Senior Electro Mechanical Technician. 23 years Surface Mount

Robert J. Waple

** ****** ****

Marlboro, Massachusetts 01752

Home Phone: 508-***-**** e-mail: *******@*****.***

Cell Phone: 508-***-****

Goal:

Seeking Engineering Position based on substantial experience of Electro- Mechanical Engineering

Technician.

Summary:

Consulting Electro Mechanical Technician:

April 2008- Raindance Technologies, Billerica, Mass.

Consulting Electro Mechanical Manufacturing Technician:

Build DNA Sequencing and Digital PCR Equipment

Responsibilities include design and setup of the manufacturing floor. System assembly,

Wire harnessing, Sub Assembly, Final testing, and packaging for shipment.

Developed Assembly Processes and wrote all Assembly Procedures for manufacturing floor.

Worked with engineering in developing test processes and wrote test procedures.

. July 2007- December 2007 Advanced Metrology Systems. Natick, Mass

Manufacturing Technician responsible for the Parts and Complete System Assembly, Wire

Harnessing, Complete Set-up, Final testing, and Packaging for shipment, for system (using IR or

Laser) used to measure surface features and trenches used on Silicone Wafers.

Model#s 3100 series. System also consisted of Brooks Automation Wafer handling System.

1998-2007 Intel Corp. Hudson, Mass.

- Engineering Technician responsibilities include Purchasing, Facilitation, Installation, Setup,

de-installation of Lab Equipment. This includes Reflow Furnaces, Blue-M ovens, Pick and

Place Equipment, Nd: Yag Laser, Wafer Back grind.

Worked with Purchasing, Plant Facilities and External Contractors. Setup Maintenance and Repair

of all Lab Equipment.

Other responsibilities included:

- 2006-2007 Materials Analysis. (Chemicals Used)

De-processing of 6 metal layer wafers. Wet and Dry Etch, Removal of Polyimide Layer using

Hydrofluoric bath, Liquid Crystal Analysis and removal using Acetone, Optical Inspection, focused

electron beam inspection and ion beam cross-sectioning.

- 2004-2006 Calibration Lab.

Operation, Maintenance and Calibration of Blue-M Ovens, Tenny Temp/Humidity

& Shock Chambers, Electronic Meters, Anemometers, Temperature Meters, Verniers, Calipers.

- 1998-2004 SORT, Assembly and Test.

- Operation, Maintenance, and Repair of Lumonics Nd: YAG System.

In a Manufacturing, Clean room Environment Class 1000 laser scribing the silicone wafers.

Installation and setup of Rofin Diode Pumped Laser also used to scribe silicone wafers.

- Package assembly to include Wafer Saw, Die Attach, Plastic Overmold, Cavity

Fill, Temperature Profiling of Ball Grid Arrays (BGAs) for Solder Ball Attach and Temperature

profiling for Flip Chip and Multi chip packages.

- Process owner for Wafer Back grind operations, including the maintenance and repair of

Shimbayama Back grinder, NITTO Tape Apply and Remove Systems, and Laser scribe operation

using Lumonics Nd: YAG Laser.

- 1993-1998 Corporate Consultant Technician Digital Equipment Corp.

-Troubleshooting and process analysis for different groups company wide.

Recommendations and updated process procedures.

- Invented High Count Ceramic Pin Grid Array Insertion Tool for New Mexico Plant.

- Recommended (After over 30,000 airflow measurements) additional Cooling techniques and CPU

location for Digital's Alpha Chip.

Other Duties Included:

- Worked on Projects 5 to 10 years ahead of the rest of the company.

Invented and Developed Processes and Procedures, working with vendors and suppliers, and

implemented them into manufacturing.

- Worked on one of a kind or 1st module prior to manufacturing to help resolve any design issues.

- Developed Vapor Phase Reflow Process for all surface mount modules.

- Developed Laser Solder Reflow for Highly reflective surfaces.

- Other board/package related products include:

PCB Module and Ceramic Hybrid Assembly/Solder reflow related to Plated through Holes (PTH) &

Surface Mount, Ball-Grid Array’s (BGA), TAB, Fine Pitch (.4,.5 mm), Multi-Chip Packages,

Flip-Chip. Package Assembly related to Wafer Saw, Die Attach, Plastic Overbold, Cavity Fill, Ball

Attach (BGAs), Flip Chip.

