Engineering Manager

PPEETTRROOSS MM.. KKOOPPAALLIIDDIISS,, PPhh..DD.

Swampscott, MA 01907

*********@*******.*** https://www.linkedin.com/in/petroskopalidis ENGINEERING AND MANUFACTURING LEADER

An objective, people-centric technical leader focused on driving efficiencies in innovation, velocity, quality, cost. An accomplished Technical Leader with solid experience in the semiconductor manufacturing and equipment industries, working with world-class teams to drive improvements in innovation, execution velocity, quality and cost. Excellent technical, communications and people skills utilized to build high performance teams in a continuously learning environment. Drives accountability for timely project completion and meeting goals and deliverables to help the organization succeed. Excellent academic preparations, patents, professional record Core Competencies and Training

People and Culture Management; Intel Corporation Manager and Group Leader Academy; Six-Sigma Methodology – Green Belt; Project Management; Design of Experiments and Statistical Analysis; Semiconductor materials process & equipment development; CMOS Process Integration for Planar and FINFET architectures; Power Devices processing on SiC, CoventorWare Training for MEMS Design Applications; CFD-ACE+ Introduction for Multiphysics Simulation Experience

AXCELIS TECHNOLOGIES 1995-2004 and 2015-present

Process Technology Manager – Lead joint development projects with customers and strategic R&D partners on advanced implant applications in Si and SiC. Subjects include materials modification implants for enabling process integration solutions, ion beam angle effects on high aspect ratio contact implants and high productivity Aluminum implants in Silicon Carbide. Presented CMOS technology seminars to Axcelis customers and technical staff. INTEL CORPORATION 2012-2015

Engineering Manager – Technical leader with significant contributions in improving department performance metrics against goals in equipment effective availability, quality, cost and training. Led teams of engineers and technicians in 22 nm and 14 nm technology high volume manufacturing and driving improvements in process and equipment capability, availability and velocity. Worked in a high-performance team, setting expectations, driving accountability with a sense of urgency and role-modeling the culture.

Data Analysis Tools: Significant knowledge of MES300, SPC#, Klarity, PCSA and E3.

Staff Educator: Identified extensive group training needs resulting in the development of individualized plans that ensured skills certification in the shortest timespan while focusing on daily operations and delivering goals.

Quality Improvements: Ensured high product quality by developing aids (checklists and excel spreadsheets) that facilitated specification adherence by all group members.

Process Improvement: Generated 30% reduction in downtime that improved overall equipment availability in the manufacturing line by introducing checklists for preventive maintenance preparation and execution.

Leadership Development: Selected to attend the prestigious Intel Manager Academy. ADVANCED ION BEAM TECHNOLOGY, INC. 2009-2012

Process Technology Manager – Proactive in managing implanter operations, scheduling and staff activities. Led customer applications and process troubleshooting activities by applying Six Sigma Methodology to contain process excursions. Developed equipment usage schedules that facilitated efficient sharing and met project goals by the expected deadlines.

Project Management: Lead continuous improvement project that produced 20% ion source lifetime improvement by identifying prime failure mechanisms and developing strategies to suppress them.

Managed new product development project resulting in novel, inductively coupled plasma ion source for implant.

Delivered ion beam Autotune algorithm improvements that resulted in 15% reduction in beam set up time.

Employee Coach/Mentor: Appointed to train Field Engineers for efficient resolution of customer issues. CIET LLC & INSTITUTE OF MICROELECTRONICS 2005-2009 Consultant - Developed mathematical models of inductively coupled plasma (ICP) reactors using the CFD-ACE+ multiphysics simulator and MEMS devices using CoventorWare. Performed background and literature studies for copper removal in multilevel metallization structures with a focused ion beam for circuit edit applications. IMEC vzw 1993-1995

Research Fellow – Lead research projects on the development of plasma etch processes for high temperature aluminum alloys (AlSiCu, AlCu) in a LAM TCP-9600 etcher and the optimization of a TCAD framework for accelerated CMOS process and device simulation.

Education

UNIVERSITY OF ROCHESTER ARISTOTLE UNIVERSITY OF THESSALONIKI Ph.D., Chemical Engineering Diploma, Chemical Engineering Master of Science, Chemical Engineering

Professional Development

Intel Manager and Group Leader Academy (Intel Corporation 2013)

CFD-ACE+ Plasma modeling course (ESI Group, 2008)

Contamination Control in Semiconductor Equipment Manufacturing short course (U.S. Vacuum Society, 1997)

Semiconductor Material and Device Characterization course (Arizona State University, 1997)

VLSI Processing Fundamentals (IMEC, Leuven, Belgium, 1994) Honors & Awards

Reviewer, Journal of the Electrochemical Society, MRS Symposium Proceedings and IIT Conference Proceedings

Human Capital and Mobility Post-Doctoral Fellow, European Union - Marie Curie Association member

Procter & Gamble Fellow, University of Rochester, School of Engineering and Applied Sciences Patents

Apparatus and method for measuring ion beam current – U.S. 8890506 and 8653807 (Issued) System and method for cleaning silicon-coated surfaces in an ion implanter – U.S. 6259105 (Issued) System and method for cleaning contaminated surfaces in an ion implanter – U.S. 6221169 (Issued) An Ion Source of An Ion Implanter – United States 13975206 (Filed August 23, 2013) Method & Device for Cleaning Contaminated Surface in Iron Impregnating Device – JPN JP2001003154 (Issued) Method & Apparatus for Cleaning Contaminated Surface in Ion Injector – JPN JP2000350970 (Issued) Method & Apparatus for Removing Contaminated Surface in Ion-Implantation System – JPN JP2001007041 (Issued) Vorrichtung und Verfahren zur Säuberung von kontaminierten Oberflächen in einem Ionen- Implantierungsgerät – Germany DE60044272 (Issued)

Publications & Presentations

List of over 25 publications and conference presentations available upon request.

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