Engineer Process

Gerald M. Hassett

Mobile 978-***-****

****@*******.***

OBJECTIVE

An independent consultant specializing in process improvement for lapping, polishing and dicing looking to obtain an engineering position in optical and/or semiconductor fabrication.

EDUCATION

Middlesex Community College / Bedford, MA.

EXPERIENCE

IPG Photonics / Marlborough, MA 2015- 2017

Senior Optical Fabrication Process Engineer

Shaping and grinding of optical laser crystals

Development of new fabrication/polishing processes for crystals

BAE Systems / Lexington, MA 1979-2013

Process Engineer

Assisted in the development of unique processes for the fabrication of HgCdTe infrared detector arrays, silicon and gallium arsnen: de semiconductor devices. Principal responsibilities in the areas of material lapping and polishing.

Chemical mechanical polishing of all optical IR materials; along with wafer dicing, developing new processes in dicing and written procedures.

Provided support for other groups involved in device fabrication in the areas of yield enhancements, and quality control, as well as developed a vendor support program to ensure quality standards and eliminate quality failures that impact on program deliveries.

Participated in the development of the first optical cavity HgCdTe hetrojunction photo diode. (Holder of the U.S. Patent.) Also developed the polishing process for the HgCdTe wafers.

Skills include handling fragile semiconductor wafers using tweezers, chemical safety, ESD, inspection, attention to details and familiarity with the application of statistical techniques for process improvements.

Itek Corporation / Lexington, MA 1978-1979

Master Optician

Performed grinding and polishing of optical elements up to 42 inches in diameter with tolerances

of 1/20 wave.

Fabricated telescope mirrors up to 94 inches in diameter with dimensional tolerances within

micro-inches.

PATENT

U.S. Patent #4.826.563 “ Chemical Polishing Process and Apparatus”

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