MICHAEL KONG
****.*********@*****.*** 732-***-**** 219 Yellowknife Road, Morganville, NJ 07751
EDUCATION
Rutgers University School of Engineering, New Brunswick, NJ May 2014
Bachelor of Science in Materials Science Engineering GPA: 3.43
WORK EXPERIENCE
Trumpf Photonics - Process Engineer - Laser Diode Devices July 2014– Present
Hands-on experience with autonomous machinery (mainly SMT systems and P&Ps), with main focus on 24/7 uptime and maintaining high quality production
Responsible ownership the installation, operation, and maintenance of several production equipment
Perform process development activities on equipment for new product/material
Continuously develops and improves GaAs Wafer processes such as scribe and break, stacking, unstacking, and visual inspection
Communicate database changes to properly track Production yields and output
Evaluation of alternate sources for components and makes recommendations to engineering designs
Develop and execute experiments to test new components and processes before use in products
Modify tooling to improve production process yield and reduce process variation
Data tracking for various bar/chip defect counts during visual inspection
Excellent communication and team work skills, work closely with development group and other engineers on various projects for future product
Conduct independent and collaborative testing on production equipment to enhance efficiency and quality relative to the scope of new processes and products
Initiate short-term and long-term solutions in reaction plans
Create timelines for projects to keep main objective in line of sight while completing small actions items
Lead PDCA teams for determining root cause of process issues and finding a solution
Ability to work independently and structure complex problems with a strong drive to resolve problems
Strong organizational and multi-task skills
Record engineering changes and update necessary process documentation
Support the training and certification of operators, creation and implementation of work documentation for step by step instructions to ensure Operator effectiveness with production equipment
Track output yield and generate SPC charts to help identify areas in need of improvement
Major ACCOMPLISHMENTS
Lead the development of new Single Emitter product: mounting, chip dicing, and visual inspection
Established facet automatic visual inspection for bar and chip facets
Upgraded entire facility with modernized equipment allowing higher throughput and yield improvements
TECHNICAL BACKGROUND
Ownership and responsibility for several machines:
Scribe and Break: Dynatex DTX, Dynatex GST
SMT/pick-and-place: OPTO-Systems Stacker, OPTO-Systems Unstacker, OPTO-Systems Die Sorter, TaylorTech (Laurier) Stacker, TaylorTech (Laurier) Unstacker, and FiconTEC SL2000i
ADDITIONAL SKILLS
Microsoft Office, CAD; Solidworks, SPC Charts, PDCAs, Fishbone Diagram/5-Whys, DOE, SAS JMP Software, JIRA, SAP, BOM, Six Sigma Yellow Belt, Keyence Vision Software for Auto Visual-Inspection, I-Cite Vision Software