Michael A . Munoz
**** ********* **. ****** ** **010
Home: 626-***-**** - *******@**************.***
Professional Summary
A challenging and responsible position in Printed Circuit Board design that will utilize my skills in Electronic and
Mechanical Design, and ISO-9002 procedure utilization - and that will further expand my knowledge in high speed
Digital, Analog, Optical Transceiver/Receivers,USB3,USB data hub.
Core Qualifications
Pads Standard Plus Release VX2.2, Pads Logic VX2.1, Cam 350-Release 14. Altium Designer 19, AutoCAD Release 14 and 2000,Cadence Allegro 17.2, PCB Librarian XL, Orcad PCB Designer Professional, Capture Cis, Solidworks 2019, Draftsite 2019, User of Windows XP, 7, 10. Microsoft Office 2003.
Experience
Lead PCB Designer
January 2012 to Current
Glenair Inc Glendale, Ca
Designed 10G Transmitter/Receiver board, on a small form factor.
Designed a Rigid/Flex board with control impedance, power supply,.
Was task to reduce layer count successfully on a rigid/flex board from a 12 layers to 6 layers.
Sr. Principle Electrical Cad Designer
January 2005 to January 2012
Viasys/Cardinal Health/CareFusion Yorba Linda, Ca
Generated schematics and designed multi-layer surface mount and thru hole printed wiring boards.
Interfaced with senior design engineers on design performance versus packaging trade-offs.
Revised Schematic drawings, Assembly drawings, Master drawings, and Bills of Material, per Drawing
Change Requests/Orders.
Released all documents in accordance with ISO-9002.
Responsible for full turnkey, on time and on budget.
Interfaced with Production, Test, and Purchasing organizations in providing released Drawings, Gerber
check plots and pending marked-up prints.
Supported sister campus in legacy design.
Consultant
January 2003 to January 2005
Alta Design Corp Duarte, Ca
Designed multi-layer printed wiring assemblies; utilizing high density and high frequency design
considerations; including BGA and two-sided SMT packaging - and differential pair, matched impedance
circuit path length design rules.
Interfaced with senior design engineers on design performance versus packaging trade-offs.
Prepared Bills of Material (BOM), and setting-up configuration management of product revisions.
Design Center Manager
January 1997 to January 2003
Acdi, Inc Anaheim, Ca
Interfaced with customers and promoted the benefits of focusing on the aspects of time-to-market
alternative solutions in the overall design and fabrication process.
Lead a design group of printed wiring designers; activity includes technical guidance, budgeting, and
scheduling of multiple simultaneous projects.
Created and implemented design quotation system for managing multiple concurrent customer Requests
for Quotations / Proposals (RFQs and RFPs); greatly improved RGP response times.
Prioritized and allocated projects of the overall design group; maintained master schedule.
Generated daily / weekly management reports on active projects for company executive staff.
Authored / implemented detailed procedures for complex printed wiring module designs.
Education
Associate: Science Drafting, June 1988
Citrus College Glendora, Ca
Science, Drafting and various technical and business seminars and specialized training course
References
References Professional and personal references available upon request
Languages
Fluent in social and technical Spanish; reared in bi-lingual household
Skills
AutoCAD, benefits, budgeting, budget, bi, configuration management, Drawing, ISO-9002, managing, market,
Microsoft Office, 2003, Windows 7, Cadence Orcad, packaging, power supply, Proposals, Purchasing, scheduling,
schematics, seminars, Spanish, wiring