Engineer Design
Resume:
Venkatesha Prasad. A
*********@*****.***
Skpe:venkateshp4
Communication Address
J.P Nagar 4th Phase
Bangalore -560078
Karnataka.
Permanent Address
3-25H,Kannerthota road
Kolya second stage
P.O Kotekar
Mangalore-574022
Karnataka
Personal Information
Date Of Birth 01.02.1981
Sex Male
Nationality Indian
Marital Status Married
Father Name Krishna Bhat.Y
Languages Kannada, English,
Known Hindi, Malayalam
Career Objective
ØSeeking a position to utilize my skills and abilities in the embedded Technology or High speed board design industry that offers security and Professional growth while being resourceful, innovative and flexible.
Work Experience (14 Years 11 months)
Period : May 2008 - Present
Company Name: iWave systems Technologies Pvt Ltd
Designation : Senior Engineer
Field of Work : PCB Layout Designing
Period : April 2006 – May 2008
Company Name : Shyam Jewels Pvt Ltd
Designation : System Administrator
Field of Work : Hardware & Networking,Maintanance
Period : March 2004 – March 2006
Company Name : Telecom Mech
Designation : Service Engineer
Field of Work : Servicing of land and cell phones
Period : November 2002 – February 2004
Company Name : K.S.E.B(Contract basis)
Designation : Testing Engineer
Field of Work : Calibration of Electronic Energy Meters
Technical Skills
Layout tools(Expert):Allegro Cadence versions 16.0,16.2,16.3,16.6.17.2
Schematic tools: Orcad versions 16.0,16.2,16.3,16.6,17.2
Simulation tool:Hyperlynx 9.3
Design Analysis:Crosstalk analysis,SI analysis,EMI/EMC analysis,DFM analysis
Cam Tools:GC-Preview,View mate,CAM-350,Gerbver2.0
Other known Tools:Altium 15.2,Mentorgraphics Pads 9.3
Operating System: Windows XP,Windows 7
ØX State Board in 1996
79 %
S.A.P.High School Agalpady,
Kasaragod,
Kerala.
.
Relevant Experience(9Years 6 Months)
Experience in complex multi-layer, high speed/multi-clock, multi-processor, RF/Mixed signal and proven design methodologies to ensure first pass success
Experience in HDI technology using micro, buried and blind vias
Experience in maintaining of signal integrity, power, heat dissipation (thermal compliance), and EMI/EMC compliance
Experience in developing of footprints database by following IPC 7351B level A/B/C
Independent designing of PCB’s by maintaining SI/PI/EMI/EMC/DFM/DFA/DFT
Working with diverse team
Present job description
The Responsibilities in present company are
Creation of component libraries using datasheets adhering to IPC 7351 standard
Netlist creation using schematics given by designer and correction of errors if any
Component placement according to signal flow
Setting up constraints and signal routing according to guild lines
Power plane designing according to best return current path
Back annotation,silk alignment,putting logos of company and customer
DRC check,over all design review and footprint check
Gerber file generation and review
Checking queries of fabvendor,assembly vendor
Development of PCB layout from schematics. Gerber generation with detailed fabrication guidelines for manufacturability
Communication with layout engineer for better understanding
Involving in designing of complex/dense/challenging layouts
Guidance to fresher’s to get better work knowledge
Maintenance of documents to update database
Successful involvement in 70+ designs from 2 layers to 18 layers for various applications like Medical, Avionics, Network, Automotive, Consumer, Multimedia etc.
Glass Main board(Qualcom APQ8096 based Processor)
Board size:56x50mm
Total No of components:681
Total No of nets :472
Total No of connections:2429
No of micro vias :2530
No of buried vias :669
Through hole vias :170
QUALCCOM APQ8096 based SMARC SOM(System On Module)
Board size:82x50mm
Total No of components:712
Total No of nets :681
Total No of connections:2429
No of micro vias :2530
No of buried vias :669
Through hole vias :170
Academic Profile
ØDiploma Electronics in 2002
78.6 %
Govt. Polytechnic Periye
Kasaragod
Kerala
ØXII State Board in 1998
61.33 %
H.H.S.I.B.S Higher Secondary School Edneer
Kasaragod,
Kerala
ØX State Board in 1996
79 %
SAPHS Agalpady,
Kasaragod,
Kerala.
MAJOR PROJECT DETAILS
Description
This is 10 layer pcb based on HDI Type 2 Technology. The processor is POP package, DDR4 is soldered above processor. The major interfaces are RF,GPS,CSI,DSI,USB2.0,PMIC,Battery pmic,pcie,audio codec,SD card interface,,HDMI,Emmc,USB3.0.This board contains various fine pitch BGAS
Description
This is 10 layer pcb based on HDI Type 2 Technology. The processor is POP package, DDR4 is soldered above processor. The major interfaces are RF,GPS,CSI,DSI,USB2.0,PMIC,Battery pmic,pcie,audio codec,SD card interface,,HDMI,Emmc,USB3.0.This board contains various fine pitch BGAS
Genreic Q7 Carrier board
Board size:120x120mm
No of components:910
No of nets :872
No of connections:2481
No of vias :2026
i.MX 6Q Based SOM
Board size:67.6x37mm
No of components:554
No of nets :534
No of connections:1899
No of vias :1434
Renesas R8A77430 Based SOM
Board size:70x70mm
No of components:824
No of nets :726
No of connections:2711
No of vias :1902
Renesas 8A77420HA01BG Based SOM
Board size:70x70mm
No of components:1001
No of nets :820
No of connections:3197
No of vias :2101
Description
This board is 8 layer pcb carrier card for some SOMs.The various interfaces are PCIe,USB2.0,USB3.0,JTAG,HDMI,GB ETHERNET,SATA,CAN,LCD,LVDS,SD Card,Mini PCIe,AudioThis board is designed by taking care for CE Certification.
Description
This is 10 layer pcb som card for i.MX6Q processor. The board supports PCIE, DDR3,, Emmc,RS232,HDMI,LCD,LVDS,PMIC. USB high speed, LCD, SATA and SD card interface.
Description
This is 10 layer pcb som card for Renesis R8A77430 processor. The board supports PCIE, DDR3, emmc, RS232, HDMI, LCD, LVDS, USB high speed, LCD, SATA and SD card interface. This board along with generic carrier card passed CE certification
Description
This is 10 layer pcb som card for Renesis R8A77420HA01BG processor. The board supports PCIE, DDR3, Emmc, RS232, HDMI, LCD, LVDS, USB high speed, LCD, MLB, SATA and SD card interface. This board along with generic carrier card passed CE certification.
Renesas 8A77450HA01BG Based SOM
Board size:67.6x37mm
No of components:567
No of nets :508
No of connections:1700
No of vias :1291
Renesas 8A77470HA02BG Based SOM
Board size:85x56mm
No of components:711
No of nets :511
No of connections:2079
No of vias :1236
Description
This is 10 layer pcb som card for Renesis R8A77450HA01BG processor. The board supports DDR3, emmc, RS232, HDMI, LCD,Ethernet both GB and RGMII, LCD and SD card interface. This board along with generic carrier card passed CE certification.
Description
This is 10 layer pcb som card for Renesis R8A77470HA02BG processor. The board supports DDR3, emmc, RS232, HDMI, LCD, LVDS,Video,GB Ethernet and high speed Ethernet, USB high speed, LCD, MLB,SATA,JTAG and SD card interface. This board along with generic carrier card passed CE certification.
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