HARI SHANKAR SHUKLA

Phone : 408-***-**** (C); 650-***-**** (H)

Address : ** ******* ******, ******* ****, CA-94062

E-mail: ac1vkw@r.postjobfree.com,

Introduction:

A highly motivated, self-starter, innovative and hands-on executive/manager with record of leading design, development, testing and production of high volume cutting edge technology products, improving processes and procedures to drive budget, efficiency and time to market. Result-oriented visionary with unique background in hardware engineering and design; expertise in mobile devices, telecommunication, semiconductor chips, IoT, Automotive, systems integration, and product design. Strong strategic and long-range planning abilities; skilled in setting product and technology strategies and has diverse background covering design, engineering, user experience, innovation, quality, customer/marketing support and Startup environment.

PROFILE SUMMARY :

1) With over 19 years of industry experience and leading a team of highly skilled RF/Analog/Hardware/Software/Mixed-signal/Mechanical, Powermanagement engineers/managers across multiple global geographic locations and time zones in a matrix environment, build capability and infrastructure for new technology, has extensive experience in chip, circuit, system, sub-system and product design, development, testing in Semiconductor, IoT/Automotive, Telecom, Cellular, Satellite and Cable Industry.

2) Successful Product delivered/launched - Proven track record of delivering leading edge, low cost, high volume products from concept to production – Industry 1st 11ax chip; company’s !st LTE phone @ Blackberry. Other include WCN3980, WCN 3990 @ QC and @ Blackberry - Z10, BOLD 9930/9900 + variants, Curve 9330 / Curve 8530 and Pearl Flip 8230 to name a few.

3) Technical Leadership –

a) Ability to take calculated risk and challenges in driving towards innovation to achieving new milestones and efficiency. Driving 1st in industry/ company – 1st 11ax chip in industry/company; 1st LTE phone-product in Blackberry, 1st Antenna tuner solution on product in Blackberry.

b) Experience with complete product cycle -MRD to concept to production; define RF-Hardware Architecture, lead chip/silicon/product development, provide solutions which includes managing/coordinating with RF, Antenna, Desense, Connectivity (GPS/WLAN/BT/NFC), Co-existence, ESD/EMI/EMC, Board Level Schematic/CAD/PCB, Power, Parametric, Digital, HSIO, Mechanical, Quality, Audio, System, Software, Firmware, Planning, NPI Process, Vendor, OEM, Certification, Manufacturing, Operations and Program/Product management.

4) Functional Leadership - worked with direct, middle and higher management; manage direct reports which include performance appraisal, training, development, goal setting, leave, communication, team building, motivation, conflict resolution, planning, team budget, process improvement driving for efficiency, quality and budget milestones.

5) Experience – Has rich hands on design, development and test experience in

a) Technologies/Standards–3GPP/3GPP2, 4G, 5G, ANSI, LTE, CDMA2000/1x, GSM/Edge, WCDMA, UMTS-HSPA, GPS, BT/BLE, NFC, IoT, WLAN (a/b/g/n/ac/ax), Automotive, Satellite, Cable TV, Wireless Sensor, Digital Microwave Radio, WIMAX, DPD, Power Amplifier, FEM.

b) Techniques – Muti-carrier modulation (OFDM, QPSK, QAM), Diversity, MIMO, Carrier Aggregation, Current saving-APT, ET, EPT.

c) Design - Qualcomm/non-Qualcomm based products-phones, Data cards, modules, systems and sub-systems including individual blocks – FEM, Power Amplifier, Driver Amplifier, LNA, Switch, Up/Down Converter, PLL Synthesizer, Combiners, Filters (Lumped/Micro-strip/Tracking), Broadband RF IMD3 Compensation, Gain Control, RF Modulator/Demodulator (QPSK, 32/64/256 QAM), DC-DC Converters, switchers.

d) RF simulation/CAD software –Genesys - Eagleware, EESoF, HP-ADS, APLAC, Zukin, Mentor Graphics, OrCAD, Visual Basic.

e) Test instruments - CMW500/CMU200, Anritsu8820C, Agilent 8960, Spirent GPS Simulator, 4-port N/W Analyzer - Agilient E8357A, Vector Signal Analyzer, Spectrum Analyzer, Signal Generator, Noise Figure Meter, VCO/PLL Analyzer, Modulation Domain Analyzer, Digital Transmission Analyzer, Noise Figure Meter, Power Meter, Frequency Counter, CRO and Environment Chamber.

