Thomas K White

Lake Orion, Michigan *****

www.linkedin.com/in/thomas-k-white-180a6715 248-***-**** ac8lsn@r.postjobfree.com

Process Engineer

Comprehensive technical leader with over ten years’ experience in process and application engineering roles.

Highly technical professional with leadership experience in a number of process engineering positions with an emphasis on SMT electronics assembly and a Lean Six Sigma Green Belt certification. Recognized for outstanding communication skillset and extensive track record of success collaborating with vendors and clients to boost manufacturing yield. Career-spanning experience training and developing large technical teams and developing knowledge base of Six Sigma and 5S. Comfortable in exceptionally regulated high-stakes environments including implementing PCB line and rework processes for products in the automotive and defense industries.

PCB Line & Rework Processes / SMT Electronics Assembly / Team Training & Development

Client Communication & Collaboration / Troubleshooting & Issue Resolution

TECHNICAL PROFICIENCIES

SMT Materials:

Leaded & non-leaded solders, fluxes, underfills, conformal coatings.

SMT Equipment:

Documentation:

Print, SPI, reflow ovens, oven profiling, AOI inspection, BGA rework, wave & selective soldering.

PFMEA, process flows, visual aids, work instructions.

SMT Processes:

Tooling/Fixtures:

Lean Six Sigma, DFX, 5S, DMAIC, DOE, root cause analysis, SPC charting, Kaizen events, X-ray analysis.

Stencils, wave/reflow pallets, assembly fixtures.

PROFESSIONAL EXPERIENCE

Process Engineer (6/2016 – 4/2018) Jabil, Auburn Hills, Michigan

Technical Scope: PCB line & rework processes, SMT pallets, routing fixtures.

Established and implemented PCB line and rework processes for a variety of high-grade products. Closely inspected and monitored layout and processing conditions and recommended changes to prevent failure recurrence. Frequently led the design and modification of SMT pallets and various routing fixtures. Developed strong base of knowledge regarding structure of BOMs, ECOs, MRP, process flow charts, and visual aids in addition to writing assembly instructions.

Key Achievements:

Provided key support in a process flow redesign Lean project to reduce WIP through one-piece flow.

Directed a range of product engineering trials and qualification activities.

Process Engineer (5/2015– 1/2016) Inovar, Inc., Logan, Utah

Technical Scope: PCB line processes, solder paste print & inspection, DFM rules, SPI machines, BOMs.

Crafted PCB line processes for solder paste print and inspection and launched DFM rules for PCB down to .4mm pitch. Boosted product yields by transitioning to new solder pastes and fluxes and carried out equipment qualifications testing. Installed SPI machines and trained operators on the use and maintenance of the machines. Cultivated greater proficiency in working with mechanical fixtures, electronic assemblies, and BOMs.

Key Achievements:

Outlined DFM rules for board layout and stencil design of higher-density boards with smaller components including 0402s and 0201s.

Eliminated significant time and material waste of solder paste drying out during processing by managing a change in vendors.

Considerably improved process yields by overseeing CAPEX and implementation of solder paste inspection (SPI).

Process Engineer (Prototype Line) (12/2009 – 4/2015) Western Digital, Irvine, California

Technical Scope: PCB line & rework processes, PCB designs, DOE, process & reliability testing, equipment qualification testing, SPI, AOI, and BGA rework machines.

Directly improved line processes by delivering recommendations for upgrades and improvements to machine vendors. Conducted process and reliability testing of solder pastes for updates to the AVL and carried out a DOE for board layout. Collaborated extensively with mechanical engineers to support internal tool design and oversaw all aspects of production ramp-up operations. Dispensed feedback to product management and engineering layout teams for new PCB designs and recommended alterations to materials, layout, and processes to avoid failure recurrence. Played key support role in CAPEX and implementation of machines used for BGA rework, SPI, and AOI in addition to leading operator training on the machines.

Key Achievements:

Spearheaded the transition from LGA to BGA to achieve improved manufacturing yield from 80% to 99%.

Directed reliability (SIR) testing for new solder pastes for addition to AVL to enable a lessening of uBGA voiding.

Supervised the conversion of the production process from Type 3 to Type 4 solder pastes to facilitate processing with smaller components including 0201s and QFNs.

Application Engineering Tech, Tech. Service Rep (10/2002 – 7/2009) Henkel Corp., Irvine, California

Technical Scope: Semiconductor materials, assembly materials, process optimization, F/A testing.

Represented a service area spanning seven Western US states and acted as company representative at numerous trade shows including heading training presentations to customers and distributors. Additionally authored articles regarding performance and reliability of electronics materials. Led reliability and F/A testing of PCB assemblies and semiconductor materials. Provided a wide variety of technical solutions and delivered new material recommendations to achieve improved performance during “gun shot” and avionic stress tests. Traveled around the Western US to collaborate with customers and gain insights into potential production issues that inform choice of materials for next-generation products and changes to processes.

Key Achievements:

Enabled a defense contractor to meet delivery schedule by delivering comprehensive instructions on material cure.

Implemented onsite improvements to an OEM robotic dispensing system of read-writ heads for DVD devices to maximize production yield.

Additional Experience: Application Engineering Tech / Field Service Representative/ Instructor – Robotic Dispensing (Asymtek, Carlsbad, California).

EDUCATION AND TRAINING

Bachelor of Art in Political Science

University of California, Los Angeles – Los Angeles, California

Science & Mathematics Coursework

Palomar College – San Marcos, California

Technical Certifications

Certified SMT Process Engineer (SMTA) – Lean Six Sigma Green Belt Certification (SSGI)

California Army National Guard (E5, former)

Professional Associations

Member – Surface Mount Technology Association (SMTA)

Member – International Microelectronics Assembly and Packaging Society (IMAPS)

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