RESUME

SAGINATHAM VINOD KUMAR

Email: ac2u1r@r.postjobfree.com

Mobile: +1-262-***-****.

Key Expertise

Bachelor of Electrical and Electronics Engineer with 9.2+ Years of experience in Embedded Hardware, PCB Design, Development & testing. Worked up to 3Gbps Signal Design & High end PCB Manufacturing technologies Like Blind, Buried via and Back Drilling concepts.

Experience Summary

Currently Working as a Hardware Engineer in Larsen & Toubro Technology Services, Mequon from June2017 to Tilldate.(Working on Client location)

Currently working as a Senior Systems Engineer in Larsen & Toubro Technology Services, Mysore from April 2012 to June2017.

Worked as Design Engineer in Sumargsai Technologies Pvt Ltd, Secunderabad from April 2011 to April 2012.

Worked as Design Engineer in Intemo Systems Limited, Hyderabad from November 2009 to April 2011.

Worked as Assistant Engineer in Elite Circuit Technologies, Hyderabad from June 2008 to October 2009.

Work Summary

Good expertise in all Interfaces like USB, SATA, LVDS, VGA, Memory (DDR2, DDR3, SDRAM) USB, San Disk Module, PCI, PCIe, SDRAM, e-SATA, Ethernet, I2C, SPI, CAN, LIN and Debug Ports.

Knowledge with Signal integrity Pre – Post simulation and Power Integrity Simulation.

Experience in all phases of PCB development and testing, including Requirements analysis, Layout Planning Component Placement, Routing and Manufacturing Process.

Experience in Stack up selection for High Speed design, Calculated Controlled Impedance traces for interfaces and via selection for High speed signals.

Experience in Design, Development and validation of High Speed Digital Design and Knowledge of IPC standards & IEEE.

Experience in all stages of Hardware Development Life Cycle (PDLC).

Resourceful in handling Design & Development activities, including liaising with client for understanding specifications and requirements, selection of appropriate technologies.

Experience in Client Communication and Status Reporting. Expert in figuring out/understand needs, focus on the important/real issues, translating them into technical actions and implementing in designs.

Good design experience in circuit boards containing FBGAs (0.5mm, 0.8mm, pitch BGA), CPLD, QFP and many more different types of components.

Created and maintained PCB component libraries and constraints.

Accustomed to designing PCB's with an awareness of “Design for Manufacturing, Assembly” requirements.

Library creation and maintenance Tool set.

Designing include variety of BGA, CBGA, DBGA, PGA, LCC, PLCC, CQFP, PQFP, RQFP, LQFP, MQFP, TQFP, SOIC, SSOP, TSSOP and all SMT packages.

This includes working closely with many different internal departments and outside contract manufactures.

Skills

Domain

Working in Fire and Security, Industrial Domain for various products like High Voltage and High Current Boards.

Schematic Tools

Altium, Cadence Allegro Design Entry CIS (Orcad Capture), Cadence Allegro Design Entry HDL, Dx Designer, Mentor Graphics Pad Logic, Zunken Cadstar.

PCB Layout Tools

Altium, Cadence Allegro 16X Version, Mentor Graphics Pads, Zunken Cadstar, Mentor Graphics Expedition,Orcad15.7.

Geber Verification Tool

CAM350,CAM Static

Simulation Tools

Pspice, Hyperlynx 7.7,8.1

Mechanical Tool

AutoCAD, Solid Works

Documentation tool

Blueprint-PCB, Micros soft Visio, AutoCAD For Assembly and Fab Drawings Preparation.

Project Details

Project 1:

Project Name

Smart Card Readers

Description

The Smart card readers are a multifunction, all-purpose proximity card reader suitable for all locations requiring a short-range reader. The reader can be connected directly to advisor master RS485 BUS. It configurable through a menu system accessible via the BUS or by Configuration cards Programmed through Titan and smart card programmer. The reader operates from 9 to 14VDC. It has a quiescent current consumption of less than 25mA and less than 80mA when reading cards. Smart Card Readers mainly used for Indoor/outdoor applications.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per mechanical and Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Zunken Cadstar 13.0

Project 2:

Project Name

Concord SB2000Z-Wave Module

Description

The Concord Super Bus 2000 Z-wave Module is a expands panel wireless zone capacity. The receiver is compatible with all ITI 921.42 MHz (crystal and SAW) Learn Mode™ wireless sensors and touchpad. It receives information from wireless sensors and touchpad’s then sends the data to the panel via the Super Bus 2000 digital data bus.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per mechanical and Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

Implementing RF standards

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Mentor Graphics Pads 9.1

Project 3:

Project Name

Advance Display Module

Description

The LCD module shall consist of a twisted nematic (TN) liquid crystal display (LCD) with LED backlight, membrane keypad with indicator lights, dimmable backlight power supply, 8 bit microcontroller, LCD graphics controller, RS-232 transceiver, and interface connector. The LCD glass will connect to the LCD drivers via an elastomeric connector. All remaining electrical components shall be mounted to the 4- layer PCB by a combination of through-hole, surface mount, and chip on board construction. The LCD module shall receive commands from an off board source and will display status information and multilingual messages. The display module will also transmit keypad entry and operating status out through its RS-232 port.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per mechanical and Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Orcad Layout 15.7

Project 4:

Project Name

Trident IO Board

Description

The Trident electronic control system is intended to be a high performance, cost effective, digital control platform to be used on chillers and heat pumps. It will incorporate and augment the feature set of the existing Pro-Dialog family of control products.

