Engineer Process

LINING HUANG

*D Autumn Terrace, Ballston Lake, NY, 12019 ************@*****.*** 573-***-****

Summary

Experienced Integration and Process Engineer with a demonstrated history of working in the semiconductors industry. Skilled in IC fabrication, Thin Film process (CVD/PVD), MEMS processing and characterization, Scanning Electron Microscopy, Microfluidics and MATLAB. Strong program and project management professional with a Doctor of Philosophy (Ph.D.) focused in Electrical Engineering from University of Missouri-Columbia.

WORKING EXPERIENCE

GLOBALFOUNDRIES US Inc., Malta, NY

Senior TD Integration Engineer/14 nm PROD INT June 2017 Present

14 nm silicon technology continuously process development and yield improvement

14 nm Fin and Gate module owner for AMD products

14 nm new products qualification and process DOE

Inline process steps correlation to device performance

Work with device team to evaluate inline process change induced device performance change

Work with device team to define new products work function tuning

Advanced Semiconductor Engineering (ASE) Assembly & Test (Shanghai) Ltd.

Back-end Sustain Process Engineer Mar 2010 Jul 2010

Define marking specifications

Sustain back-end system in marking department

Establish a liaison between customer and company

Semiconductor Manufacturing International Corporation (SMIC), Shanghai

Thin Film Process Engineer (CVD/PVD) Jul 2006 Jun 2009

Enhance and improve the growth and yield of interconnects, including the preparation of PVD CoSi2, MOCVD TiN, PVD AlCu, CVD W and CVD WSiX for 180 nm and 130nm memory and logic devices

Introduce new products in process on production line and thin film process improvement

Work with equipment engineer for PVD/CVD tool trouble shooting

Process the alarm on the machine in production line and wafer rework

EDUCATION

Ph.D. in Electrical and Computer Engineering with concentration of micro-electromechanical systems (MEMS) Aug 2010 May 2017

University of Missouri-Columbia, Columbia, MO

Research Area:

Design, Fabrication and Testing of MEMS based Microfluidic Sensors

Single electron transistor based sensors fabricated by E-beam lithography

Patent

“MEMS Based Diagnostics for Individual Red Blood Cells with Applications in Transfusion and Medicine,” United States Patent Application Serial No. 62/687,364 filed on June 20, 2018.

Papers

Lining H., James D. B., Cansu A., Yuksel A., Mahmoud A., “Lab on Chip Microfluidic Sensor for Individual Red Blood Cell Water Permeability Measurement,” IEEE-NEMS 2018, Singapore, April 22-26, 2018. (Oral Presentation)

Lining H., James D. B., Mahmoud A., “A Microfluidic Sensor for Evaluation of Solute and Solvent Membrane Permeability in Individual Cells,” Transducers 2017, Taiwan, June 18-22, 2017. (Nominated for Outstanding Paper Award)

Lining H., Haisheng Z., Bala R., Cherian J. M., Venumadhav R. K., Shubhra G., “Room Temperature Single Electron Tunneling Effect for Different Size of Au Nanoparticles,” Missouri Nanofrontiers Symposium, Springfield, October 26, 2011.

Teaching Assistant

ECE 1000: Introduction to Electrical and Computer Engineering 2013.8-2014.5

ECE 3810: Circuit Theory II 2014.8-2014.12

ECE 2100: Circuit Theory I 2015.1-2015.5

ECE 3410: Electronic Circuits and Signals I 2015.8-2016.12

Master of Engineering in Integrated Circuits Engineering Feb 2008 Jul 2010

Fudan University, Shanghai, China

Paper

Lining H., Tao L., Dong O., Xinping Q., Xiaobo L., Paulchang L., “A Study and Improvement of Tungsten Plug Peeling Defect in 0.18um BEOL Process,” ISTC/CSTIC 2009, Shanghai, March 19-20, 2009.

Bachelor of Engineering in Electronic Science and Technology Mar 2003 Jul 2006

Shanghai University, Shanghai, China

Honors

2003 2004 First class scholarship in Shanghai University

2004 2005 Third class scholarship in Shanghai University

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