Mark Mobley

Irving, Texas *****

Cell: 951-***-****, Home: 927-***-****

Email: ac2hqw@r.postjobfree.com

Objective: To obtain a position with a solid engineering/technical firm.

Lead Technical Component R&D Engineer IV

Nokia – Supported R&D and Procurement, Irving, Texas (4/2014 – 8/2017)

This company designs 3G, 4G, and 5G telecommunication systems.

My accomplishments Included: Used: ISO9001, IPC-610, ISO14001

1.supported R&D, Engineering Groups, Manufacturing & Commodity Mgrs. world-wide;

2.Component Assessment, Component Technology, Component Manufacture, Component Failure Analysis, Component Specification, etc.

3.over RF, Backplane, board to board, power, and other connectors, their usage, their manufacture, materials, new technologies and platings;

4.performed/supported Failure Analysis as needed;

5.worked closely with and visited suppliers on a world-wide basis. Have used Silicon Expert.

System, Component, IC Engineer – Contract (12/2012 – 9/2013)

GE Hitachi Nuclear Energy – I&C Engineering Group, Wilmington, N.C.

This company designs Nuclear Reactor Power Plants.

My accomplishments Included: Used: IPC-610, NRC10 CFR 21, Mil-883

1.Supported Lungman Program, a Taiwan Project.

2.Received training in Nuclear Engineering Procedures & NRC 10 CFR 21.

3.Issued ECOs, determined Shelf Life’s, identified & specified electrical parts for nuclear reactor electrical control instrumentation.

Sr. Product Assurance Engineer III (8/2011 – 4/2012)

Teledyne Microelectronics – Quality Engineering Group, Marina Del Rey, CA.

This company designs & manufactures Hybrid Circuits for Military, Aerospace, & Comm.

My accomplishments Included: Used: IPC- A-610, AS9100, ISO9000:2008, MIL-883

1.set up SPC for all IC die/lead-frame wire bond processes on site. Guided Thick Film and Conductive Film Engineering in setting up SPC in their areas. Updated SPC controls & Trained Engineering for the Mexico plant;

2.supported Manufacturing using SPC, REGRESSION ANALYSIS and FMEAs to Identify Problems caused by: operators, materials, IC die bonders, and unapproved processes;

3.rewrote their SPC procedure;

4.performed Failure Analysis on Hybrid/IC Assemblies to determine cause of failure; and performed etching to high-light hybrid circuit cross-section details.

Sr. Compliance & IC Component Engineer (11/2007 – 1/2011)

Cardiac Science Inc. – AED R&D Engineering Group, Laguna Hills, CA.

This company designs automatic defibrillators and supports their manufacture.

My accomplishments Included: Used: 21 CFR 820, ISO13485, IPC-610

1.Supported R&D and Manufacturing on all IC & component issues;

2.chose & worked with Failure Analysis Houses to ensure all IC work was done well and on time and identified and handled counterfeit IC component issues;

3.built IC component databases in Agile & Excel, included ROHS & REACH information;

4.built R&D Project assembly BOMs and issued ECNs;

5.used FMEAs in IC component fault isolation;

6.received AAMI training for Design & Mfg. & 21 CFR 820, ISO13485 in 2009, 2010.

Assembly, IC Component Failure Analysis Engineer (5/2003 – 11/2007)

STEC – Quality Group, Santa Ana, CA.

This company designs and builds memory cards, flash cards, and flash drives.

My accomplishments Included: Used: IPC-610, ISO9001

1.supported R&D and Manufacturing in all IC component and manufacturing issues;

2.ran the Failure Analysis Group & supervised six techs & wrote reports to customers;

3.identified a Molex connector problem saving company approximately $45,000 per month;

4.identified a major IC Samsung NAND flash Mask CD issue;

5.identified counterfeit IC components;

6.calculated IC Assembly MTBFs using Mfrs. FIT numbers.

Other Companies:

Baker Hughes - 4/96 to 4/02 – Mfg./Component Eng., Started & Ran Evaluation/FA Company lab

Texas Microsystems – 92 to 96 – Operations Quality Engineer – ISO Registration, Assisted Mgmt. in all areas of establishing a ISO QA System.

Compaq Computer Corp. – 87 to 91 – Supplier Quality Eng. – Memory, Digital/Analog/Passives, set record for no receiving rejects for 7 months.

Harris Custom Integrated Circuits – 1985 – 1987 – Prod. Eng. Over Rad-hard ICs

Philips Semiconductor/Signetics - 1979 – 1985 – Fab Tech, TTL/PLD Prod. Engineer – over manufacturing, test, failure analysis, and specification.

Brigham Young University BS in Elect. Engineering Technology – RF Electronics 1984

Class – Lean Six Sigma Black Belt – Villanova University 2011

Statistical Process Control (SPC) – El Camino College 2012

ISTQB Certification CTFL - 2012

Hobbies – Wood Working, Writing – Working on Sci-Fi, HAM Radio

Member – ASM/EFAS International

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