The Trident Control System shall consist of:

1. UI Board (Display board)

2. I/O Boards (TIOB or other boards)

The control board for the Trident Electronic Controls. It does not have I/O sensors. It shall be used mainly with one or more TIOB and eventually with existing I/O board for optional functions for chillers. The TIOB will contain the electronics required to manage sensor readings and drive actuators.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per mechanical and Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

High current PCB design.

Implementing Creepage and Clearance as per UL Standards.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Orcad Layout 15.7

Project 5:

Project Name

Integrated Starter Module

Description

The scope of The Integrated Starter Module(ISM) shall be a microcontroller-based device, which shall be capable of processing 3-phase voltage and current, provide necessary motor protection and starter control. The ISM shall also monitor discrete inputs.

The objective of the Project is to providing the Obsolescence Management with the effective design to eliminate the field issues and meet the new accuracy requirements.

Role & Contribution

Role : Layout Design

Responsibilities:

Designing new generation Integrated Starter Module as per the requirement.

PCB Stack up selection as per constraints.

Coordinating with Mechanical, hardware team with technical design issues.

Track width calculation as per parameters and material selection as per the requirements.

Implementing with different clearance and creepage requirements.

Conversion of Existing design & Updating design from Orcad Layout to Cadence allegro

Library Maintenance of Cadence Allegro.

Tools

Cadence Allegro 16.3

Project 6:

Project Name

Starfire IO Board

Description

The StarFire2 electronic control system is intended to be a high performance, cost effective, digital control platform to be used on chillers and heat pumps. It will incorporate and augment the feature set of the existing Pro-Dialog family of control products.

The StarFire2 Control System shall consist of:

1. Touch Pilot (color touch screen web server controller)

2. I/O Boards (SIOB or other boards)

The Touch Pilot is the control board for the StarFire2 Electronic Controls. It does not have I/O sensors. It shall be used mainly with one or more SIOB and eventually with existing I/O board for optional functions for chillers. The SIOB will contain the electronics required to manage sensor readings and drive actuators.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per mechanical and Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

High current PCB design.

Implementing Creepage and Clearance as per UL Standards.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Orcad Layout 15.7

Project 7:

Project Name

PCMCIA USB adapter

Description

This PCMCIA USB adapter is primarily intended to address obsolescence issues with the existing PCMCIA cards currently used to program container and truck/trailer units. Within the container segment, these cards program the Micro Link 3 (ML3) controller. In Truck/Trailer, the cards are used on the Advance Microprocessor (Advance) The PCMCIA Flash cards, used for Advance are obsolete. The PCMCIA SRAM PC Cards, used for ML3 are not currently obsolete but expected to go end of life in the near future, posing a risk of not being able to provide support to the customer.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per mechanical and Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Orcad Layout 15.7

Project 8:

Project Name

Supra Relay Board

Description

The Relay board acts as a slave for microprocessor board which holds the control algorithm of truck refrigeration system. Power from alternator/battery is distributed to each controls of truck refrigeration system using relay board based on the control signals from microprocessor board.

Role & Contribution

Role: PCB Layout

Responsibilities:

PCB Stack up selection as per Placement and Routing.

Implemented Reverse Engineering techniques in Layout Design.

Track width calculation as per parameters and material selection as per the requirements.

High current PCB design.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Implementing all the standards.

Tools

Cadence Allegro 16.5 & AutoCAD

Key Achievements

Received Best Team award.

Project 9:

Project Name

Multi-Function Display

Description

The scope of The Supra DMD is a user interface unit remotely mounted in the truck cabin Din slot. It includes a LCD display and keypad. The keypad & display serve to provide user access and readouts of SUPRA controller information. The information is accessed by keypad selections and viewed on the display.

Role & Contribution

Role : Layout Design

Responsibilities:

Planning floor plan for effective component Placement, Routing Constraint settings in Expedition.

Coordinating with Mechanical, hardware team with technical design issues.

Track width calculation as per parameters and material selection as per the requirements.

Library Maintenance of Cadence Allegro.

Tools

Cadence Allegro 16.5

Project 10:

Project Name

Power Flex

Description

Low voltage inverter consists of two different PCB assemblies (Inverter control board and power board).

1.Inverter Control board: Inverter control board provides PWM gate drive signals to Inverter power board. Other functional components of Control board includes DSP, Memories, Hall Effect sensors for current monitoring, encoder interface, CAN interface, safety chain Interface and local power supply.

2.Inverter Power board: Inverter Board consists of a 3 phase MOSFET bridge (U, V and W phases), gate drive circuits, Power Supplies for gate drive and DC capacitor bank.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

High current PCB design.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Cadence Allegro 16.6

Key Achievements

Received Gold Team Academy Award.