6) Inter-personal skills – Some of my many key strengths are :

a) Leadership, multi-tasking, ability to quickly adapt to new technologies, provide easy and fast solutions leading to performance enhancements, improved quality, value addition and cost reduction.

7) Appreciation - Received many appreciation awards and special merit increases for unique contribution in product development.

8) Linkedin Profile : ca.linkedin.com/pub/hari-shankar-shukla/a/1a/137/

PROJECT DETAILS :

1) DIRECTOR OR ENGINEERING @ QUALCOMM, San Jose, CA, USA (05/2016 – Present)

• Leadership style that focuses on developing, motivating and leading highly skilled managers/engineers to achieve stretch goals and difficult challenges often in the context of complexity and ambiguity. Highly results oriented and problem solver of extraordinary capability.

• Technical Management – build capability and infrastructure for 11ax technology, Industry’s and Qualcomm’s 1st 11ax chips (multiple chips / variants) on target for delivery, delivered 1st version. Delivered WCN3990 (2 variant) released into products by customers, WCN3980, QCA65x4, TC (3 variant), 2 Research projects. Building technical capabilities – defining architecture / long term technology road map, RF (WLAN/BT/FM/GPS/4G/5G - Tx, Rx, Synth), DPD, Power Amplifier, FEM, Co-existence, interference, Filters, Combiners, I/Q Calibration, Power management, LDO, Central Bias, ADC/DAC, Mixed Signal, HSIO (PCIe 2.0, 3.0; USB2.0,3.0; TIC, 10G SERDES), BB PLL, FM DPL, PDET/iCoupler, Temperature Sensor, FPGA/Firmware, Software/tools (Labview, Teststand, Pearl), Data processing–(Excel, Spotfire), PCB board design, MIMO.

• Project/Product Management - Managing multiple projects / product lines with multiple variations concurrently and teams spread across multiple geographic locations demonstrating excellent organization and analytical skills along with strong negotiating and influencing skills. Experience with complete product cycle -MRD to concept to production; define architecture, lead chip/silicon development, product development, NPI Process, provide solutions which includes managing/coordinating with RF, Co-existence, ESD/EMI/EMC, board level schematic/PCB, HSIO, Quality, Audio, System, Software, Firmware, Mechanical, Planning, OEM, manufacturing, operations, sales, marketing and Product/Project management.

• Resource Management - Managing hiring, developing, retaining and mentoring high performance team. Provide direction and directives to direct reports in the performance of their duties, establishing work priorities to achieve goals and thrive in a team-oriented environment while aiding in achieving company initiatives. Have excellent organizational, communication and conflict management skills.

• Budget - Providing portfolio and resource planning for existing and future needs–man power, equipment, space needs. Forecast and manage the budget for the team and projects.

• Team Management - Leading and motivating a high caliber team of over 30 local and offshore engineers developing solutions for design verification of highly integrated and complex chips - RF receivers/transmitters/transceivers, power management, HSIO’s, analog and mixed signal ICs by design and debug test interface hardware, implement test methodology, automate test equipment, and verify/characterize new devices from concept to high volume production on time against demanding schedules.

• Collaborated with various departments – design, engineering, system, DV, board design, ATE, PE, program management, product marketing, build planning, infrastructure and operations in developing product strategy, product roadmaps, and technology roadmaps to enable leadership. Ability to understand the market and competition and to think strategically to build long-term vision/technology roadmap for the organization.

• Process Development - Successfully implementing innovative and optimal processes to enable and improve quality, productivity, efficiency to ensure consistent, on-time, high-quality product deliverables leading to continued growth and success of the group and company. Monitor product quality throughout development and post-release, identify and escalate critical issues, ensuring product releases are as error-free as possible.

• Lab Management – Managing lab infrastructure - bench, equipment, calibration, ESD audit/compliance, safety, E-waste, planning.

