Omkar Vaishampayan

+1-949-***-**** ac4px2@r.postjobfree.com omkarv92

Summary ”Looking for full time opportunities in Mechanical/ Thermal Engineering domain”

• Worked as Thermal Engineering Intern at NVIDIA in Summer 2017 in Shield Hardware Dept.(Consumer Electronics division)

• Working as Graduate Student Researcher in Nano Thermal Energy Lab at UC Irvine.

• Worked as Quality Assurance Engineer in CATIA R&D in Dassault Systemes.

• Worked in TATA Motors as a Summer Intern in 2013 with projects in Central Processing Engineering departments.

• Lead Braking and Analysis teams for SAE SUPRA 2014 college level competition. Education

University of California, Irvine M.S. in Mechanical Engineering Sep 2016 - Mar 2018

• Courses: Micro-nano conduction heat transfer, Multi Phase Heat Transfer, Microfabrication, Linear Algebra University of Pune B.E. in Mechanical Engineering Aug 2010 - May 2014

• Courses: IC Engines, Production Technology, Heat Transfer, Manufacturing Processes, Automobile Engineering Skills

Computer Skills

• ANSYS Icepak, ANSYS Fluent,Python 3.0, LabView, Solidworks, MATLABR2016b,MicrosoftOffice,3DExperience, CATIA, COMSOL, AutoCAD, Wildfire Pro-E(Creo 2.0), Altair Hyperworks Lab/Test Skills

• Instrumentation, Thermocoupling, DataAcquisition(DAQ), Benchmarking, Prototyping, Airflowmeasurements,Acoustic testing, IR Imaging and analysis

Experience

NVIDIA Santa Clara, US

SUMMER INTERN- MECHANICAL THERMAL ENGINEERING INTERN Jun 2017 - Sept 2017

• Performed baseline thermal cycling tests on next generation Jetson modules for selection of thermal interface materials. Iden- tified few materials with high performance and promising reliability.

• Fabricated and tested upcoming Shield devices for thermal performance with mockups and prototypes.

• Benchmarked GPUs for the purpose of repeatability.

• Automated the thermal cycling process.

• Worked on different cooling solutions such as heat pipe, vapour chamber, heat sink, fans and blowers. Dassault Systemes Pune, India

QUALITY ASSURANCE ENGINEER-CATIA RESEARCH AND DEVELOPMENT Jan 2015 - Jul 2016

• Provided support for 4 applications namely Sheetmetal Design, Sheet Metal Hydro-formed, Bent Part Design,and Structural Packaging Applications, all from CATIA.

• Tested apps using industrial models. Tested packaging for market levels of 3DExperience and CATIA. Projects

Reduction in thermal conductivity of nano-porous material by modified arrangements Irvine, CA, US RESEARCH PROJECT Nov 2016- Jun 2017

• Analyzed lattice thermal conductivity of nano-porous material and reduced it by more than 18% using Monte Carlo Ray Tracing Algorithm in MATLAB and confirmed the results using Finite Element Package.

• Goal is to fabricate nano-materials with high figure of merit which can be later integrated in electronic applications Thermal analysis of low dimension material transistor and its application Irvine, CA, US COURSE PROJECT Dec 2016- Mar 2017

• Performed steady state thermal analysis of transistors of low dimension material using ANSYS.

• Compared and proposed high efficient 2D transistor models with critical assessment with respect to their applications Thermal modeling of steady state heat transfer by conduction and convection Irvine, CA, US COURSE PROJECT Sep 2016- Dec 2016

• Developed a MATLAB program to analyze heat transfer by finite difference method using energy balance method on nodal net- work for 2D rectangular objects displaying the temperature profile as contour.

• Included the ability to accept temperature function, convection, and constant heat flow as boundary conditions. Automotive thermo-electric generator Pune, India

UNDERGRADUATE CAPSTONE PROJECT Aug 2013- May 2014

• Designed, modeled, and fabricated the generator using thermocouple network which utilized exhaust waste heat of automobile to produce electricity. Performed thermoelectric analysis of the model using ANSYS Thermal Electric.

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