Project 11:

Project Name

NDTP Display Board

Description

The scope of the project is to design NDTP Display module that is to be used as user interface to NDTP refrigeration control systems through CAN bus. The role of the NDTP Display is to start/Stop the unit, monitor the Refrigeration temperature, to adjust the set-point, status of the refrigeration unit, alarms, to show operating time and cooling mode, launch manual defrost and to configure units.

The design product shall be single mechanical enclosure, Keypad for the Supra DMD and NDTP display.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per mechanical and Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Cadence Allegro 16.5

Project 12:

Project Name

B787 SPDU Power Module Redesign

Description

The purpose of the project is to re-design 4-variants of the B787 Power Modules to improve reliability and to reduce costs.

Activities includes the layout update, analysis update and test activities of the B787 Power Modules.

The objective is to improve reliability along with cost reduction.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

High current PCB design.

Implementing Constraints manager settings.

Tools

Cadence Allegro 16.6

Project 13:

Project Name

Power Flex Extended TRL

Description

The scope of the project is to redesign Inverter Control board, Inverter Power board and current sensor module to improve reliability and to reduce Size and costs. Activity includes Layout design and analysis. The objective is to improve reliability along with cost reduction.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

High current PCB design.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Cadence Allegro 16.6

Project 14:

Project Name

Gate Drive Interface Board 2 (GDIB2)

Description

The “GDIB2” project objective is to design the Gate Drive Interface Board2 (GDIB2) to enable Global Drive Control Board (GDCB2) driving the Carrier Power sections thru the SEMIKUBE GB11 gate driver board thereby controlling the compressor motor. The new GDIB design shall be verified by prototyping and integration testing.

The project consists of analog modules, digital modules, communication interfaces and power supply modules. The project objective includes, Requirements collection, Design calculations and simulations, completing of schematics, coordinating PCB layout, developing prototypes and testing.

Product Details: GDIB2 has analog and digital signal conditioning hardware to interface motor current, AC line voltage/current sensors, and temperature sensors. It has voltage translation circuits for inverter, converter PWM signals. It also provides power supply to GDCB2, SEMIKUBE GB11 gate driver boards. GDIB2 has RS485 and CAN physical layer for external communication.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

High current PCB design.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Cadence Allegro 16.6

Project 15:

Project Name

MCRL Test Rig

Description

The “MCRL Test Rig” project objective is to simulate the elevator hoist way in LabVIEW based environment. The vehicle movement in hoist way can be configured and simulated by providing the user inputs in LabVIEW based GUI. It can simulate the movement of two vehicles simultaneously both up and down directions.

The project consists of analog modules, digital modules, communication interfaces and power supply modules. The project objective includes, completing of schematics, preparing PCB layout, developing prototypes and testing.

Product Details: Developing hardware interface boards for analog and digital sensors. There are 5 boards in this project, Analog hall-effect sensor board, SPI interface board, digital hall-effect sensor board, CAN bridge board and control board. All interface boards interfaces the LabVIEW simulated sensor signals with control board after necessary signal conditioning.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Mentor Graphics Expedition

Project 16:

Project Name

Vibration Sensing Board (VSB)

Description

The Objective of Vibration Sensing Board “VSB” is to detect faults in elevator system. Faults are detected using vibration data analysis, envelop detection is used for cyclic vibration detection. Decision are done on time domain and frequency domain analysis. Persistency block implemented on data collected over period of time to indicate severity of fault. The design shall be verified by prototyping and integration testing.

The project consists of analog modules, digital modules, communication interfaces and power supply modules. The project objective includes, Requirements collection, Design calculations and simulations, completing of schematics, coordinating PCB layout, developing prototypes, Module testing and Pre-compliance testing.

Product Details: Vibration sensing board uses STM32 microcontroller platform and has the following interfaces: Vibration sensor, EEPROM, DIP switch Relay control RS232 and USB. 5V board supply is derived from input voltage ranges from 20V to 190V. 3.3V LDO is used form controller power supply.

Role & Contribution

Role: Layout Design

Responsibilities:

PCB Stack up selection as per Placement and Routing.

Track width calculation as per parameters and material selection as per the requirements.

Implementing IPC and client standards.

High current PCB design.

Choosing appropriate PCB technologies like Surface finishing material, Solder mask selection to make PCB & assembly Cost Low.

Tools

Altium

Educational Qualification & Certifications

B.Tech

Electrical and Electronics Engineering, Completed in 2008

Personal Details:

Name: S VINOD KUMAR

Father Name: S VENKATA SUBBAIAH

Date of Birth: 01-06-1985

Permanent Address: D/NO 9/127, Kothapeta (Village), Proddatur (Mandalam), Kadapa-516361, Andhra Pradesh.

Present Address: N113W15583,Apartment 5, Francese Dr,Germantown,WI53022.

Language’s Known: ENGLISH, HINDI, AND TELUGU

Passport Details:

Passport Number: H8155795

Date of Expiry: 16-03-2020

Visa Details:

Visa Type: H1B

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