2) Principal Engineer @ Broadcom Corporation, Sunnyvale, CA, USA (06/2014 – Present)

• Managed over 12 Customers and 40 Projects based on 802.11x WLAN/WiFi/OFDM, GPS, Bluetooth, Wireless charging and IoT-Wearable chips contributing to the development of next generation products and managing technical resources spread across various teams/geographic locations.

• Received "THE FIREMAN AWARD" in Nov 2014 for putting out fire on a very complex, technical & administrative, time and cost sensitive issue for an important customer.

• Provided technical leadership and support for multiple customer products / projects relating to 802.11x WLAN / WiFi / OFDM Systems, GPS, IoT and Bluetooth, Wireless Charging and other Radio Technologies, External Power Amplifier, FEM, Filter, Diplexer, Combiners which include -

o Develop architecture/product/project specifications and applications - Hardware/Software/Mechanical designed for generic/specific customer;

o Generate/provide reference design; test board design/debug and development; perform schematic and PCB layout reviews; power management, assist in RF tuning and hardware troubleshooting/bring-up, Co-existence/interference, power control accuracy, spurious emission, noise, harmonics, isolation, TIS/TRP, automating test equipment and implementing test methodology.

o Work on significant and unique issues where analysis of data requires an evaluation of intangibles and exercises independent judgment in methods, techniques and evaluation criteria for obtaining results.

o Provide technical training/presentation//support to Broadcom's staff and customers for products relating to WLAN, Bluetooth, Wireless Charging and other Radio Frequency technologies. Provide, present and interpret design, application and service information.

o Assist customers in technical evaluation of Broadcom products under consideration and give technical presentations.

o Help customers and internal teams in developing test solutions for design verification of highly integrated RF receivers, transmitters and transceivers on the Broadcom WLAN/BT chips.

o Hands on experience with test equipment – CMW500, LitePoint IQxel, Time-interval Analyzer, Logic Analyzer, Spirent GPS Simulator, Power Meter, Network Analyzer, Spectrum Analyzer, Signal/Frequency Generator, Frequency Counter, Oscilloscope and Environment Chamber.

o Modelling and simulation skills to analyze system performance and design implementation; using and modifying LabVIEW test software; Mixed Signal Design and analog PCB Design using Cadence Design System – Allergo PCB and CAD Interface / tool.

• Working with middle and upper management, managing resources (people / setup / lab time) spread across various teams and geographic locations – RF/HW, SW, FW, IC Design, Testing, System, Regulatory, Customer - Development/Factory/ Manufacturing, Operations to build and deliver quality products and services on time. Act as technical liaison between Design Teams/Factory Application teams and customers.

• Coordinate with Sales Account Manager to increase demand for Broadcom products pertaining to hardware and software application.

• Understand Broadcom products & customer's application to identify key technology & product feature for next generation products.

3) Team Lead - RF Hardware Development @ Blackberry, Ottawa, Canada (04/2008 – 03/2014)

• Leading a team of RF/Antenna/Desense/Connectivity (GPS/WLAN/BT/NFC), Co-existence, ESD/EMI/EMC, CAD/PCB/schematic designers to design and develop RF Hardware on next generation BB10 super phones.

• Functional Responsibilities – working with direct, middle and higher managers; managing direct reports, performance appraisal, goal setting, training, communication, team building, motivation, conflict resolution and team budget.

• Technical responsibilities include defining architecture for next generation products, managing direct reports as well as managing RF design and development activities (design, debug, calibration, verification, and certification) including close coordination in the antenna development efforts; interfacing with program/product management, various departments (mechanical, CAD/PCB, SW, Parametric, Quality, Power, Baseband, Audio, ESD/EMI/EMC), vendors, QC, certification houses, manufacturing and sustaining.

• Proven track record of delivering low cost, high volume products - Z10, Bold9930/Bold990; Curve8530 (CDMA), its refresh Curve9330 and BB Pearl Flip 8230 (First BB flip phone).

• Successfully lead debugging of many urgent and complicated issues with potential to have huge impact on production / multiple products.

• Active member of core team defining processes and procedures to be implemented at various stages to produce next generation super phones.

• Active member of core team that reviews development milestones in different programs (schematic, layout, test data etc.).

• Prepare reports and documents for management on the progress of the design including accomplishments and issues.