-- EXPERT in various Solder Profile/Reflow Processes include: Vapor Phase, Infrared, Convection,

Thermode, Hot Air, Nd: YAG Laser Reflow, Vacuum Reflow.

1975-1998 Digital Equipment Corp. Maynard, Mass. (Corporate Consultant Technician).

Research and Development Engineering.

- Purchasing, Facilitation, Installation, Setup, and De-installation of all lab equipment.

- Worked with Designers and Facilities on Lab Layout and Complete Facilitation.

- Organized Group moves from building to building.

- Operated, maintained and repaired US Laser Nd: YAG laser system.

Beam alignment, power measurements, Laser soldering (Name on Patent) of circuit

boards, Laser cutting of Fine pitch etches on multi chip packages, Laser cutting and drilling of

beryllium materials.

-setup and profiling of Reflow Furnaces, Blue-M ovens, Pick and Place Equipment,

- Responsible for Environmental Test Equipment Operation and Setup. Thermal profiling of Tenny

Temp/Humidity and Temp Shock Chambers, Blue-M Ovens, Vibration testing, Instron Testing (Pull,

flex, push). According to Military STD 883.

- Worked with Purchasing, Plant Facilities and External Contractors for the Purchasing, Installation

Setup, Maintenance, Calibration and Repair of all Lab Equipment.

1971-1975 Thermo Electron

- Electro-Mech. Assembler (NOX Group): Chemi-Luminesent gas analyzing systems for the EPA and

Industry.

- In house Field Service Upgraded, Repaired and tested all systems.

- Designed and installed one of a kind type wiring harnesses without the use of prints.

Related back to Engineering for print designs.

- Microphone Group Electro-Mech. Tech: --Microphones for hearing aids. Maintained and repaired all

production floor equipment. Including: plastic injection mold machine.

- Performed acoustic testing on the microphones in anechoic chamber.

Lab Experience:

Organize and Schedule the move of complete labs from building to building.

Perform Y2K Testing of all Required Lab Equipment.

ISO 9000 Certified for Manufacturing Environment.

Organize the Calibration and In-House Maintenance of All Equipment.

Materials Analysis and Reliability Testing Includes: Potting/Cross-Sectioning and Preparation for

SEM Analysis. Instron Testing (Pull, flex, push) Using Model #s 1122, 4505.

EXPERT IN Thermal Profiling of Modules, Packages and Temperature Chambers.

Support a number of engineers for lab work to be done.

Organize own work schedule to divide time between 2 or 3 projects simultaneously.

External Plant Support Digital Equipment as Corporate Consultant

Albuquerque, New Mexico. Surface Mount Support

- Floor Supervisor for screen printing and reflow operations.

Overseeing operations of temperature profiles for Electrovert convection reflow ovens.

Repair and upgrade for screen printer and reflow ovens.

Hudson, Mass. Thermal Analysis Support - Alpha Chip.

Performed over 40,000 airflow measurements 17 different style cabinets for cooling recommendations

for Digital's Alpha Chip.

Augusta ME. Ionograph Testing

-Wrote procedures and trained operators. Board Cleanliness Testing Alpha Model 500

Ionograph used for manufacturing.

Hughes Aircraft Carlsbad, Cal. - Developed process for Thermosonic ILB of TAB devices.

Austin, Texas --3Ms Lab - Inner Lead Bonding of TAB Tape using Jade Bonder

Switzerland, for FARCO TAB Bonding. – Trained for Repair and Maintenance on F150 TAB Bonder.

Education:

Boston Trade High - 1971 Graduate, Basic Electronics

Northeastern University – Electrical Engineering Department

In-House Courses: RS-1 Design of Experiments, Hazardous Chemical Safety/Handling, and Handling of Compressed Gases, Windows 2000, MS Word, Excel, and EEW Certified.

Seminar Courses: Introduction to Lasers, Understanding Laser Technology

Technical Courses: Instron Software Training for 4500 Series.

Instron Operational Training for 1100 and 4500 Series

References:

Upon Request

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