Experienced Integration and Process Engineer with a demonstrated history of working in the semiconductors industry. Skilled in IC fabrication, Thin Film process (CVD/PVD), MEMS processing and characterization, Scanning Electron Microscopy, Microfluidics and MATLAB. Strong program and project management professional with a Doctor of Philosophy (Ph.D.) focused in Electrical Engineering from University of Missouri-Columbia.
GLOBALFOUNDRIES US Inc., Malta, NY
Senior TD Integration Engineer/14 nm PROD INT June 2017 Present
14 nm silicon technology continuously process development and yield improvement
14 nm Fin and Gate module owner for AMD products
14 nm new products qualification and process DOE
Inline process steps correlation to device performance
Work with device team to evaluate inline process change induced device performance change
Work with device team to define new products work function tuning
Advanced Semiconductor Engineering (ASE) Assembly & Test (Shanghai) Ltd.
Back-end Sustain Process Engineer Mar 2010 Jul 2010
Define marking specifications
Sustain back-end system in marking department
Establish a liaison between customer and company
Semiconductor Manufacturing International Corporation (SMIC), Shanghai
Thin Film Process Engineer (CVD/PVD) Jul 2006 Jun 2009
Enhance and improve the growth and yield of interconnects, including the preparation of PVD CoSi2, MOCVD TiN, PVD AlCu, CVD W and CVD WSiX for 180 nm and 130nm memory and logic devices
Introduce new products in process on production line and thin film process improvement
Work with equipment engineer for PVD/CVD tool trouble shooting
Process the alarm on the machine in production line and wafer rework
Ph.D. in Electrical and Computer Engineering with concentration of micro-electromechanical systems (MEMS) Aug 2010 May 2017
University of Missouri-Columbia, Columbia, MO
Design, Fabrication and Testing of MEMS based Microfluidic Sensors
Single electron transistor based sensors fabricated by E-beam lithography
“MEMS Based Diagnostics for Individual Red Blood Cells with Applications in Transfusion and Medicine,” United States Patent Application Serial No. 62/687,364 filed on June 20, 2018.
Lining H., James D. B., Cansu A., Yuksel A., Mahmoud A., “Lab on Chip Microfluidic Sensor for Individual Red Blood Cell Water Permeability Measurement,” IEEE-NEMS 2018, Singapore, April 22-26, 2018. (Oral Presentation)
Lining H., James D. B., Mahmoud A., “A Microfluidic Sensor for Evaluation of Solute and Solvent Membrane Permeability in Individual Cells,” Transducers 2017, Taiwan, June 18-22, 2017. (Nominated for Outstanding Paper Award)
Lining H., Haisheng Z., Bala R., Cherian J. M., Venumadhav R. K., Shubhra G., “Room Temperature Single Electron Tunneling Effect for Different Size of Au Nanoparticles,” Missouri Nanofrontiers Symposium, Springfield, October 26, 2011.
ECE 1000: Introduction to Electrical and Computer Engineering 2013.8-2014.5
ECE 3810: Circuit Theory II 2014.8-2014.12
ECE 2100: Circuit Theory I 2015.1-2015.5
ECE 3410: Electronic Circuits and Signals I 2015.8-2016.12
Master of Engineering in Integrated Circuits Engineering Feb 2008 Jul 2010
Fudan University, Shanghai, China
Lining H., Tao L., Dong O., Xinping Q., Xiaobo L., Paulchang L., “A Study and Improvement of Tungsten Plug Peeling Defect in 0.18um BEOL Process,” ISTC/CSTIC 2009, Shanghai, March 19-20, 2009.
Bachelor of Engineering in Electronic Science and Technology Mar 2003 Jul 2006
Shanghai University, Shanghai, China
2003 2004 First class scholarship in Shanghai University
2004 2005 Third class scholarship in Shanghai University