Jeffrey Chin Senior-Level Business Development Manager
Innovative ~ Strategic Sales ~ Semiconductor Expertise ~ North America & Asia
Entrepreneurial, results-oriented executive with over 12 years of business development experience and a solid technical and engineering background in the network communications, ASIC, ASSP Semiconductor industry. Credited with implementing effective sales strategies in highly competitive international semiconductor markets including OEM, ODM, North American, and APAC region customers. Dedicated to developing and driving outbound sales strategies, onboarding new customers, and retaining current clients. Analytical strategist skilled at successfully targeting new business opportunities and effectively managing the sales funnel to consistently exceed revenue goals and maintain budgets. Collaborative communicator continually focused on building business partnerships, alliances, and Tier 1 accounts to increase revenues and market share. Fluent in Chinese and English. Areas of Expertise include:
Strategic Planning & Forecasting
Revenue & Profit Growth
Tier 1 Business Development
Sales Planning & Marketing
Technical Areas of Expertise include:
Multi-Core Communication Processors
Embedded Processing Solutions
Ethernet Passive Optical Network
Experience & Notable Contributions
Unigen Corporation Newark, CA 2017 – Present
A Solid-state drive and DRAM module products manufacture
Strategic Account Executive
Supported and grew the revenue at existing accounts including Cisco-Meraki, Brocade/Broadcom, Brocade/Extreme Networks, Infinera, Foxconn, Fabrinet, Flex, Jabil, Lanner Electronics and external manufacture sales reps as well as developing new business at new customers with the Unigen Flash Storage, SSD, DRAM and Server/Embedded memory products lines. Manages China Mftg Sales Rep firms/distributors Avnet HK, Arrow Asia ... etc and China sales team to develop new business opportunities in OEM/ODM Enterprise, Data Server/Storage, Embedded and Industrial markets with the support from the Unigen HQ in the US.
Achieved 30% total sales revenue growth from 2017 – 2018
M.2 SSD drive design win at Datang Mobile 5G base station design in China 5G market.
Recruited and rebuilt sales and FAE team for China region
Signed up Avnet HK and Arrow Asia as Manufacturer Reps/Distributors for China region.
APPLIED MICRO CIRCUITS CORPORATION Sunnyvale, CA 2009 – 2011
A fabless semiconductor company designing embedded processor and connectivity products
Director of Sales, China Country Manager
Led a top-performing team of 10 sales and field applications engineering (FAE) staff to plan and implement effective sales strategies for the China market achieving revenues in excess of $42M per year. Expanded regional business by collaborating with major distributors Avnet HK, Arrow Asia, and RTI. Assisted with development and implementation of product marketing plans including positioning messages, presentations, and sales tools to communicate value proposition and key differentiators. Identified, qualified, and developed executive relationships and strategic partnerships, facilitated client meetings, negotiated client sales agreements and contracts, and closed business. Provided ongoing customer support via post-sales account management and relationship maintenance activities.
Increased ZTE optical transport network (OTN) revenue from $3.2M 2009 to $12M 2011.
Achieved first company 100G OTN design commit with Fiberhome forecasted revenues of $4M annually by 2014
Coordinated high-level executive meetings for product roadmap discussion and relationship building
Recruited and rebuilt 50% of sales and FAE support team for China region
EZCHIP Campbell, CA 2009
A fabless semiconductor company that develops and markets Ethernet network processors
Director of Strategic Sales, Asia
Led the planning and implementation of sales strategies for Huawei Layer 2/3 IP Router, Metro Ethernet, and PTN product lines. Facilitated development of executive level relationships, identifying appropriate targets and establishing a positive, long term relationship via a series of meetings to establish a high level of mutual trust and respect.
Negotiated and closed commercial strategic partnership relationship with Huawei Technologies Co.
XELERATED Santa Clara, CA 2004 – 2009
A fabless semiconductor company specializing in ASSP-based carrier Ethernet chipsets
Director of Sales, Asia-Pacific
Developed and implemented all strategic sales activities for original equipment manufacturer (OEM) customers in China, Korea and Taiwan for the networking semiconductor markets including management of FAE team. Identified and built
positive relationships with customer key decision makers, prepared quotations, and closed sales. Supervised the provision of technical pre- and post-sales support.
Recruited to manage multifaceted role for manufacturer of 20G/40G/100G programmable network processors for LAN switch, Carrier Ethernet switches and routers, Optical systems, and Metro Access markets
Facilitated an additional $23 Million in new funding by securing a joint news announcement with Huawei and ZTE for the X11(20G) Network Processor design wins
Launched and built sales support organization from 0 to 4 FAE staff in China
Increased design wins by 150% year over year exceeding yearly revenue and design win goals
Multiplied China sales revenue by more than 300% each year improving from $0 to $15M
Achieved 60% total sales revenue growth for 2007 and 2008
PASSAVE TECHNOLOGIES/INFINEON TECHNOLOGIES/ZETTACOM Santa Clara, CA 2000-2004
Selected to manage field-engineering role for multiple semiconductor firms
Senior Field Applications Engineer
Provided advanced engineering expertise to drive design wins and advance sales of Ethernet passive optical networks (EPONs) and silicon (OLT, ONU) for high-profile Asian and North American FTTH broadband customers. Participated in trusted computing platform alliance (TCPA) compliance, Security IC, Trusted Platform Module (TPM), and HW & TSS SW stack design-in activities for Infineon. Managed prominent client accounts providing expert pre-sales design and technical support for ZettaCom Ethernet Switches. Consulted with ZettaCom’s marketing/engineering groups regarding new-product definition and development, training materials and other support materials.
Generated $8.5 million in sales during first quarter 2004 for Passave
Achieved $5M in annual revenues through 2 Tier One customer design wins in Asia for ZettaCom
Collaborated on Intel team that achieved listing for Infineon TPM module on recommended material list (RML) for all Intel PC desktop and mobile platforms
Led sales activities for Passave major accounts including Hitachi, NEC, and Mitsubishi
INTEL CORPORATION Santa Clara, CA 1998 – 2000
One of the largest and highest valued semiconductor chip makers
Field Application Engineer (1999 – 2000)
Led sales and design activities for assigned major accounts developing and executing sales strategies across all Intel/Level One product lines.
Achieved expected revenues of $16M in 2002 by driving Intel/Level One product lines to Nortel/Bay and Netgear
Senior System Hardware Engineer (1998 – 1999)
Spearheaded complex project to manage development of StrongARM SA-1100 microprocessor-based Internet screen phone reference design.
MS, Electrical and Computer Engineering
WAYNE STATE UNIVERSITY Detroit, MI
BS, Chemical Engineering
TAIPEI INSTITUTE OF TECHNOLOGY Taiwan, Republic of China
Multiple Sales Seminars Sales Management Account Management
Relationship Management Technical Support Project Management