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Engineer Engineering

Location:
Milford, MA
Posted:
March 08, 2018

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Resume:

Milan Shah

** ********* ******, **** #***, Lowell MA – 01852. Ph: 585-***-****

Email:ac4qxi@r.postjobfree.com

Result oriented Engineering Manager with a Master’s Degree in engineering combined with over 10 years of experience, seeks an advanced management position in Electronics Manufacturing - utilizing manufacturing, six sigma and Process Control skills to meet the business goals of the organization.

Education

MS Mechanical & Manufacturing Systems Integrations, Rochester Institute of Technology (RIT), Rochester, NY, Dec 2007 (GPA 3.7)

BE in Mechatronics Engineering, Sardar Patel University, India, May 2004 (GPA 3.6)

Certifications & Skill Set

Relavent Knowledge & Expertise

ASQ: Certified Six Sigma Green Belt (CSSGB)

ASQ: Certified ISO 9001:2008 36 Hour Lead Auditor with Medical Device Focus (ISO 13485:2003)

Certified for Infinity QS SPC Fundamentals Training

Certified Radiation Safety Officer

SMT Process Related Skills

oStencil Printing

oPick and Place Machine

oWave and Reflow Profiling

oSelective Soldering

oBGA Rework

oAOI, 2DX, 5DX

oBatch Washer/Inline Aqueous Cleaning System

Valor Trilogy/MSS

RSlogix – Programmable Logic Controller

Minitab 15.1

Arena - Manufacturing System Simulation

Lab View – Computer Aided Data Acquisition

Agile, PFS

Advanced Electronics Packaging

Reliability Statistics in Electronics Manufacturing

Design of Experiments (DOE)

Statistical Process Control (SPC)

Lean Manufacturing

Project Management

Quality Engineering

Cost Accounting

IPC Class II and Class III

Work Experience

Engineering Manager (Aug 2015 – Present)

Mack Technologies, Westford MA

A leading supplier of printed circuit board assembly, systems assembly, and electronics contract manufacturing services for the defense, communications, industrial, energy, and medical industries

Responsible for managing the engineering processes and resources for printed circuit board and system assembly

Manage the technical elements of business development including DFM, PFMEA, production process development and new product introduction

Responsible to identify, recommend, justify and validate manufacturing equipment required by the operation using thorough ROI analysis

Provide support to the Operations group with capacity planning, process development, cycle time reductions and yield improvements

Additionally, Validation qualification (IQ, OQ and PQ) completed on various new equipment including 2 new production SMT lines and 2 new Selective Soldering machines

Prepared Capacity and Engineering Activities Plans for each manufacturing operation at the beginning of each quarter

Active participation on the Mack Management team

Support the new business development process by participating in Customer visits

Provide departmental performance metrics as appropriate

Recruit, train, and motivate Engineering team to meet customer requirements and Mack’s business needs

Provide support to Program Management to ensure Customer Satisfaction goals are met

Support the Continuous Improvement process by ensuring participation in Quality Teams, reviewing and implementing ECO’s, driving New Product Introductions and following through on Corrective Action Requests (CAR’s)

Responsible for the Performance Management of Process Engineering, Manufacturing Engineering, Maintenance and Documentation Control.

Other responsibilities as directed and necessary for the business

Projects:

Proposed, justified, installed and validated 2 Universal Fuzion Placement lines that replaced original 5 Universal HSP/GSM old legacy lines, with better quality and efficiency in SMT placement which resulted in 4k CPH to 12k CPH with change over time from hrs to approximately 15-30 min

Optimized DFM process by updating ERF (Engineering Rules Files) in Valor software and improving VPL Identification hit rate from 50% to 80% which resulted in saving engineering time performing DFM by approximately 720 hrs ($36,000) per year

Proposed, justified, installed and validated 2 new selective soldering machines (with ROI 1 year) to replace a legacy lead wave, and an old legacy selective soldering machine with drastic improvement in quality yield, labor and efficiency which ended up resulting in potential approximate savings of ~$90,000 to $100,000 per year

Studied and analyzed the non-conformance data in Post SMT and Box Build area related to the manual placement (human errors) consisting of reverse component, missing component and wrong component and provided justification for through hole insertion machine(Contact System) CS400E (with ROI less than a year) resulted in potential approximate savings of ~$100,000 to $125,000 per year

Justified new router machine with ROI 1.2 years that could potentially end up of saving approximately ~50,000 per year

Performed Gage R and R analysis on a very high value active customer’s test station in box build area that resulted in yield improvement from 82.5% to nearly 98%

Executed CPM (Critical Path Method) Analysis to improve NPI readiness (from 23 to 15 days) by 35%

Enhanced the No of NPIs to be released on time from ~80% to ~100% by improvement in planning and integrated system aligning and coordinating among planner, PM, supply chain and engineering

Completed Re-layout of Post SMT Manufacturing area per Lean Concept and Value Stream Mapping

Optimized solder paste release transfer efficiency and voiding underneath the area array packages by conducting a scientific DOE analysis

Successfully, executed 2 major Six Sigma Projects as a part of Continuous Process Improvement

oAvg NPI debug time should not be longer than “1” hr per side per assembly

oReduce the TH defects by 50% at the end of the project completion

Sr. Process Engineer (July 2013 – Aug 2015)

Ducommun, Stafford, Houston TX

Expert turnkey manufacturing services for high-mix, low-to-medium volume ruggedized PCBAs that must perform reliably in extreme and high-cost-of-failure environments (Oil and Gas Industries).

