Engineer Lab Technician
Resume:
Jeff Riddle
Fuquay-Varina, NC 27526
ac2j3e@r.postjobfree.com
Experience
Line Cook
Triple Barrel Tavern
October 2016-September 2017 (11 months) Fuquay-Varina
• Plate food for presentation and expedite to front of house customers.
• Clean kitchen and turn off cooking equipment for closing.
• Cook food using fryer, grill and flat top.
• Stock refrigerators for dinner and lunch.
Asphalt Lab Technician
TR Vernal Paving
October 2014 – July 2016 (1 year 9 months) Raleigh
• Calibrate and maintain lab testing equipment.
• Test asphalt samples according to DOT specifications to ensure samples meet design criteria.
• NCDOT QMS Level 1 Plant technician certification.
• Perform maintenance on asphalt plant. This includes replacing defective and worn parts, moving material with Bobcat to recycle area, receiving liquid asphalt shipments and greasing bearings.
Lab Technician
S&ME, Inc.
May 2007 – August 2012 (5 years 4 months)Raleigh-Durham, North Carolina Area
• Calibrated testing equipment.
• Tested construction materials (concrete, soil, and asphalt) according to ASTM specifications.
• Achieved Level 1 Nicet certification for soil and asphalt and level 2 for concrete.
• Traveled to job sites to test concrete.
• Traveled to production plants to test asphalt
Staff Engineer
Nitronex, LLC
November 2001 – October 2006 (5 years)Raleigh-Durham, North Carolina Area
• Developed package designs with respect to wire bond shapes and die layout to optimize die performance.
• Programmed die attach and wire bond machines to meet RF design needs. This would involve quick turn builds where the program for each machine would be slightly modified.
• Developed and optimized die attach, wire bond, and dicing processes. This included utilizing DOE methodology.
• Developed UV tape dicing process.
• Installed new packaging equipment.
• Ordered tooling for package equipment. In some cases the tooling would have to be modified based on die dimension changes. I would coordinate the machining work for this.
• Analyzed die attach quality and classified material using thermal imaging, SEM, EDX, KOH etch and SAM.
• Engineer in charge of back-end process from back grinding through packaging.
• Part of team that established business relationships with outsource service suppliers that included semiconductor packaging and reliability testing.
• Wrote SOPs for all packaging processes and dicing process.
• Established maintenance schedules for critical packaging equipment.
• Rebuilt non-functioning components for packaging equipment.
• Ordered and installed mechanical upgrades to equipment.
• Part of teams that worked on material related issues such as eutectic blow through, front side and backside contamination, and die cracking.
• Traced process problems back through the entire manufacturing process which included looking at wafer fab and epi.
Process Engineer
Cree
July 1997 – July 2001 (4 years 1 month)Durham, NC
• Provided engineering support for Package and Test department with a focus on dicing, wire bonding, epoxy die attach, wafer break, and tape transfer processes.
• Developed automated processes for inspection and dicing.
• Optimized ink and probe processes.
• Installed and qualified new machines.
• Provided equipment support for all machines in department, which entailed preventive maintenance and down machines.
• Increased process yield by 8% by implementing auto kerf check upgrade to dicing saws.
• Reduced dicing blade cost by 50% by improving blade life and qualifying a second source.
• Utilized DOE methodology to optimize process parameters.
• Traced process problems back through entire manufacturing process which included looking at wafer fab and epi.
Side and volunteer work (painting and general housekeeping)
Explore Church- Volunteer
Helped paint new church building. Shoveled snow off sidewalk.
REV Enterprises
• Property management assistant
• Landscaping work
Triangle Painting
• Residential and commercial painting construction
Education
North Carolina State University
Bachelor's degree, Materials Science
1992 – 1997
Graduated Magna Cum Laude. Received Doshi scholarship in 1994.
Activities and Societies: Worked at the Center for Advanced Materials and Processes Lab. Deposited thin films of TiN and AlN using magnetron sputtering. Maintained deposition equipment.
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