ARNEL HIDLAO
+63-090******** Mobile / ** years old
*******@*****.*** / *-******@**.***
Osio Road, Tadiangan, Tuba Benguet,
Baguio City, Philippines
PROCESS ENGINEERING / MANUFACTURING
* **ars of work experience in large semiconductor engineering operations with high volume semiconductor manufacturing industry. Experience and highly proficient in statistical methods of data analysis using JMP and spotfire tools, problem solving using 8D methodology, FTA, SPC, MSA, FMEA, DOE. Skilled and performer process engineer with excellent in meeting productivity, eliminating non-value added activities and controlling production cost
PROFESSIONAL EXPERIENCE
Process Engineer (Breakthrough & Sustaining) Texas Instruments Philippines Incorporated
BGA Laser Marking/Package Saw Singulation October 18, 2009 - 2018 Present
Key engineer and leading in driving improving Yields, Top3 DPPM reduction, Lot rejection Rate (LRR) meeting machine productivity (with hands-on legwork)
Key engineer in problem solving and prevention by identifying the systemic problem using common fault tree analysis, fish bone diagram, process mapping or six sigma (with hands-on legwork)
Key engineer in Improving process and machine capability, machine productivity (with hands-on legwork) by understanding every variable factor
Key engineer in performing DOE to understand the material characteristic vs machine capability and get the region of interest for both to come-up a working and realistic optimum process
Performed parameter and machine baselining/optimization to attained to eliminate unnecessary multiple parameter, eliminate chronic issues and non-value added activities
Performed Variable and Attribute Measurement System Analysis (MSA) for machine/process Improvement
Performed evaluation and DOE to come-up a stable process/machine stability, working parameters and optimized parameter
Key engineer and proficient in DEFINING STANDARD on process methodology, machine parameter and machine capability
Key Engineer in Defining Process Specification, Limits, Work instructions, FMEA and Controls
Visibility and open negotiation on suppliers/OEM for continuous process/machine improvement
Active in every CCB, MRB and Operation Review (OR) presentation for process/machine improvement
Expert in conducting study to define standard methodology, material characteristic and machine
Active and transparency on supplier/OEM for continuous drive on improvement (win-win)
Continuous drive on Cost Savings and Avoidance
Blade COST Improvement Program for Package Saw:
-Blade consolidation( from 12 different blade part numbers to 4-blade part numbers presently)
-Blade and UV tape second sourcing, blade rejuvenation/ Blade Life Extension
Punching tool modification to improve cost usage
Effective in Process Change Implementation and Improvement/Productivity
-Switching and Qualification of one device to another device on Machine Set-up/flexibility to Improve and Hitting Productivity and Cost metric
Ball Attach Process Engineer Apprenticeship ~ Texas Instruments Philippines Incorporated
- EPZA Loakan Road Baguio City ~ 2009
TECHNICAL SKILLS & KNOWLEDGE
Expert in Mini-tab Analysis Tool, Expert in JMP Statistical Tools and Expert in Spotfire Tool
Expert in Design of Experiments (DOE) and MSA (Variable/Attribute)
Proficient in MS Word/Excel/Powerpoint
Knowledge in Ball attach and Die attach process
Programming and Operating of the Machine Precision Measuring Tool
Key engineer in defining specs limit of process /machine and capability
Operating/Troubleshooting BGA Devices Laser Marking and Package Singulation Machine
(APM, Josung, EO Tech Laser, Rokko, DISCO, ACCRETECH/TSK)
Additional Training/SKILLS
Train the Trainer (Certified) Six Sigma DMAIC
Blade for Singulation by DISCO Corp Work/Business Ethics 7QC Tools
Laser Marking by EO Tech mini-tab Analysis tools JMP Analysis tools
Design of Experiments FMEA /8D/Engg5S Material Science
Ball Attach Process Solder Balls Process Substrate Process
Process Mapping Characterization/Process mapping Presentation Skills
Package Mold Compound Problem Solving
EDUCATION
Bachelor of Science in Electronics & Communication Engineering
Cebu Institute of Technology University ~ N.Bacalso Avenue, Cebu City, Philippines 2003-2008
ACHIEVEMENT/PUBLICATION
Top Performer Assembly Process Engineer
Eliminating trace burr – achieved ZERO DEFECTS PPM
Eliminating SR chips, damage solder balls on BGA devices
200% Defects Improvement on package dimensions/off-center problem and damage balls
Meeting Cost programs on Savings and Avoidance
(Blade Usage, Second Sourcing, Blade Life Extensions/Rejuvenation)
Continuous drive on innovation and active on PATENT ideas contributor
ACHIEVED MANUFACTURING INCENTIVE AWARD
Improve machine productivity and manpower by implementing UNIVERSAL MACHINE HANDLER SET-UP program (machine conversion elimination/universal set-up and NVA elimination)
Improve machine productivity and manpower to overcome substrate material warpage by re-designing and enhancing machine capability – on-going patent review at US
Redesigned substrate material to eliminate and prevent copper trace burr on saw singulation process (attained and accomplished ZERO DEFECT PROGRAM on this project)
Improve machine productivity and manpower due to frequent tooling breakages by implementing Y-Cut Die Enhancement (attained ZERO TOOLING BREAKAGES)