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Mechanical Engineer Manager

Seoul, Seoul, South Korea
April 22, 2019

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Dongkyu Park Woodinville, WA

Phone number: +1-425-***-****



High performance senior engineering professional with +20 Yrs. extensive experience in both tooling design and product mechanical design for the consumer electronics industry. Successfully led cross functional teams providing design expertise for market leading technology creation organizations. Extensive consumer electronics process development expertise. Known for optimizing product design for reduced cost and streamlined assembly.

Demonstrated expertise in architecting mobile devices from design concept to mass production with the launch of LG products LG-P515 series, LG-D210, LG-KP6100, Pantech products PG1300, PH8500, PN820 and Foxconn’s Mobile product(A1), Nokia’s tablet PC (Lumia 2520), Microsoft’s All-In-One (Surface Studio), etc (BT Head set, Debonding fixture, bonging machine’s Nest & press head)

Expertise in the follow areas.

Mobile/Tablet Product Architect (Concept ~ MP)

Product Development for Mass Production

Tier 1 and 2 Supplier Management

ODM/CM Product Development

Trouble shooting on-site

Analysis,Corrective Action

Touch Panel and Display Development

Tooling Program Management

PSA/HAF for lamination

Injection Molding Tool design

Fixture design (Bonding/Debonding)

Manufacturing Processes Expertise (Painting, CNC, Sub_Assembly)

Experience (Details refer to attachment in the next page)

Mar. 2011 ~ Jan. 2019. Company / Location

R&D Manager/Mechanical engineer KOMI Global/ Seoul, Korea

-. Design Bonding machine/Fixture, Die cut (PSA/HAF)

Senior Mechanical engineer Microsoft / Redmond, WA

-. Lead touch display module/system integration

Mechanical Project Manager. (MPM) Foxconn / Taipei, Taiwan

-. Review design/manage schedule

Senior Mechanical engineer/Project Manager Nokia / Taipei, Taiwan

-. Lead Tablet design, manage project (ODM)

Sep. 2007 ~ Mar.2011

Principal engineer/PM LG Electronics / Seoul, Korea

-. Manage tooling schedule, lead tool design review

Sr. principal engineer/Team Manager/PM Foxconn / Seoul, Korea

-. Lead mobile phone design/project manager (ODM).

Aug. 2003 ~ Sep. 2007

Principal engineer Cresyn / Seoul, Korea

-. Lead design (Concept, BT headset/Ear phone)

Sr. Mechanical engineer/Project leader Pantech / Seoul, Korea

-. Lead mobile phone design/project.

Dec. 1996 ~ Aug. 2003

Sr. mechanical engineer LG Electronics / Seoul, Korea

-. Lead design/project (Mobile phone)

Tooling designer LG Electronics / Seoul, Korea

-. Design injection mold tool (Laptop, Printer, and Mobile Phone.)

#1. Attachment

Detail Experience

KM Global. Jun.2017 ~ Present

R&D Manager/Mechanical engineer Seoul, Korea

Designed the bonding (PSA) machine/fixture (for Window, Camera lens, Cover glass, home button)

Updated program status, managed engineering resources and work with cross-functional teams. (China, U.S including customers.).

Designed and led the Debonding machine from concept to sellable.

Reviewed customer requirements and defined Design concept including layout and detail design.

Strong knowledge on PSA, HAF application and Bonding/Debonding Assy processes.

Knowledge on Pneumatic system Design and heat transfer, and FEA (static with Solidworks).


Successful Set up company part number system and PDM application.

Designed and completed the Debonder machine/equipment from concept to sellable stage.

Set up design model tree structure and BOM system for company.

Microsoft Apr. 2015 ~ Nov. 2016

Senior Mechanical Engineer Redmond, WA

Led Touch Display Module development, including program management, external design partner management, risk assessment, architecture definition, detailed component level design, tolerance analysis, and design for assembly. Accessed and communicated Touch Display Module progress, risk and dependencies to internal stakeholders

Responsible for complex component design including various mechanical enclosures, structures, electrical and electromechanical subassemblies within the Touch Display Module, including printed circuit boards, flexible circuit boards, cable assemblies, and other integrated components.


Successful implementation of unique Touch Display Module for mass production.

Implementation achieved all cost and reliability targets.

Improved build materials quality with working with suppliers closely.

Launched Surface studio (All-In-One PC)

Foxconn Jan. 2015 ~ Apr. 2015

Mechanical Project Manager Taipei, Taiwan

Provided risk analysis, design for manufacturing feedback, and development schedule planning for customer product concepts.

