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Engineering Operator

Location:
Arizona
Posted:
March 15, 2018

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Resume:

Resume

Andrew S. Krall

***. W. Mesquite St; Chandler, AZ, 85225

480-***-****

Job History

Intel Corp, Chandler AZ, Ocotillo.

*/**-**/** (temp)

Engineering lot processing.

General expedite fab logistics.

NXP Semiconductor, Chandler, AZ, Manufacturing technician.

5/2016-6/2016

Fab pre-cleans (engineering bay)

TEOS/Nitride/Oxide depositions

Diffusion

SemiGrind Corp, Chandler, AZ, Process Technician

6/2007-11/2015. ( Job held simultaneously with Panjit position)

Process engineering responsibility for 3M Wafer Support System and demounter for processing ultra thin wafers.

Process operator/technician for Asyntis plasma etch (stress relief) system.

Disco, Nitto, ADE, Schmitt, 3M and Asyntis engineering support.

Various clerical functions including documentation generation and maintenance of ISO obligations.

Panjit America; Tempe, AZ. Diffusion Process Technician

10/2000 to 8/2007

Diffusion process sustaining including oxidations, predepositions, diffusion, LPCVD nitride, TEOS and associated metrology

functions.

Modification of existent cycles and processes to obtain the desired e-test results as requested by process/product engineering.

Utilize various diagnostic methods to troubleshoot product anomalies.

Design, setup and process and evaluate send ahead tests prior to committing production.

Initiated and revised process documentation.

Conducted mil/ISO audits for all fabrication areas, and managed the FAB selfaudit teams in preparation for the customer/mil/ISO

audits.

Trained new operators and technicians in all phases of wafer processing and SPC obligations

Thermco, Prometrics

Microchip Technology; Tempe, AZ. Photo/Etch Trainer/Operator

7/1997-8/2000

Performed conventional wet/dry etch processes and associated duties .

Operated in-line steppers w/laser EBR.

Drytech, Canon, FSI, Branson, Megastrip, Thermowave and Nanospec.

Alternatively temporary lead operator and all-shift trainer.

Maintained on-line SPC charts for etch qualification data.

Lansdale Semiconductor; Tempe, AZ. Engineering Process Specialist.

3/1993-5/1997

Assisted engineers in the FAB move from California, installed and qualified processes in the new Tempe facility.

Sustained diffusion process area, authored documentation and trained operators.

TMX, Nanometrics, Veeco, Rudolph.

Vitesse Semiconductor; Camarillo, CA. Etch Operator.

2/1992-1/1993 (moved to Phoenix)

Various wet/dry production etch processes.

LAM, AME, Matrix, Branson and Megastrip.

Graduated Sabino High School, Tucson, AZ; 1989.

References available on request.

ac4tor@r.postjobfree.com.



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