GREGORY BURT ANDERSON
**** ******* ****** ***** *. Jacksonville, 32224 904-***-**** **************@*****.***
Summary
Patent pending internationally published Staff Failure Analysis/Quality Engineer with over twenty years’ of Quality Management experience. Continuous improvement projects leader utilizing Lean, Six Sigma, and 5S frameworks supporting OEM/Tier1 customers for ISO9001 and IATF16940 compliance.
Skills
Failure analysis report publication (over 600)
Eight Discipline report publication (over 1200)
FMEA
Fault tree
Five Why
Six Sigma
Lean
5S
HAZ MAT DOT
Semiconductor Failure mechanism identification
Fault localization and interpretation
Wet-Lab manager
Scanning Electron Microscopy (SEM)
C-Mode Scanning Acoustical Microscopy (CSAM)
Energy Dispersive X-Ray (EDX)
Failure mode localization
X-Ray machine operation and safety training
Wet lab owner responsible for chemical approvals, safety, education, and training
Work instruction formulation and publication
Experience
Staff Failure Analysis Engineer Jul 2005 – Feb 2019
Failure Analysis Request Manager Oct 1996 – Jul 2005
INFINEON TECHNOLOGIES
Failure mechanism localization and identification.
Publish Failure Analysis and 8D Reports to Customers.
Material elemental analysis and identification using SEM/EDX tools.
Document results with concise conclusions in an analysis report for submission to internal/external customers.
Participate in customer conference calls and present analysis results.
Develop new innovated processes and methodologies in supporting new emerging technologies.
Develop, compile, and publish lab work instructions.
Wet lab owner responsible for chemical approvals, safety, education, and training.
Wet lab owner responsible for 5S training and implementation.
Develop new techniques and tools for Livonia lab with the central Failure Analysis group in Europe.
Marshal cross functional teams to bring customer related EOS and Back End related failures to resolution.
Coordinate and manage all Failure Analysis activities for US, Canada, and Mexico customers.
Monitor Failure Analysis Activity and publish monthly report to Company Management.
Monitor Failure Modes and publish monthly report to Company Management.
Monitor Failure Mechanisms and publish monthly report to Company Management.
Monitor Root Causes and publish monthly report to Company Management.
Monitor Failure Analysis cycle time monthly report to Company Management.
Chair customer communication meetings and conference calls for Quality related issues.
Set Weekly Priorities for the Failure Analysis Labs.
Chair weekly Failure Analysis status meetings with Field Quality Engineers, Marketing, and Sales Offices.
US liaison for Back End (Component Assembly and Test) and Front End (Fabrication), Quality related issues and corrective actions.
Track open failure analysis requests and ensure proper throughput time.
Develop and maintain technical quality support for key account customers.
Develop and maintain working relationships with customer Quality organizations to reduce the impact of quality related issues.
Education
Associate of Science in Electronics and Computer Technology
Mission College, Santa Clara, CA. 1999.
Certifications
Ford Motor Company: - Eight Discipline (8D) problem solving training - 1996
Infineon Six Sigma Yellow Belt - 2018
ISO9001 and IATF16940 – 2016
DOT Hazardous Materials Regulations and Safety Training – 2013
Hazardous Waste/Materials Handling & Emergency Procedures Training - 2013
More certs available on request
Accomplishments
Patent pending die electric gel removal process utilizing a ten-micron wavelength CO2 laser for Hybrid Pack module automotive applications. Submission #US20170117139A1.
Pending patent submission Heat Affected Zone methodology laser process for mold compound removal for plastic encapsulated integrated circuits.
Publications
Co-Authored Abstract “CF4-free Microwave Induced Plasma De-capsulation of Automotive Semiconductor Devices” International Symposium for Test and Failure Analysis 2016.
Co-Authored Abstract and Tutorial “Effective Laser De-Capsulation Employing the Digital ICO Laser and HAZ Methodology” International Symposium for Test and Failure Analysis 2016.
Authored Abstract “Innovative Process for Gel Removal” presented at International Symposium for Test and Failure Analysis 2016 and Infineon Tech Forum 2016.
Authored Abstract “The Feasibility of Green Non-Destructive Failure Analysis”. Presented at Infineon Technical Forum 2017. Proprietary document.
Published over 1200 failure analysis reports.
Published over 600 Eight Discipline report