Allen G. Ramos

Present Address: No. ***, Zhonghua Road, Section 1F

Chung-Li, 320, Taiwan, R.O.C

Cell. No. +886-***-***-***

Permanent Address: Blk5 Lot14 Treelane 3-F Bayan Luma

Imus, Cavite PHILIPPINES +63-46-471-****

E-mail Address: ac2pwb@r.postjobfree.com

Taiwan Permanent Certificate Holder (APRC)

Education:

University Of Perpetual Help Rizal

Las Pinas, Manila

Degree in Electrical Engineering

Graduated School Year 1996 - 1999

Adamson University

Ermita, Manila

Degree in Computer Engineering

Under Graduated School Year 1989 - 1992

Cavite National High School - Secondary Diploma

Cavite City

Graduated School Year 1985 - 1989

Dalahican Elementary School - Elementary Diploma

Cavite City

Graduated School Year 1979 - 1985

Basic training Coarse @ Semiconductor Industry

Basic ATE operation and maintenance

Test Methodology

Semiconductor Test Process flow

ISO 9000

ISO 14000

Basic SPC

Personal Leadership

ESD Handling

Clean room Requirements

Housekeeping / 5S

Symtek Hadler Operation Maintenance

Aseco 130 Operation and Maintenance

Epson Handler Operation and Maintenance

STS/KTS System Maintenance and Trouble

Shooting

Scanning Acoustic Tomography Operation

Scanning Electron Microscopic

Energy Dispersive X-ray Micro-analysis

Time Domain Reflectometry

Auto Curve Tracer (Mega Trace)

ELITE (Enhance Lock-In Thermal Emission)

Experience (Detailed Responsibilities):

ASE GROUP Chung-Li

550,Chung-Hwa Road, Section 1Chung-Li, 320, Taiwan, R.O.C

June 15, 2016 - Present

Senior Failure Analysis Engineer

DETAILED RESPONSIBILITIES:

Technical Failure Analysis Engineer focus on Customer return, RMA samples, Operation Low-yield devices, Reliability fail condition and New Package.

Failure Analysis Engineering for advanced semiconductor IC packages on both Leadframe, Substrate, FCBGA, FCCSP, new Develop IC Packages (SIP), MEMS, Sensor devices and Multi Stacked Dices Packages.

Design a failure analysis workflow for failure modes into failure analysis and provide expert input on root cause, its relevance to the field and the best path in terms of addressing the finding with the design teams and countermeasure validation.

Collaborate with vendors and apps teams to determined equipment upgrade needed for new develop IC packages.

Technically Failure Analysis Trainer for new and lower rank FA Engineers.

Technical Liaison Failure Analysis Engineer for customer Audit and Company Visit.

Work with other teams to identify and resolve issues for quick turn-around-time resolution.

Summarize Failure Analysis Team Report in a weekly and monthly basis.

Maintain FA lab equipment (THEMOS – ELITE) as required and ensure internal staff are properly trained.

Siliconware Precision Industries Co., Ltd.

No. 123, Section 3, Da Fong Road Tantzu County, Taichung City, Taiwan, R.O.C.

July 01, 2002 - June 08, 2016

Senior Failure Analysis Engineer

DETAILED RESPONSIBILITIES:

Failure Analysis Engineer that support both Package (IC level) and On-Board (SMT Level) Gross Functional Failure mode.

Basic knowledge on Reliability

Physical Analysis expert on Wet and Dry Decapsulation. Advance-know how on mechanical cross-section both Lateral and Parallel Lapping procedure.

Basic knowledge on Die Delayering (Wet/Dry/Lapping) and cross-section using FIB.

New Product or Package support Failure Analysis Engineer reason why could Develop and Enhance New Method and Techniques in finding solution on the observe problem.

Support Gross Functional Reject on both O/S and Function Test Station and Drive Analysis in Finding Defect and Failure Mechanism in Short Time.

Basic Knowledge on Failure Analysis on IC and Discrete Devices at Wafer Level. Basic know-how on using Liquid Crystal as a method of finding Electrical Fault and Issues.

Able to Perform and Handle Failure Analysis Equipment and Machine such like FESEM, SAT (Hitachi and Sonics), SEM/EDS, Laser Decapsulation and Auto Curve Tracer (for electrical fault isolation)

Technically Failure Analysis Trainer for new FA Engineers.

Fault isolation technique using ELITE (Enhance Lock-In Thermal Emission). Equipment use as non-destructive and post destruct thermal hot spot.

ACCOMPLISHMENTS:

Developed Stacked dice package Die Separation Procedure

Developed FA procedure for Surface Mount Units

Promoted as a Senior Failure Analysis Engineer last July 2007

Copper Wire Wet Decapsulation Procedure co-developer

CYPRESS SEMICONDUCTORS, PHILS,

Gateway Business Park, Special Export Processing Zone, Brgy. Javalera, Gen. Trias, Cavite

May 15, 2000 – March 31, 2002

Test Maintenance Engineer

DETAILED RESPONSIBILITIES:

Test maintenance Engineer that maintain, handle and support all Unix-Based ATE Tester such as Credence (DUO, LT 1001, STS) series and Memory Tester such MINATO.

Preventive Test Maintenance Engineer of various Handlers such as Symtek Series like S3050/S340/SKP/S6D40, ASECO 130/200/450 and EPSON HM3500.

Calibrate Semiconductor Test handler or equipment.

Trouble shoot and repair Test handler of equipment

Buy off newly acquire machine or equipment use in semiconductor test site

Test verification and online set-up engineer.

Hardware (Test Logic inter-phased) Trouble shooting Engineer.

Astec Power Inc.

Epza, Rosario, Cavite

november 30, 1995 - may 15, 2000

Failure Analyst/Technician

DETAILED RESPONSIBILITIES:

Power supply/conversation/UPS trouble shooting technical engineer.

Maintained Various Work Bench Equiptment like Digital Multi-tester, Oscilloscope, Digital Load Equipment.

Helps promote line satisfactory and ensure good quality of work by using feedback form on all unit that is being Troubleshoot.

Recommend new Process flow for newly produce package base on the problem encounter during online trouble shooting

Assist line supervisor on how to deal with the Daily workmanship trouble and recommend new flow for better and good quality of work.

Hayakawa Phils. Inc.

Epza, Rosario, Cavite

February 14, 1995 - October 30, 1995

Operator Technician

Maintain and operate machine or equipment use for crimping (crimp connector on the wire).

Set-up own crimping machine or equipment base on the specs or detailed information given.

Troubleshoot minor failure problem encounter on the machine or equipment use to crimp connector on the wire.

Recommend additional upgrade on the machine or equipment use to crimp connector on the wire.

Maintained Various Work Bench Equipment like Digital Multi-tester, Oscilloscope, Digital Load Equipment.

Philips Inc. (Shoe Manufacturing)

Epza, Rosario, Cavite

june 01, 1993 - december 21, 1994

Quality Controller

Daily roving inspection of all shoe mould that would be use for production.

Hourly roving on all shoe sole that is being cook on the mould

Ensure all machine that being use for operation is using their curing time correctly.

Inspection on all sole rubber substance its color and curing ability

Recommend proper way of rubber cocking to lessen rubber scrap page and rubber deformation.

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