguished Member Technical Staff 2010 - 2016

Subject Matter Expert on SMT PCB assembly, adhesives, and materials. Created innovative solutions with product architecture and design teams. Specialist for adhesives and materials technology on all new products delivering successful, high quality product launches. Coordinated with sourcing and commodity teams to recommend best adhesives and interface materials including electrical design to support continuous improvement in each new product and ensure product quality and reliability.

Implemented vacuum and atmospheric plasma in South Korea and China factories improving quality and yield 10X. Reviewed manufacturing process flow and made process flow changes that reduced cycle time and improved throughput that eliminated capacity issues for new product on-time launch.

Developed, coordinated, and implemented new adhesive materials to prevent water ingress into electrical products, improve product serviceability, and to meet reliability quality standards.

Evaluated and implemented vacuum plasma process to support new product development applications.

Conducted flex circuit design reviews and accelerated life reliability testing for electrical engineering on all new products to ensure high product quality and reliability.

Championed cross-functional team on new adhesive and application process for new flagship product.

Trained engineers and technicians on lab equipment operation and adhesive material applications.

Lead outside vendor supplier technology shows and demonstrations to promote new technologies, materials and manufacturing methods to support continuous improvement in new products.

MOTOROLA, INC., Libertyville, IL

Principal Staff Mechanical Engineer 2006 - 2010

Created Excel knowledge base for adhesives and bonding technologies. Conducted failure analysis on new products and identified corrective actions to eliminate future quality and reliability problems.

Created new adhesive design review process documentation, rules, and tools used to track, check, and review adhesives used on all internal and external product hardware designs to meet quality standards.

Analyzed and resolved laser welding problem on new high tier product allowing on-time launch.

Implemented corona surface treatment at multiple vendors that optimized keyboard key cap adhesion.

Investigated and implemented new hinge flex circuit tape that eliminated critical field reliability issue.

Conducted flex circuit design reviews for all new products that ensured new product quality & reliability.

Quantified best practices and documented design rules to capture knowledge to prevent repeat mistakes and support continuous improvement in Knowledge One Pager (KOP) documents.

Managed and conducted seminars and training on adhesives, adhesive technologies, and their uses.

Carl N. Garcia, MSME ac9shd@r.postjobfree.com Page Two

MOTOROLA SOLUTIONS, INC., Schaumburg, IL

Manufacturing Process Development Engineer 2004 - 2006

Created coating process for new high resolution fingerprint sensor to be used by Department of Homeland Security.

Invented new fingerprint sensor feature that improved sensor capability and enhanced overall performance by 4X. Patent disclosures were submitted, approved, and filed.

Underfill and glob top encapsulation processes used to make prototype sensors for product demonstrations and testing.

Created new in-house mono-layer epoxy screen printing coating hardware and process that improved yield from 30% to 99%(>3X process improvement), while reducing process cycle time 10X.

Developed and validated screen printing process for 13mm square aperture x 20µm thick stencil printing for semiconductor wafer-level IC die conductive epoxy coating.

MOTOROLA, INC., Arlington Heights, IL

Staff Mechanical Engineer 2000 - 2004

Developed advanced processes and equipment for SMT PCB assembly including reflow, through-hole, and wave soldering for assembling electronic products. Assigned to manufacturing engineering teams and factories to solve difficult production yield, cycle time, and quality issues.

Designed and simulated new PCB assembly factory process flow that predicted increase in throughput by 28%. Changes were tested, validated and then implemented for all production.

Invented Flip Chip or Direct Chip Attach (DCA) reflow solder repair process. Allowed removal of high temperature solder alloy spheres from fully populated 2-sided FR4 PCB circuit boards without damage.

Created equipment, hardware and process development of low cost solder repair for BCC IC bumped chip carrier for implementation in China factory. Trained Chinese engineers in USA for use in China.

Directed project that identified new product design and process changes, reducing soldering defect levels from 34,000 to 20PPM for 0.4mm pitch parts (QFP), reducing repair costs, and improving product quality that allowed new high tier product to ship on-time.

Created, optimized, and launched global co-branding labeling process for UV painted cellular phones resulting in on-time product launches, corporate recognition, and 5 awards for outstanding performance.

Chemical Hygiene Officer for process development lab. Created safe lab operating procedures for equipment and the use of chemicals like fluxes, adhesives, solvents, acids, bases, and other materials.

EARLIER ROLES AT MOTOROLA, INC., Schaumburg, IL

Senior Engineer, Lead Engineer

Reflow and wave solder, SMT, and PCB fabrication technologist developing new materials, IC packages, and manufacturing processes to advance surface mount electronic assembly.

Pioneered new surface mount packages, materials, technology, and manufacturing processes to produce the first pocketable cellular phone.

•Completed Design of Experiments (DOE) that quantified effects of solder pad finish and soldering atmosphere improving product quality and reducing costs, key in winning the Malcolm Baldridge Award.

•Championed new component soldering improvement project reducing defects from 36,000 to 120PPM. Identified key issues in manufacturing processes that reduced repair costs by 30X.

•Created modified IPC-B25 test board for flux and soldermask interactions to achieve no-clean soldering.

EDUCATION & PROFESSIONAL DEVELOPMENT

Master of Science Mechanical Engineering (MSME), University of Illinois

Bachelor of Science Mechanical Engineering (BSME), University of Illinois

Motorola Six Sigma Black Belt DMAIC, DFSS and DFX Training, Motorola University (200+ hours)

Project Management Training, George Washington University (40 hours)

Green Belt Training, Six Sigma Masters (24 hours), ANSYS FEM Modeling Training (40 hours)

ProE 2D/3D Modeling Training (60 hours), CADDS 2D/3D Modeling Training (80 hours)

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