Michael P. Fleischer

**** ****** **** ***. *

Eau Claire, WI 54701

715-***-****

ac7euk@r.postjobfree.com

Summary

Over 25 years of experience working in either semiconductor fabrication as a technician & process engineer or as a support technician & lead in a high volume manufacturing environment. Currently looking for a position in an industry that utilizes my background to enhance product development and manufacturing while maximizing yield potential.

Experience

MST & Maintenance Lead 2004 – 2018

TDK Hutchinson Technology Eau Claire, WI

Oversee MST group on D crew assign tasks/experiments from Engineering as requested and respond to daily problems with a sense of urgency.

Manage group work load make assignments based on daily manufacturing needs.

Completed MST & maintenance annual performance reviews.

Ensure that manufacturing is running at the highest possible OEE for a specific process by troubleshooting any technical issue outside the scope/capacity of the other organizations.

Identify and reduce the causes of acute quality problems that occur daily in the component processes by collecting and analyzing pertinent data and troubleshooting identified problems.

Improve the next generation of equipment by supporting Design and Development Engineering with concepts, specifications, and feasibility analysis.

Assist support areas on special projects by acting as a consultant/subject matter expert.

Ensure manufacturing has the documentation required to manufacture effectively by helping to maintain/update process documentation.

Guide and coach technicians on troubleshooting activities for equipment and processes.

Administer daily work assignments for maintenance technicians.

Communicate with manufacturing leads & supervisors regarding priorities, i.e. down equipment.

Other duties as requested.

IC Etch Process Engineer 1995 – 2003

Cray Research / SGI / USTC Chippewa Falls, WI

Principal etch engineer assigned to perform initial start-up, qualification, and acceptance of ion beam etch/deposition system for use in etching/SiN passivation of GMR films on 6-inch wafers.

Developed ion beam etch system standard operating/qualification procedures.

As member of etch team, worked on MRAM process development using SPC & DOE.

Assisted in training etch personnel on ion beam etch/deposition system, as well as other etch equipment, Lam 4526i and 9606.

Developed purchase agreement to upgrade Lam 4526i and 9606 etch systems to electrostatic chuck.

Researched equipment vendors to determine etch system capabilities for future production requirements.

Ability to operate Amray SEM and AFM to measure GMR bit CD’s.

Monitored SPC control charts.

Worked on MMBICMOS process development for via and metal etch.

Researched costs for upgrading Lam 4526i and 9606 etch systems to electrostatic chuck.

Wrote purchase order for new Matrix 1106 photoresist strip system.

Principal etch engineer assigned to perform initial start-up, qualification, and acceptance of Matrix 1106.

Developed ISO 9000 operation/qualification procedures for Lam 4526i, Lam 9606, and Matrix 1106.

Wafer fabrication for MMBICMOS product line.

Assisted in training personnel on all etch equipment.

Worked with etch process technicians to improve existing etch processes or develop new ones.

Acted as liaison to equipment vendors to identify recurring equipment software or hardware issues.

Completed SPC training class.

Coordinated etch area maintenance with equipment support staff to meet production schedule.

IC Process Technician 1990 – 1995

Cray Research Chippewa Falls, WI

Promoted to Senior IC Process Technician.

Assisted etch engineers in initial start-up, qualification, and acceptance of Lam 4526i, Lam 9606 etch systems, as well as Matrix 1106.

Provided engineering support in developing new via, metal, and planarization etch processes for MCAV product line.

Assigned to perform initial start-up, qualification, and acceptance of Semitool WSST(Water Soluble Solvent Tool).

Performed maintenance on MRC Aries via etcher.

Cross-trained in Thin Films area.

Completed DOE training class.

Learned operation of Amray SEM.

MCAV wafer fabrication on 3rd shift.

Maintain accurate process documentation and records.

Assisted in preventive maintenance on AME 8130 aluminum etcher.

Provide engineering support for improving via and metal etch processes.

Education

University of Wisconsin-Eau Claire, Eau Claire, Wisconsin:

Bachelor of Science degree, August, 1989. Biology Major. 3.25/4.

Geography minor--Land Use.

Additional Skills

Efficient in operation/programming of the following etch equipment: Commonwealth IBE 1027 (ion beam), Lam 4626i, Lam 9606, Matrix 1106, Semitool WSST. Amray SEM operation. Atomic Force Microscope (AFM) operation. MS Word, Excel. Windows NT, Powerpoint.

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