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Engineer Manufacturing

Location:
Lynwood, California, United States
Salary:
$85,000 per year
Posted:
April 27, 2019

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Resume:

RESUME

Salvador M Roque

***** ***** ********

Lake Elsinore Ca 92530

714-***-****

Email: ac8776@r.postjobfree.com

EDUCATION: California Polytechnic University, Pomona

B.S. Engineering Technology

WORK EXPERIENCE:

Collins Aerospace : 14440 Myford Rd, Irvine Ca 92603

Sr Manufacturing Engineer April 26, 2018 to March 21, 2019.

Responsibilities : Sr Manufacturing Engineer in charge of Night Vision Systems for Goggles used by Army Personnel.

o Work with R & D for processes, assembly development and equipment identification for production. Advise Design Engineering on manufacturability, lean / six sigma manufacturing, produce ability and quality of new designs. Using DFM, FMEA, and 5Y’s to define/ measure root cause then analyze to improve and control process.

o Design Prototype tooling for soldering and assembly of Laser Transmitters and Photo Diode Receivers, Optic Subassemblies, Optic components (collimators, focusing lens, SM and PM Fibers for 10 to 18 GHz Modules.

o Create and maintain process and assembly instruction for products and processes with attention to detail. Involved in Change Control Board to change Procedures and Drawings thru NCR’s.

o Supervise a production team of 5 technicians to build prototype and preproduction modules and PCBA box Assemblies. Using Telecordia 468, Mil-STD-883, IPC-610, workmanship standards.

o Provide Quality Engineering support for Performance Testing, Qualification Testing, and Life Testing of Modules and Box Assemblies as part of Design Verification. A member of the Material Review Board to disposition production material.

o Maintained an engineering lab facilities, assembly equipment, hand tools. Including all ESD controls, humidity, clean room environment, electrical requirements, and inert gases for process.

o I have a strong structured work ethics with interpersonal communication skills among all organizations (Engineering, Quality, Production, Business Departments, and Customers)

Nanoprecision Products: 411 Coral Circle, El Segundo Ca 90245

Manufacturing/ Process Engineer; Feb 7, 2015 to Feb 18, 2018.

Responsibilities: Sr Process Engineer in charge of process development for a Navy Transmitter/ Receiver communication Hybrid that went into the F18 and Joint Strike Fighter.

o Work with R & D with New Product Introduction and advise Design Engineering on manufacturability, lean manufacturing, produce ability and quality of new designs.

o Design Prototype tooling for soldering and assembly of Laser Transmitters and Photo Diode Receivers, Optic Subassemblies, Optic components (collimators, focusing lens, SM and PM Fibers for 10 to 18 GHz Modules.

o Create and maintain production documents for products and processes with attention to details

o Supervise a production team of 3 technicians to build prototype and preproduction modules and PCBA box Assemblies. Using Telecordia 468, Mil-STD-883 and IPC-610 workmanship standards.

o Provide Quality Engineering support for Performance Testing, Qualification Testing, and Life Testing of Modules and Box Assemblies as part of Installation Qualification. To meet requirements of Product Safety CE Compliance, IP Code Standards, and United Lab Standards.

o Support company goals and objectives, policies and procedures, Good Manufacturing Practices and ISO regulations.

o I have a strong interpersonal communication skills among all organizations (Engineering, Quality, Production, Business Departments, and Customers)

APIC / PhotonIC Corp: 5800 Uplander Way, Culver City Ca 90230

Manufacturing / Process Engineer; Aug 19, 2013 to Sept 16, 2014.

Responsibilities: Sr Process Engineer for new designs and process development for

Communication devices for commercial and military applications.

o Work with R & D and Design Engineering with DFM and FMEA’s for new designs. Implement Production Key Process Indicators for manufacturability, lean/ six sigma, and DMAIC.

o Design Prototype tooling for soldering and assembly of Eutectic Die, Metal and Optic Subassemblies, Optic components (collimators, focusing lens, lens fiber, & flip chip), PM Fibers and TEC’s for 10 to 40 GHz Packages.

o Use statistical methods, DFM, FMEA, Kaizen and CAPA for continuous improvement, and hands on experience to solve problems on the production line related to yield, product quality and cost efficiency thru the life of product.

o Create and maintain production documents for products and processes with attention to details

o Supervise a production team of 9 operators and technicians to build prototype and preproduction modules and PCBA box Assemblies. Using Mil-STD-883 and IPC-610, J100-Std workmanship standards.

o Provide Quality Engineering support for Performance Testing, Qualification Testing, and Life Testing of Modules and Box Assemblies as part of Design Verification. To meet requirements of Product Safety CE Compliance, IP Code Standards, and United Lab Standards.

o Established an engineering lab from the ground up with facilities, assembly equipment, hand tools. Including all benches, ESD controls, humidity, clean room environment, electrical requirements, and inert gases for process.

o I have a strong interpersonal communication skills among all organizations (Engineering, Quality, Production, Business Departments, and Customers)

Emcore Broad Band (Formerly Lucent /Agere): 2015 W Chestnut St, Alhambra, Ca 91803