• Implemented many steps in an effort to shorten design cycle while maintaining/improving quality.

• Provided solution to optimize and reduce manufacturing time per phone resulting in sizable cost savings.

4) Staff / Sr. RF Engineer @ Sierra Wireless, USA and Canada (06/2005 – 04/2008)

• Design and develop RF on USB module development involving CDMA-IS2K/EVDO; GSM/EDGE/UMTS (HSDPA-HSUPA) bands plus GPS.

• Responsibilities include manage, design, debug, calibration and test CDMA-IS2K/EVDO-Rev0/A and GSM/EDGE/UMTS- HSPA based PC Cards, Mini Cards, EM Modules, USB Modules and ruggedized modems.

• Coordinate with other teams – PCB layout/design, firmware/software, mechanical design and manufacturing test for smooth design, development and transfer to production.

• Performed compliance testing for FCC, FTA and Industry Canada – conducted/radiated and FTA testing for modems.

• Provided cost effective solution to PCS Single Tone Desense problem, failures due to radiation problem and improvement in TX linearity at no additional cost on EVDO module.

• High level design of Dual technology (CDMA+WiMax) modem and presentation on “RF System/Circuit Design and Testing in WIMAX”.

• Supervise radiated testing of modules using GTEM, Anechoic and Satimo chambers. Devised a mechanism to use GTEM for radiated measurements in lieu of anechoic chamber resulting in considerable cost savings.

• Prepared a comprehensive document on “RF Requirement and Test Procedures for GSM/ UMTS” based on 3GPP standards; a comprehensive “Guide for RF Designers to Design RF Modules” for new hires.

• Provided component / cost reduction solutions, and optimized automated Lab test set up reducing test time by 40%.

• Prepared a detailed design report on “TX Diversity in CDMA Mobile Station” using current components coupled with smart design approach to meet performance and current limitation. Presented a technical paper on the same.

5) Senior RF Engineer @ Kyocera Wireless Corporation, San Diego, USA (03/2004 – 06/2005)

• RF Rx-Tx lead on Flip Phone Project; managed two Engineering Technicians.

• Manage, design, debug, calibration and testing of CDMA RF Transceiver – Cell, AMPS, PCS and GPS.

• Debugged PCS single tone desense problem with QC on Duplexer - led QC to define Triple-Beat requirement for duplexer.

• Provided solutions for eliminating difference between PCS and Cell GPS sensitivity on phone.

• Advance Tech Project -FM Radio Tuner and PA Linearizer for cell phone.

6) Senior RF Engineer @ Avaak Inc., San Diego, USA (10/2003 – 02/2004)

• Manage, design, develop, debug and test RF portion of Wireless Sensor Modules (2.5 GHz)

7) Senior RF Engineer @ Broadband Innovations Inc., San Diego, USA (09/2002 – 10/2003)

• Designed, developed and tested RF Portion of Broadband (DC – 1 GHz) Low Cost, Low Power, High Performance DQRM viz. 64/256 QAM Modulator, VCXO, PLL Synthesizer, IMD3 Compensation Circuit, Preamplifier, Gain Control, Power Amplifier, Switches, Frequency Agile Filters and DC-DC Converters. Redesigned VCXO Circuit for Up-converter.

• Implemented "Frequency Agile Filters" and “Broadband IMD3 Comp. Circuit to Improve Sideband Rejection” using discrete components.

8) Senior Member Technical Staff-RF @ Hughes Network Systems, San Diego, USA (08/2001 – 08/2002)

• Designed 4 watts 16 QAM Linear Power Amplifier (LDMOS) with one stage Driver amplifier to meet the ETSI Specifications (Mask, EVM, Harmonic rejection etc.) and still have considerable production margin. The design reduced the cost to half resulting in considerable savings.

• Designed low cost 2-stage low noise, high gain LNA & Switch (Satellite/GSM) for Thuraya Mobile phone.

• Feasibility study on the design of BGAN satellite modules.

• Paper on “Design of Low Cost High Power Linear Amplifier for 16 QAM Transmitter”.

9) RF and Microwave Design Engineer @ P.J. Microwave, Oulu, Finland (09/2000 – 02/2001)

• Designed Transmit and Receive PLL Synthesizer for TETRA based mobile phone for Nokia, Finland from a single Synthesizer chip. Time, space and cost were the constraints overcome.

