ANDREY DIDENKO
Russia, Moscow, ******. Cell: +791********. Email: ******.*.*******@*****.***
Seeking for a challenging and rewarding position of a
Sr. Digital Design Engineer / SoC Architect
BUSINESS PROFILE:
Digital Design Engineer with 10 + years of experience in IP design and SoC architecture
Extensive practice in front-end design of complex IP-blocks including microarchitecture elaboration, specification writing, RTL-coding and testing
Strong skills in HDL RTL code writing for ASIC/FPGA implementations
Familiar with professional CAD tools and modern techniques & practices in the sphere
Practical knowledge of conventional PC I/O protocols including high-speed standards
Significant experience in system integration of 3-d party IPs
Excellent knowledge of AMBA protocols set
Awareness of SoC architecture design fundamentals and understanding of digital schemes implementation tradeoffs
Successful tape-outs of single-/multicore SoC architectures with multiple clock and power domains
Ability to find out and create custom solutions for system performance enhancements
SoC FPGA prototyping, adapting design for FPGA implementation
Valuable experience in debugging. Close cooperation with verification team engineers
INTERPERSONAL SKILLS:
Self-motivated, well-organized, dynamic and result-driven
Detail-oriented, able to schedule own workload and plan tasks
TECHNICAL SKILLS:
HDL: Verilog, System Verilog
Simulators: Synopsys VCS, Mentor Graphics ModelSim/QuestaSim
ASIC Tools: Synopsys Design Compiler
FPGA Tools: Altera Quartus, Xilinx Vivado, Synopsys Synplify, Synopsys Certify
Ptotocols: UART, PS/2, SPI, I2C, USB, PCI, PCIe, SRIO, MIL STD-1553, SD, USB,
Ethernet, MII, GMII, RGMII, AMBA APB, AHB, AXI3, AXI4
Version control: SVN, Git
Bug Tracking: Bugzilla, Redmine
WORK EXPERIENCE:
09.2015 – Present
Leading Design Engineer / SoC Architect at Tecon MT, Moscow
Played key role in the following projects:
-Multicore SoC for industrial applications with high level of robustness with
four CPU cores (RISC-V architecture), shared L2 cache, DDR3 memory controller, embedded four banks of on-chip SRAM and set of peripheral interfaces
-Microcontroller SoC for industrial real-time applications with CPU core (RISC-V architecture), embedded on-chip SRAM, Ethernet 1G, CAN, UART, SPI, I2C …
Defined architecture & microarchitecture of SoCs
Designed and debugged 1G Ethernet IP (MII, RGMII interfaces)
Worked out custom protocol of system interconnect with Network-on-Chip (NoC) structure. Developed NoC Router microarchitecture specification
Designed SRAM AXI4 Controller for memory banks access
Designed Clock Reset Unit for SoC’s domains synchronization control
Integrated Synopsys AXI Crossbar IP into design
06.2014 – 08.2015
Leader of FPGA group / SoC Architect at Baikal Electronics, Moscow
Was involved in the integration type project (mostly 3-rd party IPs):
-Multicore processor SoC for telecommunication tasks with two CPU cores (MIPS), shared L2 cache, DDR3 memory controller, PCIe Gen3, Ethernet 10G, SATA Gen3, USB2, low-speed interfaces
Participated in SoC microarchitecture elaboration
Designed system PMU (Power Management Unit) scheme
Supervised system integration and verification of PCIe Gen3 IP
Adapted SoC design for FPGA prototyping using Synopsys HAPS platform. Adaptation included: simplification of system synchronization scheme, design constraints definition (SDC, XDC), substitution of ASIC memories for FPGA primitives
Carried out iterative process of SoC design partitioning, implementation and debugging
Achieved stable prototype operation. Solved problems with DDR3 and SATA interfaces launching with the help of daughter cards
Succeeded in FPGA bare-metal testing and Linux startup before SoC was taped-out
06.2001 - 05.2014
From Graduate Design Engineer to Sr. Digital Design Engineer at MCST, Moscow
The main projects:
-Several generations of Northbridge and Southbridge chips for high performance systems
-Set of specialized FPGA-based daughter cards for system IO extensions
Elaborated proprietary protocol and designed two generations of link controller for interface between Northbridge (CPUs + MC) and Southbridge (Peripheral IO) chips.
While the first generation of link interface achieved 8 Gbps speed and was based on 8-lane parallel LVDS, the second generation increased link throughput to 80 Gbps with 16-lane PCIe Gen2 PHY. The designs were silicon-proven
Developed two generations of custom low-latency protocol and controllers for high-speed (up to 80 Gbps) inter-processor communication interface for multichip NUMA architecture. ASIC implementations were successful
Designed M2M communicational protocol and link controller with remote DMA feature support to speed up MPI performance in computer clusters. It was silicon proved.
Integrated Synopsys PCIe Gen1 Root Complex. Designed Transaction Layer logic to achieve more effective link throughput utilization
Engineered FPGA implementation of SRIO Gen2 interface controller. Designed Logic Layer functional block (IO and Message Passing specifications). Altera’s IP was integrated as a Physical Layer
Designed and debugged a set of interface controllers: USB1.1 (OHCI), SD, PS/2, UART, PCI-PCI Bridge, MIL-STD-1553
EDUCATION & TRAININGS:
2016 Doulos Training Courses. Intensive System Verilog & UVM
1999 – 2001 Master of Science in Applied Physics and Mathematics
Moscow Institute of Physics and Technology (MIPT), Moscow, Russia
1995 - 1999 Bachelor of Science in Applied Physics and Mathematics
Moscow Institute of Physics and Technology (MIPT), Moscow, Russia
ANY ADDITIONAL INFORMATION AVAILABLE ON REQUEST.