Nokia Apr. 2012 ~ Nov. 2014

Senior Mechanical Engineer/ Project Manager Taipei, Taiwan

Lead architect for several tablet PC concepts and detailed designs, leading to one successful mass production launching as technical mechanical lead.

Coordinated cross-functional teams and managed external design partners (ODM Mechanical team, 6~8 personas), ensuring products met cost, schedule, and quality targets, also managed ODM ME resources and reviewed detail design-3D/2D, and mile stone.

Provided on-site build support at supplier factories, clearing away roadblocks and keeping production schedules on track. Guided tooling design mold flow analysis, and design for manufacturing efforts.


Launched first tablet PC for Nokia (Lumia 2520).

Implemented first Nokia product with OGS touch solution.

LG Electronic Mold Technology Center Mar. 2011 ~ Apr. 2012

Principal Engineer and PM Seoul, Korea

Managed tooling development and schedules for new product development.

Worked closely with mechanical and cross-functional design teams, providing design for manufacturing expertise leading to achievable product concepts meeting cost and schedule targets. (; leading tool kickoff meeting, managing tooling schedule)

Sourced and implemented new technologies such as tooling heating and cooling systems, sand blasting laser etching technologies, 3D cooling designs and 3D glass forming.


Applied 6-sigma principles to define standard cycle times for mechanical housing parts, leading to improved cost calculations by sourcing/purchasing teams,

Did activity on the reduction of cycle time (injection mold-housing, covers)

Worked for mechanical competitive reinforcement task team as a member for mobile phone.

Earned Six Sigma Green Belt

Foxconn Sep. 2007 ~ Mar. 2011

Senior Principal Engineer / Project Manager/Team manager Seoul, Korea

Managed mobile device architecture, component stack-up, cost and schedule.

Optimized mobile device architecture for assembly and manufacturing. (Concept ~ MP)

Provided on-site support for every build at tier 1 and 2 suppliers in Asia, working collaboratively to meet ODM customer’s requirement. (cost and quality targets and schedule)


Project leader for 4 programs with one launched successfully.

Developed thinner rotary hinge.

Developed and implemented assembly fixtures at the factory for touch panel / housing assembly (Glue).

Launched Mobile phone (A1, Touch phone)

Cresyn Sep. 2006 ~ Sep. 2007

Principal Mechanical Engineer Seoul, Korea

Led architect and mechanical designer for cutting edge ear phone and Bluetooth head set concepts.

Identified and solved reliability issues, calculated material costs for customer proposals, and supported mass production.


Launched Bluetooth mono head set.

Produced Kleer chip solution prototypes to demonstrate feasibility as a Bluetooth replacement.

Pantech Co., Ltd. Aug. 2003 ~ Aug. 2006

Sr. Mechanical Engineer / Program Lead Seoul, Korea

Managed master schedule, led overall layout and detailed assembly structure for mobile devices.

Led efforts to mature product design through reliability testing and on-site support at tier 1 and tier 2 suppliers from concept through to mass production.


Successfully launched 4 products.

Designed and launched unique rotary hinge with applying co-axial cable connection between display and main board.

Launched ultra-low cost product. (Mechanical target cost: Under $10).

LGE Mar. 2000 ~ Aug. 2003

Sr. Mechanical Engineer / Program Lead Seoul, Korea

Led detailed mechanical engineering design for various mobile devices from concept through to mass production.

Launched 8 products, and provided ongoing support for 5 products in mass production.

Provided on site build support at all stages of development, and solved reliability and mass production issues at tier 1 and 2 suppliers.


Awarded “first and best” prize (on time launching, high quality within 6 months).

Completed feasibility study on painted and anodized aluminum die cast covers.

Earned Six Sigma Black Belt

LGE Dec.1996 ~ Mar.2000

Tooling Designer Seoul, Korea

Responsible for tooling design of injection molded parts for internal customers.

Collaborated with customers to optimize injection molding tool designs in consideration of cost and quality.


Designed and launched several tools for customers’ mass production programs

Education / Qualifications

BSc in Mechanical Engineering Chon-Buk National University, Korea

Six Sigma Green Belt LG Electronics

Six Sigma Black Belt LG Electronics

Mold flow analysis (advance course) LG Electronics

Lean Six Sigma training Nokia

GD&T Training Microsoft

Technical Skills

Pro/E (Creo, Expert. +15Yrs)

Mold Flow Analysis

(Moldex 3D,injection mold)

Program management (including ODM/CM)

Catia, UG NX

Sheet Metal/Plastic molding

Minitab (statistical analysis tool)

English (Proficient)

Die-Casting (Mg, Al, CNC)

Six Sigma Black Belt


Manufacturing Processes

Solidworks/FEA(static analysis)

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