Manufacturing Engineer: Nov 28, 2000 to Aug 16, 2013

Responsibilities: Sr Manufacturing Engineer for new designs and product introductions for

Lasers, Receivers, and Sensors for CATV and Telecommunication Equipment per

GR-468-CORE Requirements.

o Work closely with R & D for high volume product introduction of processes and assembly equipment, and lead continuous improvement on existing production lines.Advise Design Engineering on lean manufacturing, produceability and quality of new designs.

o Design Prototype and Mass Production Tooling processes for potting, laser welding, machining, drilling, soldering, assembling operations,

o Use statistical methods, DFM, FMEA, continuous improvement, and hands on experience to solve problems in the production line related to yield, product quality and cost efficiency thru the life of product.

o Create and maintain production documents for products and processes with attention to details.

TRW Space and Electronics Group: One Space Park, Redondo Beach, Ca 90278

Senior Member of the Technical Staff: March 24, 1997 to Sept 25, 2000

Responsibilities: Manufacturing / Process Engineer for transition of new designs for RF Hybrids, Modules per MIL-STD883 Requirements. Support and sustaining of existing high volume product lines, which are used for Aerospace and Commercial application. Responsibilities: Auto and Manual Pick and Place, Auto and Manual Ribbon and Wire bonding, SMT / Flip Chip, PCB Soldering, Flex Circuit Assembly, and various other assembly and sealing processes. Engineer responsible for Statistical Process Control (SPC).

Accomplishments:

o Design Reviews of Engineering Specifications, design layouts, and approval of assembly drawings.

o Determine new processes and procedures and write the manufacturing instructions.

o Implement design changes on existing programs.

o Write master flow documents (assembly instructions).

o Initiate and monitor statistical process controls of assembly processes.

o Generate visual and line aids.

o Design fabrication and assembly tooling.

o Feed back producibility information to design engineering of new products.

Lockheed Aerospace: 29947 De Las Banderas, Rancho Santa Margarita, Ca 92688

Quality Engineer / Manufacturing Engineer: June 1, 1990 to March 21, 1997

Responsibilities: In charge of Surface Mount Technology (SMT) and Standard Circuit Card Assemblies (CCA’s) for MIL-STD-2000A and J-STD-001 Requirements. Pick and Place of SMT components and standard axial, radial, and dip components. Responsible for infrared, vapor phase, and wave solder reflow machines. Create manufacturing instructions packages for SMT, Standard CCA’s, Flex Circuits and Subassemblies. Profile I. R. Furnace for the different CCA configurations.

Accomplishments:

o Provide lead bending tooling for fine pitch (.015 and .020 mils) Gull Wing components.

o Solder paste screen printing and automatic pick and place machines.

o Solder reflow and cleaning.

o Initiate and monitor statistical quality controls on processes.

o Automatic conformal coat spray.

o Injection molding and potting compounds.

o Trouble shoot soldering, potting problems on CCA’s, flex circuits, and wire harness.

Leach Corp : 6900 Orangethrope Ave, Buena Park, Ca 90620

Supervisor Mfg Process Engineering: Sept 23, 1987 to Feb 17, 1990

Responsibility: Transition of new Hybrid and Surface Mount Assemblies designs to production. Develop and implementing Processes and Materials, writing and maintaining Process / high Material Specifications. Justify new equipment and provide utilization instructions.

Accomplishments:

o Review customer specifications to introduce new process and material requirements, long lead items, and high risk components in kick off meetings with management.

o Instruct to the design group proper design methods for Hybrids, Surface Mount Assemblies, and Packaging.

o Create travelers / routers for proper production operation sequences to meet customer Specifications.

o Deposition product and determine rework procedures for the Material Review Board.

o Maintain logs and maintenance schedules for production equipment.

M/A-COM PHI : 1742 Crenshaw Blvd., Torrance, Ca 90501

Senior Product Engineer : Nov 19, 1986 to Sept 21, 1987

Responsibility: Planning new Surface Mount production areas, equipment, facilities, and man power requirements for new programs.

Accomplishments:

o Interface with Marketing and Customers in determining impact of new programs to production floor.

o Analyze combine utilization of equipment of dedication new areas and equipment for production Implementation.

o Improve processes and equipment for optimum yield, reliability and quality (solder reflow, eutectic die attachment, wire bonding, and sealing).

o Develop and qualify new vendors (Plating, PWB Manufacturers, Substrate Manufacturers, Component Manufacturers).

o Direct model shop in the simulation of prototype products to debug fabrication, assembly, and process problems.

Teledyne Microelectronics: 12964 Panama St., Los Angeles, Ca 90066

Senior Manufacturing Engineer: June 18, 1984 to Nov 17, 1986

Responsibility: Transition of new design Hybrids and Surface Mount Devices to production.

Accomplishments:

o Design Reviews of Customers Specifications, design layouts, and approval of Subassemblies and final assembly drawings.

o Write Manufacturing Instructions for new procedures.

o Implement design changes on existing programs.

o Write master flow documents (assembly instructions).

o Initiate and monitor statistical quality controls on processes.



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