10) Assistant Manager-RF @ Himachal Futuristic Communication Limited, India (12/1997 - 09/2000)

• Design of RF Modulator/Demodulator (32 QAM), LC/ Microstrip Filters, Power Amplifier, LNA, Up/Down Converter for 18 GHz SDH Radio.

• Designed Power Amplifier, PLL Synthesizer, LNA and RF Modulator/ Demodulator (QPSK) for Low cost 120/30 Channel 2 Ghz Digital Microwave Radio and 10 Channel UHF Radio from scratch to production. New system was 40 % cheaper than existing system.

• Designed Test Jigs for Generating PRBS Data-(215) PRBS, I/Q Data, I/Q Data BER Checking, 70 MHz Standard Modulator to test the sub-modules. This approach was to overcome instrument shortage.

• Designed Various Filters Low pass (2-70 MHz) and Band Pass (2-2.3 GHz) active, passive and microstrip.

• Transfer of Technology for 4/36 Multi Access Rural Radio. This included checking block diagram, schematics, circuit diagrams; preparation of Part List & BoM; modifications as per company requirement; preparation of documents and submission to TEC for approval.

• Set up a state of art R&D center in the country at Gurgaon, Haryana, India. Job includes developing sophisticated laboratory, office, inventory, library, assisting HR in recruitment and dealing with vendors.

11) Trainee-R&D @ Shyam Telecom Ltd, India (01/1997 - 11/1997)

• Design user friendly Signal Source for (3.7-4.2 GHz/4.5-4.8 GHz). The module included Frequency Doubler; Parallel Coupled Band Pass Filter, Amplifier, Attenuator. EESoF was used to stimulate the design.

TECHNICAL PAPERS / PRESENTATIONS :

• Submitted paper on Adaptive RF Matching Technique to Improve RF Performance, EMU 2007, Munich, Germany.

• RF System/Circuit Design and Testing in WIMAX.

• Use of GTEM for Radiated Moblie Station Testing in lieu of Anechoic Chamber.

• TX Diversity in CDMA Mobile Station.

• PCS Single Tone Desense – Cause and Selection Criteria for Duplexer.

• Simplified and Inexpensive Linearizer Circuit to Improve PA Linearity.

• Design of Frequency Agile Filters.

• Broadband IMD3 Compensation Circuit to Improve Sideband Rejection.

• Design of Low Cost High Power Linear Amplifier for 16 QAM Transmitter.

• Design of Low Cost QPSK RF Modulator/Demodulator for DMR.

TRAININGS :

• Leadership and Change, Qualcomm, USA.

• Management Skills Series: Impact and Influence, Qualcomm, USA.

• Leading High Performance Teams, Qualcomm, USA.

• The emotionally Powerful Leader, Qualcomm, USA.

• People management Essentials (R & D Group) training by RIM, Canada

• Completing Year End Performance Review by RIM, Canada.

• Leadership and communications training by RIM, Canada.

• W-CDMA and LTE Training from Rohde and Schwarz, Canada.

• CDMA 1x EVDO Rev 0 and EVDO Rev A Training, USA.

• GPS Fundamentals & Measurement Training, USA.

• CDMA IS-95 & IS-2000 (1x RTT) Training, USA.

• ISO 9001 Training at Hughes Network Systems, San Diego, USA.

• RF/Microwave Design techniques & components (filters, couplers, combiners/dividers, antenna, mixers & amplifiers etc) by Prof. Dr. S. K. Kaul, (Center of Applied Research in Electronics), IIT Delhi, India.

EDUCATION :

• Master of Technology (Microwave Electronics), Delhi University, Delhi, India.

• Master of Science-Electronics, ICSEI, D.A.V.V., Indore (M.P.), India.

• Bachelor of Science (Hons.)-Electronics, Delhi University, Delhi, India.

ACADEMIC ACHIEVEMENTS :

• First Division through out education.

• Delhi University Scholarship during Master of Technology, India.

• Top student at D.A.V.V. University in Master of Science, India.

• University’s Merit Scholarship during all semester in Master of Science, India.

REFERENCES :

• Available upon request.

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