Technician Test

Terry Tucker

***********@*****.*** 408-***-****

Objective:

To obtain employment with a dynamic and progressive company, where I may utilize my technical, creative and organizational skills to help meet and exceed all business goals and objectives.

Summary:

Highly resourceful and organized technician with years of proven reliability testing, IC production and all facets of backend of line operations experience. I offer a versatile skill-set with verifiable results in various capacities within the high technology sector. Experience:

Sr. Test Technician

Qualcomm Technologies Inc. CDMD Technology

2016–2017

1. Performed a variety of ATE Testing

2. Performed chipset evaluating based upon engineering specifications 3. Knowledge of the set up and troubleshooting of Delta Edge Synax, Advantage ATE Handlers and Teradyne System.

4. Troubleshoot complex electrical circuits as well as mechanical equipment relating to the testing of Chipsets.

5. Work closely with the engineering staff to perform test on Chipset and provide analysis of test results. Sr. Process Technician/Lead

Qualcomm MEMS Technologies Inc

2005–2016

1. Responsible for performing daily inventory of materials. 2. Performed all manual/auto IMOD Testers: Qpit, Cpit, Burn-in test, Paint-Chip 3. Measurement, Spectrum Measurement and Conditioning/electrical test. 4. Wafer Glass Scriber/ Singulation (TLC Phoenix 600). 5. Assist and completed multiple Engineering Design/Projects. 6. Wafer Release (XEF-03, XEF-04, ULV-01 Load and Unload) Bake Oven (BLUE-M). 7. Wafer tester (Electro glass 2001X).

8. Wafer Encapsulation (Lantech Tool).

9. Training all incoming New

Reliability/QA Technician

Nano Measurements, Inc.

2004–2005

1. Performed a variety of electrical and environmental stresses on IC Microchips and recorded the stress results for customer review. o These stresses include Hast, Pressure Pot, Temp Cycle, Humidity stresses, E.G. 85/85), Burn-in life test, Pre-Conditioning (E,G Reflow Chamber) and others. 2. Operated and performed profiling on the chambers: used for these stresses. Include Express Test environmental Chambers, Adec burn-in ovens, Aehr test burn ovens, Heller 1700 Convection Reflow Chamber and others.

3. Used Burn-in Board Testers to check the board and to confirm proper device functionality before loading into stress chambers.

4. Routinely performed scheduled preventative maintenance on the stress chambers used for reliability stresses.

Reliability/QA Technician

Philips Semiconductor

2000–2004

1. Performed ATE testing on all stressed parts at each reading points during the require stresses, and recorded the test results. This included many different types of Microchips.

2. Performed test set-ups needed for ATE testing. This included the Handle programming and set-ups troubleshooting of various Handlers such as SYNAX, MCTs, S21 and STS.

3. Interfaced well with a variety of Internal Customers with stress results and testing. Test Floor Operator / Setup Technician / Lead

VLSI Technology, Inc.

1985–2000

1. Knowledgeable with all wafer sorter and final test handler's set-ups and operations including KLA, Electro-glass (Model 2001X) and Trigon

2. Knowledgeable with all ATE Test Systems set-ups and operations including STS- 120, STS-256, SENTRY-21 and TEKRONIX.

3. As set-up technician I assisted other technician when set-up troubleshooting was needed. 4. As test floor lead I assigned the testing responsibly for each operator for that shift, coordinated all testing and allocated the available testers in order to meet the Scheduled Production needs according to the current Lot Priorities. Production Test Technician / Supervisor of ATE Test Floor Gould. American Microsystems, Inc (AMI)

1973-1985

12-years as Production Test Technician: as part of the Manufacturing Department 1.5-years as Production Test Supervisor: as part of Manufacturing Department. Education:

Merced High School

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