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materials Engineer

Location:
Newark, CA
Posted:
April 09, 2019

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Resume:

Yanqing (Arthur) Li

**** ******* ******* ***, ******, CA, 94560

628-***-**** *******@*****.***

Objective:

• Seeking an entry-level material engineering position, focus on failure analysis, material characterization and mechanical analysis of solids. Technical Skills:

• CAD/Hardware Modeling: AutoCAD, Pro-E CREO, SolidWorks, LabVIEW.

• Finite Element Analysis: ABAQUS, ANSYS.

• Data Analysis/Mathematical Computation: MATLAB, Python, C, C++, Microsoft Office, JMP, SQL.

• Molecular Dynamic Simulation / Visualization: LAMMPS, OVITO.

• Physical/Optical Characterization: HV Hardness Test, Tensile Test, Nanoindentation, Scanning Electron Microscope (SEM), Scanning Probe Microscopy (SPM), Atomic Force Microscopy (AFM), X-ray Diffractometer (XRD), Energy-dispersive X-ray spectroscopy (EDS).

Education:

Santa Clara University, Santa Clara, CA Sep. 2016 - Dec. 2018 Engineering Master of Science in Mechanical Engineering emphasis on Materials Engineering China University of Petroleum-Beijing, Beijing, China Sep. 2011 - Jun. 2015 Bachelor of Science in Material Science and Engineering Academic Projects:

Failure Analysis of Magnesium Alloy AZ31B Processed by Uniaxial Tensile Apr. 2018 - Jun. 2018

• Determined the fracture modes and mechanical properties of annealed Mg alloy AZ31B processed by uniaxial tensile.

• Identified the fracture propagation mechanism through analyzing the fracture surface visualized by AFM and SEM, then use EDS to verify the composition.

• Evaluated fracture modes of Mg alloy AZ31B and determined annealing influence on fracture mode transformation (ductile-brittle). Failure Analysis and Phase Transformation Research in Wire Bonding of Aluminum/Copper Jan. 2018 - Mar. 2018

• Researched intermetallic phase nucleation and forming mechanism during wire bonding of Aluminum/Copper, then analyzed the bonding parameter and tool angle influences on bonding joint quality.

• Designed 3D wire bonding model using SolidWorks then use Finite Element Analysis (FEA) to analyze the stress and deformation distribution on bonding joint with different tool angles during wire bonding.

• Determined the fracture modes, optimized bonding process to avoid defects and maximize strength for bonding joint. Cu-Metal-Organic Framework Material Powder Forming and Failure Analysis Sep. 2014 - Mar. 2015

• Developed the forming method of Cu-Metal-Organic Framework (MOF) material powder through binders and solvents combinations.

• Evaluated crystallinity and crystal integrity using the SEM and XRD, then use BET test to measure the specific area which maintains the adsorption and catalysis properties.

• Explored the optimal binders and solvents combinations, saved more than 50% cost because of the product recyclability. Work Experience:

Santa Clara University, Santa Clara, CA, Research Assistant Dec. 2017 - Dec. 2018

• Researched the deformation mechanism in contact interface that forms through the jump-to-contact mechanism using molecular dynamic simulation on ultrasonic bonding of Aluminum/Aluminum.

• Simulated ultrasonic bonding atomic structure using LAMMPS, then visualized and analyzed bonding defects generated during ultrasonic bonding using MATLAB and OVITO.

• Optimized bonding process by presenting perfect atomic arrangement during ultrasonic bonding process and successfully avoided the bonding defects.

Sinopec Oilfield Equipment Corporation, China, Material Characterization Engineer Intern Jun. 2015 - Sep. 2015

• Lead material characterization, failure analysis and quality inspection for oil and natural gas transportation pipes.

• Determined the failure modes and failure reasons such as design deficiencies, manufacturing defects, overloading, fracture, and fatigue, then provided optimization advice for the manufacturing department to avoid defects during manufacturing.

• Evaluated the oil and natural gas transportation pipes quality and ensured that the quality meets the API (American Petroleum Institute) Q1 standards and client requirements.



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