Process owner for analyzing and improving manufacturability of new and existing products for down hole tool application using DFM concepts and OE/CI toolbox

Develop and optimize manufacturing processes by studying product requirements,, conducting research, and applying knowledge of engineering fundamentals, fabrication, assembly, tooling, raw materials

Create manufacturing process instructions and process routers for PCBA’s. by reviewing Gerber, BOM, ECO, and assembly drawings

Responsible for optimizing NPI builds by identifying, analyzing and correcting potential issues during the initial review phase and FAI process

Execute various scientific DOE to classify the significant factor/s impacting product integrity. Develop corrective actions and projects to implement process control to improve yield and reliability and meet customer product quality requirements

Programming of ERSA selective soldering equipment, development of SMT and wave solder profiles, programming of screen printing and pick and place equipment

Assist management in manufacturing decision-making information by calculating labor and material costs, reviewing production schedule per priorities and estimating future requirements

Acting as an Operational Excellence Leader in conducting and managing process capability study on production line

Perform manufacturing documents (ESP) per Ducommun Quality Management system

Manufacturing Process Engineer III (April 2011– July 2013)

Cyberonics Inc, Houston TX

Cyberonics, Inc. pioneered the Vagus Nerve Stimulation (VNS Therapy) System, a Class III Active Implantable Medical Devices Manufacturer for the treatment of Epilepsy and Depression

Assessed process capabilities, prioritizes process improvement opportunities, and innovates and implements process improvements on platform or derivative projects for SMT Manufacturing line.

Ensured proper documentation is completed to meet quality systems requirements. (e.g., BOM’s, Routers, FMEA’s, etc.)

Executed IQ, OQ and PQ phases for manufacturing line equipment and wrote applicable validation protocols and reports.

Working knowledge of non-conformance and CAPA Quality system per 21 CFR 820.100

Performed manufacturing documents change orders (DCOs) per Cyberonics Engineering Change Management system

Applied technical knowledge to innovate, design, and develop processes, procedures, tooling and/or automation.

Planed, organized, and conducted all aspects of technical reviews.

Trained and/or provided work direction to technicians and engineers and manufacturing personnel when required as part of a validation.

Process Engineer (Jan 2008 – April 2011)

Benchmark Electronics Inc, Angleton, TX

BEI – Contract Manufacturer – High Mix Low Volume: Provides specialized engineering services including product design, PCB layout, prototyping and test development.

Acted as Lead Process Engineer responsible for analyzing, developing and implementing optimum Oven profile for all PCBA’s which lead to increased overall yield and improved reliability

Experienced in developing the entire process flow of PCBA’s from Kitting to final inspection, including Quality parameters and QC check points

Actively responsible for Bare Board and Assembly review of boards for customers before NPI build.(using Valor Trilogy software)

Troubleshoot assembly issues on the production floor

Responsible for eliminating/minimizing process related issues during NPI builds and providing post built reports for the same to the customer

Implemented DMAIC methodology to reduce the amount of BGA rework

Developed a process for re-balling BGA’s in-house which resulted huge cost savings on critical assemblies using expensive BGA’s

Involved with Failure Analysis on customer returned (RMA) boards

Recommended the Im-Ag surface finish for ENIG PCBA to overcome the Black pad issue which lead to increase overall yield

Modified Press fit and ICT fixtures to reduce the amount of mechanical stress under BGAs that was causing Pad Cratering issue, which resulted in increased yield and reliability

Provided a solution for Pad Cratering issue under POPs by changing PCB material, underfill POPs and by using stiffener to reduce the amount of scrap and improve field reliability

Project lead for the implementation of high temp (HMP) soldering process for oil and gas industries

Active team member in the process of reducing the amount of scrap in MRB

Managed and established process for transferring product from another facility by making necessary changes to establish an optimum process flow as well as mitigate associated risk

Responsible for initial review of process for advance/complex packages (POP-multiple stacked BGA’s, PGA’s, socket BGA’s)

Over 7 years of experience in training process technicians and operators

Experienced in ordering critical parts Stencils and SMT Pallets after reviewing and analyzing complex assemblies

Project lead for evaluating the performance of different Pb-Free solder pastes to reduce the amount of usage cost without compromising quality and affecting lead time

Graduate Research Associate (Jan 2006 – Dec 2007)

Center for Electronics Manufacturing and Assembly (CEMA), Rochester Institute of Technology (RIT), Rochester NY

Investigated the influence of various parameters in minimizing the void formation in Quad Flatpack No-lead (QFN) assembly using the Lead-Free Solder Alloys manufactured by Indium Corporation of America.

oFormulated DOE to determine the influence of the various parameters related to the PCB, print process and reflow, in minimizing void formation (Response) and correlation of voiding with thermal resistance with QFN devices.

Conducted DOE to test the performance (under stencil cleaning efficiency) of stencil cleaning paper manufactured by Microcare Corp.

oAnalyzed the cleaning performance of two different stencil cleaning papers on eleven factors and conducted runs based on classical DOE treatment combinations

Graduate Teaching Associate (Mar 2006 - Feb 2007)

Manufacturing Automation and Control Systems, RIT

Designed and developed the course material for “Manufacturing Automation and Control Systems” and Supervised the laboratory experiments

Trainee Engineer (Jan 2005 – Jun 2005)

INTELTEK Automation Pvt. Ltd, India

Integrated the electro-mechanical drives with the CNCs and SPMs controllers by CNC coding and PLC (Programmable Logic Controller) programming. Calibrated the CNCs and SPMs and retrofitted them if needed

Please Note: References available upon request.



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