Resume
Andrew S. Krall
***. W. Mesquite St; Chandler, AZ, 85225
Job History
Intel Corp, Chandler AZ, Ocotillo.
*/**-**/** (temp)
Engineering lot processing.
General expedite fab logistics.
NXP Semiconductor, Chandler, AZ, Manufacturing technician.
5/2016-6/2016
Fab pre-cleans (engineering bay)
TEOS/Nitride/Oxide depositions
Diffusion
SemiGrind Corp, Chandler, AZ, Process Technician
6/2007-11/2015. ( Job held simultaneously with Panjit position)
Process engineering responsibility for 3M Wafer Support System and demounter for processing ultra thin wafers.
Process operator/technician for Asyntis plasma etch (stress relief) system.
Disco, Nitto, ADE, Schmitt, 3M and Asyntis engineering support.
Various clerical functions including documentation generation and maintenance of ISO obligations.
Panjit America; Tempe, AZ. Diffusion Process Technician
10/2000 to 8/2007
Diffusion process sustaining including oxidations, predepositions, diffusion, LPCVD nitride, TEOS and associated metrology
functions.
Modification of existent cycles and processes to obtain the desired e-test results as requested by process/product engineering.
Utilize various diagnostic methods to troubleshoot product anomalies.
Design, setup and process and evaluate send ahead tests prior to committing production.
Initiated and revised process documentation.
Conducted mil/ISO audits for all fabrication areas, and managed the FAB selfaudit teams in preparation for the customer/mil/ISO
audits.
Trained new operators and technicians in all phases of wafer processing and SPC obligations
Thermco, Prometrics
Microchip Technology; Tempe, AZ. Photo/Etch Trainer/Operator
7/1997-8/2000
Performed conventional wet/dry etch processes and associated duties .
Operated in-line steppers w/laser EBR.
Drytech, Canon, FSI, Branson, Megastrip, Thermowave and Nanospec.
Alternatively temporary lead operator and all-shift trainer.
Maintained on-line SPC charts for etch qualification data.
Lansdale Semiconductor; Tempe, AZ. Engineering Process Specialist.
3/1993-5/1997
Assisted engineers in the FAB move from California, installed and qualified processes in the new Tempe facility.
Sustained diffusion process area, authored documentation and trained operators.
TMX, Nanometrics, Veeco, Rudolph.
Vitesse Semiconductor; Camarillo, CA. Etch Operator.
2/1992-1/1993 (moved to Phoenix)
Various wet/dry production etch processes.
LAM, AME, Matrix, Branson and Megastrip.
Graduated Sabino High School, Tucson, AZ; 1989.
References available on request.
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