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Engineer Design. PCB Schematic capture, Embedded C, Python, VHDL

Hyderabad, Telangana, India
September 04, 2019

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Dhanavath Vishnu




Permanent Address:

H.No: 5-29




Telangana, India.

Pin: 508207.

Personal Data:

Fathers Name: Govind

D.O.B :6



Nationality: Indian,

Marital Status: Single.


Playing Cricket and

Chess, Cooking,

Swimming, Reading books


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Languages Known:

Telugu & English.



To work as Engineer using my technical and interpersonal skills as part of a team to increase my level of expertise and to learn new technologies.

Technical Skills

Languages : C, VHDL, MATLAB, Embedded C, Python

Software Tools : CoventorWare, MEMS Plus, Synopsys TCAD, PSpice, Cadence Virtuoso, Layout Editor, Smart

Snippets, ECAD, Keil

Operating systems: Windows Family, Linux.

Academic Credentials:

2014-2016: Master of Technology in VLSI and Microsystems, Indian Institute of Space Science & Technology, Thiruvananthapuram. CGPA – 7.71

2009–2013: Bachelor of Technology in Electronics and Communication,

Swami Ramananda Tirtha Institute of Science and Technology, Nalgonda.

Score – 69.92%, First Class with Distinction.

2007–2009: Higher Secondary Education,

Board of Intermediate Education Andhra Pradesh,

Vasavi Junior College, Miryalaguda.

Score – 90.40%.

2006–2007: Secondary Education,

Board of Secondary Education Andhra Pradesh,

Adharsha Vidyalayam, Miryalaguda.

Score – 69.83%.


Hard Working in nature

Sincere & Co-Operative

Put maximum effort to achieve goal

:: Project Profile::


2016: Design, Fabrication and Optimization of MEMS based vibratory Gyroscope. Device Fabrication Work performed at Semi-conductor Laboratory, Chandigarh. Description: Present MEMS based gyroscopes are miniaturized in the commercial application but still there is need of miniaturized gyroscope in the satellite and navigational application where the bulk gyroscope is need to be replaced by micro/Nano gyroscope. In this project, an attempt was made to optimize the MEMS based Vibratory gyroscope in terms of design and fabrication. The designed Out of plane Gyroscope meet the frequency match differ by only 35Hz and Rate sensitivity of 1.1 fF/(deg/sec), having a drive and sense mode quality factor of 1 million and 500. The Design part carried out Indian Institute of Space Science and Technology, Thiruvananthapuram and fabrication is carried out at Semi-conductor Laboratory, Chandigarh by bulk-micromachining process and Si-Glass Anodic bonding. 2013: Design of AES (Advanced Encryption Standard) Encryption and Decryption Algorithm with 128-bits Key Length.

2011: Pc Based DC Motor Speed And Direction Control By Using PWM and Bridge.

:: Experience::

2015- 2016: One Year fabrication lab exposure (clean room) at SCL, Chandigarh. Associated with different tool engineers of 1X double side mask aligner, LPCVD and PECVD deposition chambers, DRIE Etching, Wafer bonding and Dicing for the fabrication stages of vibrating Gyroscope for my project work.

2016 September – 2017 June: Worked as Junior Research Fellow at IIST, Thiruvananthapuram. My role is to develop a Gas Sensor using a microcantilever platform with the piezoresistive material by MEMS fabrication method. Designing using FEM tools, designing manufactural wafer level mask layout, coordinating with the sensor manufacturer, testing and analysis. Also, I have worked on a customized system for detecting different type of gases and volatile organic compounds, using a microcantilever platform with piezoresistive readout. Having hands on experience in clean room on 1X Double-sided mask aligner, DC/RF magnetron sputter and Parylene deposition system, Laser Doppler Vibrometer (LDV), Nanoindenter. 2017 July – Present: Working as IoT Product Engineer in R&D at Geokno India Private Limited, Hyderabad. The work we carry out is developing an IoT product for smart security application. My role is to coordinate with vendors at different stages of product development starting from ordering and importing all required hardware testing boards for proving POC, PCB designing, 3D Enclosure designing, product certification. Laying out the complete roadmap of product development. Once the PCB boards come from the PCB vendor caring out the different type of testing and analysis using the standard tools. Writing code in Keil for integrating sensor with the wireless microcontroller.


I hereby declare that the information furnished above is true to the best of my knowledge.



Yours faithfully,


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