RESUME

John Merrell 208-***-**** Email: ac6mm5@r.postjobfree.com

Senior PCB Designer

Technologies:

Digital, Analog, RF

Flex/Rigid designs Backplanes

HDI technology

Tuned signals DFM/DFA

Plane utilization

High layer counts Burn-in/ATE boards

EMI considerations

30+ years of PCB experience Thick/Thin film hybrids

High-speed signals

Power/thermal management Controlled impedance

Knowledge:

•Certified Associate Electronics Technician, AST142225 (2015).

•Certified Customer Service Specialist, CSS141550 (2015).

•OSHA Certified (2015).

•IPC CID+ Certified (2015).

•Excellent communication with peers, PWB vendors, and assembly manufacturers.

•Ability to work with minimal supervision. Design group manager experience.

•Experienced with high-speed, differential, and single-ended terminations.

•Clear and detailed fabrication/assembly drawings. (commercial and MIL)

•Familiar with schematic symbol, padstack, part, and library management.

•Complete understanding of design verification using DRC and Valor NPI.

•Familiar with producing and maintaining documentation standards.

•Proficient with Microsoft Office Suite.

•Complete understanding of the bare board fabrication and layout process.

•Detail-oriented, highly motivated, problem solver, and driven for results.

•Thorough understanding of creating signal constraints, rules, and classes.

Softwares:

Mentor Graphics Expedition (VX.2.1) Mentor Graphics PADS

Design Capture DxDesigner Valor NPI

Work history

General Dynamics – Sr. PCB Designer (Contract)

(8/2017-4/2018)

Designed rigid and flex-rigid printed circuit boards for defense aerospace applications. Produced layouts containing controlled impedance, high-speed signals, high-density surface mount, differential pairs, single-ended signals, and high pin count BGA’s. Collaborated with ECAD and MCAD to understand project scope. Ensured on-time delivery of quality products that meet or exceed the companies’ mechanical, electrical, and manufacturing requirements.

Generated assembly, fabrication, and BOM outputs. Managed multiple projects simultaneously. Worked jointly with team members to help solve problems and seek new ideas. Performed design validation using DRC and Valor NPI. Utilized CES constraints editor for setting up net classes, rules, and spacings. Used Mentor Graphics Expedition for PCB design and DxDesigner for schematic capture.

Northrop-Grumman Defense – Sr. PCB Designer (Contract)

(9/2016-3/2017)

Produced designs containing RF, digital, analog, high-speed signals, controlled impedance for defense aerospace applications. Designs contained SMA connectors, oscillators, mixers, amplifiers, switches, baluns, differential signals, filters, RF transmission lines, signal line isolation, grounding and power supplies. Layer counts were up to 18 layers and thruhole/blind vias were utilized. Performed design validation using DRC and Valor NPI. Utilized CES constraints editor for setting up net classes, rules, and spacings. Used Mentor Graphics Expedition for PCB design and DxDesigner for schematic capture.

Micron Technology – Sr. PCB Designer

(10/2005-7/2016)

Produced printed circuit board designs with an emphasis on quality and detail. Typical designs consisted of 8-40 layers, high-speed signals, BGAs, fine-line traces, via-in-pad, blind/buried/ and micro vias, matched lengths, differential signals, and controlled impedance. Board types included power distribution boards, backplanes, burn-in boards, controller boards, ATE probe, and system level boards. Created assembly and fabrication documentation, as well as all required manufacturing outputs. Created padstacks, cells, and updated parts library. Performed design validation using DRC and Valor NPI. Utilized CES constraints editor for setting up net classes, rules, and spacings. Utilized Mentor Graphics Expedition for PCB design, and Design Capture and DxDesigner for schematics.

Flextronics International – Sr. PCB Designer

(2/2002-10/2005)

Responsible for printed circuit board design, schematic capture, and management of library cells, padstacks, and schematic symbols. Layouts consisted of high-density placement, highspeed signals, BGAs, high power, high copper weights, blind and buried vias, and Valor NPI for design verification. Exposed to a many types of design technologies. Worked directly with internal and external customers. Created assembly and fabrication documentation, as well as all required manufacturing outputs. Utilized Mentor Graphics Expedition, Cadence Allegro, and Mentor Graphics PADS for PCB design.

Lone Star Circuits - Regional Sales Manager (1/1998-2/2002)

As Regional Sales Manager, my function was to obtain and sustain business relationships, close deals, and drive for high levels of customer satisfaction. Successful in creating alliances with Tier 1 customers such as Nokia, Texas Instruments, and AT&T. Operated closely with the Marketing Manager and Customer Service team to ensure schedules and performance criteria were met. Resolve customer issues and create a win-win situation for all parties. Created quotes for new customers and ensured they understood them, and then transferred new accounts to the customer service team. Visited customers regularly and made sales calls with prospects. Constantly placed a high emphasis on customer satisfaction. Very knowledgeable about printed circuit board manufacturing processes.

Epic Engineering Services - Sales Manager/Project Management

(5/1995-1/1998)

Responsible for acquiring new business, establishing close working relationships, maintaining customer satisfaction, and strengthening growth. Provided customers with PCB design and turnkey fabrication/assembly services to potential new customers and to maximize sales with existing customers. Provided weekly sales reports to management. Additional responsibilities included managing supply chain, creating RFQ’s, creating customer quotes, ordering bare board fabrication and procuring electrical components. Emphasis was placed on ensuring ontime delivery to the customer, communicating with customers as to the project schedule, project tracking, costs, RMA activity, resources, project scope, and program management.

Education

A.A.S. in Electronics Technology, Magna Cum Laude (2015)

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