MAHESH PALLAPOTHU

682-***-**** ac4lwr@r.postjobfree.com https://www.linkedin.com/in/mahesh-pallapothu-a6220212a Education:

Master of Science (M.Sc.), Mechanical Engineering G.P.A: 3.6/4 The University of Texas at Arlington

Thesis Title: Reliability Assessment of Solder Joint Interconnects of BGA Package-Megtron series under Power Cycling

Bachelor of Technology, Mechanical Engineering G.P.A: 3.6/4 Jawaharlal Nehru Technological University

Technical Skills:

Modelling Tools: SolidWorks, CATIA V5, Auto CAD, Creo Simulation Tools: ANSYS Workbench, ABAQUS, Basic Knowledge of Icepack. Instrumentation: Thermo-Mechanical Analyzer(TMA), Dynamic-Mechanical Analyzer(DMA), Instron Micro Tester, Environmental Chamber and Conventional Machining Operations Areas of Interest:

Product Design & Development, Finite Element Analysis (FEA), Failure Mode Effect Analysis (FMEA), Material Characterization, Chip Package Interaction (CPI), Design of Experiments (DOE), Design for Manufacturing(DFM), Design for Reliability (DFR).

Experience:

Graduate Research Assistant-EMNSPC Laboratory, University of Texas at Arlington

• Extensive computational analysis using 3D CAD tools and FEA on ANSYS Workbench.

• Material Characterization of the Printed circuit board using TMA, DMA & UTM according to ASTM standards.

• Solder Joint Reliability assessment of BGA, WCSP under thermal cycling and power cycling (JEDEC Std.).

• Achieved 30% better reliability of Megtron-6 compared to FR-4 PCBA under Power Cycling National Thermal Power Corporation, Ramagundam (Internship)

• Studied the design and working of a boiler and its pressure parts.

• Extensively worked to reduce the leakage rate from a valve.

• Submitted a detailed report on the boiler and the valves being used in the power plant. Indian Railways, Hyderabad (Internship)

• Assisting senior technicians in the periodic maintenance and overhauling of the locomotive engine.

• Studied departmental work processes and working of the braking system. Projects:

Comparative study on Reliability of a WCSP under the influence of semielliptical crack.

• Performed thermal cycling test on WCSP of 0.7mm and 1mm thickness FR-4 board.

• Examined the point of failure of the critical solder ball and modeled a semi-circular crack.

• Examined the rate of propagation of crack and calculated the characteristic life of the PCBA.

• A similar study has been done with a BGA package on the Megtron-6 printed circuit board. Evaluation of Maximum Temperature of a Substrate board using Green’s Function Solution Method.

• Theoretical study of the maximum temperature of the substrate board mounted with two heat generating chips.

• Studied the effect of variation of the convection co-efficient.

• Compared the theoretical results with the simulation results from ANSYS WB. Finite Element Analysis & obtaining failure Parameter of Retaining ring and compression reed valve

• Design and model retaining ring and compression reed valve using ABAQUS and analyzed pressure impact on it.

• Achieved the mesh independent solution by mesh sensitivity analysis.

• Suggested necessary changes in the material used and the designed to reduce the stresses developed. Birth to death analysis of a solar dryer using the DFM Techniques.

• Built the House of Quality(HOQ), Morphological chart, Flow charts for Physical and Functional Decomposition, Bill of Materials (BOM).

• Organized team meeting at different stages of the project to review the suggested and most feasible design.

• Performed Failure Mode Effect Analysis (FMEA), Cost, Reliability, Tolerance, DFM and DFA Analysis. Awards:

• Recipient of Kelcy-Warren Fellowship for the academic year 2016-2017.

• Event Officer for Surface Mount Technology Association (SMTA) Student Chapter at UT Arlington.

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