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Engineer Engineering

Location:
Chandler, Arizona, United States
Posted:
December 21, 2018

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Resume:

DAVID BENJAMIN PAUL email: ac702a@r.postjobfree.com

**** **** ******** **** ***. 15 - 332 phone: 1-281-***-****

Chandler, Arizona 85224

CAREER PERSPECTIVE

I am interested in widening my career in failure analysis of semiconductors with possible further mastery of areas of product engineering or test engineering.

WORK EXPERIENCE

QUALCOMM CDMA TECHNOLOGIES

Senior Engineer June 2014 to June 2018

QCT Failure Analysis Lab – Corporate Headquarters San Diego, CA

Senior Engineer Lead EFA on digital analysis projects for Qualifications & RF Returns.

Verified Test Characterizations for Structural/Functional EFA flows.

Coordinated ATE Tester Docking to IR Electron SIL Microscopes.

Performed EBAC, SOM, Thermal, and nanoprobing to isolate fails.

Debugged Bench setups and CAD support for PTE and FA technicians.

Most products were in the 28 nm RF space, some 10 nm nanoprobe.

ON SEMICONDUCTOR CORPORATION

Staff Failure Analysis Engineer September 2012 to April 2014

Product Analysis Lab – Corporate Headquarters Phoenix, AZ

Staff Failure Analysis Engineer Performed micro-probe analog Fail Site Isolation on Thermal failures.

CAD Cross-probe Conversion Team support for the entire team.

DALS analysis with bench developed triggers on thermal failures.

Developed full Bench Characterization of Xilinx FPGA activation of ATPG and functional failures.

TEXAS INSTRUMENTS INCORPORATED

Quality Assurance Engineer October 2005 to August 2012

Houston Device Analysis Operations Houston, TX

Quality Assurance Engineer ATPG Diagnosis FA Champion for Automotive and DSP Product.

Wrote Voltage Contrast/LC Segmentation rules: non-repeated circuits.

Tool Owner, RIE-ICP Plasma: Oxide de-process of 65 nm pitch tech.

Tool Owner Dual Beam FIB, coauthor HDAO Auto-probe STEM proc.

Pack. Analyses: BGA, flip, bumps. Performed Sem-probe verification.

Test Engineer Responsible for bench setup duplication of tester program patterns.

ATE Shmoo transfer to Thermocouple at bench for IR/liquid crystal.

Micro-probed electrical fails to defects for mixed signal devices.

Time-Domain Reflexometer profiling/CSAM for package quals.

T-Tool parallel de-layering and mechanical cross-sections for 90 nm.

Design Diagnostics Engineer July 1998 thru June 2001

DFAB’s & MSP Operation’s Integrated Yield Team Dallas, TX

Design Diagnostics Engineer Performed FIB straps, cuts & pads for verification of new product functionality, decreasing time to high yield production. Did FIB work for e-beam/VC setups. Wrote probe access standards for customers.

EDUCATION

CARNEGIE MELLON UNIVERSITY, GPA = 3.09 Class of 1998

Bachelor's Science in Electrical & Computer Engineering Fall 1994 thru 1998

w/ a BA in Philosophy (Artificial Intelligence depth) Pittsburgh, PA

Graduate Courses: IC Fabrication Processes, Advanced Analog IC Design Project, Analog IC Design

Project, Applications of Analog ICs, Stochastic Processes, Circuit/Packet Switching

Undergraduate: Semiconductor Devices 1&2, Quantum, Electromagnetism, Signals, Prob & AI, Game Theory, Analog Circuits, Engineering Statistics & QC, Conflict Res, Digital Circuits, Prob. Theory & Random Processes

QUALCOMM, 2014 to Present Mentor Graphics Tessent Diagnostics,

Advantest V93000 Digital User Training

UFLEX Teradyne Training, Yield Explorer Training,

Fischer Scientific Nanoprobe System Training

TEXAS INSTRUMENTS, 1998 thru 2012 Wafer Handling, IC Processing, Tetramax, Ocelot Tester, VLCT, Supervisor Communications, 5S

Generic, 1998 to Present VCM/Spindle motor controllers, Labview, GPIB

Fire Marshall Training, CPR Training, ESD, PPE Hazardous Communications, ISO compliant

W. T. WOODSON HS in Fairfax, VA Class of 1994

FIELD EQUIPMENT

Fischer/DCG Nanoprobe 2 System with EBAC, Crossbeam FEI FIB/Plasma & P3X DCG/Schlumberger FIBs, Hitachi 4800 & Joel SEM, Inovys Ocelots, Teradyne UFLEX Testers, 93K Agilent Testers, VLCT, IR Emissions Microscope, Scanning Optical Microscopes(OBIC, OBIRCh, TIVA, XIVA, DALS), Realtime X-Radiography, C-SAMs, Karl Suss and probe stations, Hot Chucks, RIE/ICP machines, Parameter Analyzers, Network Analyzers, Logic analyzers, pattern generators, oscilloscopes, curve tracers, Pico Probe Manipulators, AFM/SPM probe, EBIC/SEM probe station, Nisene Omni-etcher, fuming nitric and sulfuric jet etchers, plasma sputtering tools, bond pull, vacuum ovens, UV lasers, & various chemicals.

FIELD SOFTWARE

Gatan Microscopy Suite, Tessent, Tetramax, Fastscan, TestKompress, Avalon/Knights, ICBF Cadence, K2, Verilog, Magic, Karl Suss Wafermap, IDS Datapower, Spice, Labview, Perl, HPIB basic, Matlab, C/C++, Java, Assembler, HTML, Pascal, AutoCAD, Quick Circuit, Pro-cad, Solaris/Gnome Unix.

AWARDS

Qualcomm Super Qualstar for World Class Speedy FA of 28 nm RF.

24/7 support to debug multiple Root Material Analyses for success of critical sockets.

Outstanding Weekend Support of UFLEX docked devices. (pre-Triple Stacked Solutions)

In Recognition of Great Effort for the Green Dragon Project.



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