LORITO E. VICTORIA

**** ******* ****, *** **** CA 95135 408-***-**** ac1pkj@r.postjobfree.com

EMPLOYMENT OBJECTIVE:

A challenging position in Manufacturing, Project/Program Management, Packaging, Process Development, Quality Control, Failure Analysis and Equipment Engineering in the Semiconductor Industry or Medical Devices.

ACHIEVEMENTS:

Manage process development for Laser Projection Module (LPM), selection and qualification of new Contract Manufacturing (CM) for cost reduction and increase capacity.

Manage material and Equipment supplier selection and qualification process.

Leader in transfer or injection Molding process and Trim/Form/Singulation tool design and fabrication, also perform the buy-off and installation of automatic equipments for semiconductor devices.

Leader in the development of other types of packages using metal leadframe or laminate (ceramic or PCB) with thermal dissipation consideration,..QFN, COB, Chip scale, SiP, WLP, stacked die, MEMS/MOEMS, Laser projection module and flip chip (FC) with solder balls, copper pillars or gold stud bump. Also familiar with hermetic packaging process (TO-metal can, ceramic pkg, butterfly metal pkg).

Manage the Die bonding, Wirebonding, glue dispensing, molding and TFS process development.

Evaluate different types of die attach epoxy, DAF and glue (conductive, non-conductive, low stress, UV cure) to meet MSL-1 requirements.

Developed custom metal leadframe, custom package design, assembly process, open cavity mold, trim, form, singulation tools and other automatic equipments to assemble Tire Pressure sensors, Accelerometer/MEMS devices and laser projection module.

PROFESSIONAL EXPERIENCE:

Over 10 years of increasing responsibility in the Optic/Electronics/Semiconductor Industry in the areas of Manufacturing, Project, Packaging, Assembly/Process Development, R&D, Production Supervision and Quality Control.

Manage multiple projects assigned. Perform weekly meetings to update the status of active projects.

Analysis of assembly and process defects, initiate corrective actions in 8D format. Perform process optimization, FMEA/Control Plan, yield improvement, failure analysis, quality control, DOE and documentation.

Responsible for vendor sourcing, process development, equipment/tool selection, buy-off, documentation and yield improvement.

Actively involved with equipment acquisition, including supplier and manufacturing subcontractor interface.

Provide inspection and testing of equipments and materials for Quality Control to insure strict compliance to specification.

Fulfilled supervision and management duties to insure proper manpower and man-hour levels were maintained. Meet production schedule and implement Standard Operating Procedures (SOP).

SPECIALIZED EQUIPMENT/SKILLS:

Wafer Back Grinding Trim/Form/Singulate SMT

Tin/Solder Plate Ink/Laser Marker Plasma clean

Die Attach (Epoxy/Eutectic) Solder Print(Stencil) Tape and Reel

Wire Bonding (Al/Au/Cu) Asymtek Auto Dispenser Bubble test

Molding (Auto/Transfer/Injection) Solder Reflow/wave Gross/Fine Leak Test

Bake/Reflow Oven Deburr /Deflash Resistance/Tig Welding

Disco Saw Die bonder(ESEC, ASM, Datacon)

EMPLOYMENT HISTORY:

Jabil Circuits Inc., 6375 San Ignacio Ave., San Jose CA 95119 Aug 2014 – May 2017

Sr. Packaging/Process Development Engineer, NPI – (Engineering Program Lead)

Support new product introduction (NPI) development activities from R&D to high volume MP, create SOW and maintain process flow, fixture design and review initial sample builds. Create plans and schedule for all New Product Introduction projects assigned and identify appropriate resources and financial requirements for manufacturing processes. Interface with customer and BU to review and understand new product requirements. Lead the development of materials, processes, tools and equipment. Travel to vendors for equipment evaluation and buy-off. Perform cost analysis on materials, process, tools/equipment based on mass production target volume. Leader in the design of Laser Projection Module and fabrication of tooling for proto-type builds. Generate work instructions and build sheet. Release and maintain product BOM. Perform continuous collaboration with Business Unit/Marketing, Design, Product, QA and Test engineers to address the issues, corrective actions and update the status of new product development. Work with Reliability and QA to perform product qualification. Interacting with and travelling to CM to transfer processes and equipment to a mass production line. Monitor processes and production performance, analyze data, optimize yield, improvement on product cycle time and initiate cost reduction programs.

BialaMeris Inc., 37500 Central Ct., Newark, CA 94560 Nov 2012 – May 2014

Sr. Manufacturing Engineer

Manage all engineering activities in production. Perform motion and time study to establish a standard operating time for each process. Monitor assembly procedures for continuous improvement. Also perform sustaining engineering, process mapping for failure analysis and corrective actions. Interface with equipment and material suppliers. Create process flow chart, manage Bill of Materials (BOM), perform ECNs when necessary. Participate in the design review and material procurement. Provide SOP and visual aids in performing box build assembly. Manage materials and equipment supplier qualification and selection process.

TriQuint Semiconductor, 3099 Orchard Drive, San Jose, CA 95134 Jan 2011– Apr 2012

Sr. Packaging/Process Engineer

Manage all phases of new product development, package design and assembly processes of different types of packages such as,..SOT, SOIC, QFN/DFN, Flip Chip(FC), CSP, Open Cavity package and MCM in laminate. Leader in the development of RF devices in 16L SOIC package and 5x7mm 40L QFN for CATV and mobile device use. The RF device is composed of multi-chip using conductive epoxy while other chips used Aluminum Nitride spacer for isolation. I introduced the use of non-conductive epoxy to isolate other chips to reduce the cost of package and improve output. Evaluate open cavity QFN for RF devices with multi-chip and longer wire requirements, also sustained QFNs in laminate with combination flip-chip and wirebond assembly. Qualify and support offshore Contract Manufacturing in Malaysia, China, Thailand and Philippines. Perform sustaining Engineering, evaluations, monitor daily production output and yield. Perform failure analysis and corrective actions on assembly related issues. Participate in the new product/package design review to assure that Assembly design rules are coordinated and followed. Create new specs/procedures or provide ECNs when necessary. Interface with material and equipment suppliers to improve yield and process.

Power Integrations Inc., 5265 Hellyer Ave., SJ, CA Oct 2002 – July 2008

Staff Assembly/Packaging Engineer - Support offshore CM in China, Malaysia, Philippines and Thailand. Manage all phases of New product development, package design, assembly process development including BOM and automatic equipment such as die attach, wirebond, mold and trim/form. Perform prototype build depending on package requirements (TO-220, PDIP, SOIC, QFN, CSP or Flip Chip, stacked die…etc), also perform process optimization to obtain package quality and reliability through SPC, FMEA, control plans and design of experiments. Perform failure analysis to determine root cause of rejects using CSAM, Thru-scan, SEM/EDX, T/C and decapsulation. Publish ECN to implement appropriate or improved assembly procedures and process specifications. Responsibility also includes interfacing with local or offshore machine shop for new tooling requirements. Work closely with Marketing, Design, Product, Test, Quality and Reliability Engineering to complete project deliverables. Monitor daily production output and yield at each offshore CM.

TRW-Nova Sensor, Fremont, CA June 2001- Sept 2002

Sr. Manufacturing/Process Engineer - Project Leader in Pressure Sensors, MEMS device Assembly. Collaborate with Marketing, Design, Product, Test, Quality/Reliability Engineers to create a custom metal leadframe and an open or air cavity package including BOM to meet RTPM MEMS device requirements, also created the process flow and work extensively with local machine shops for the manual and automatic tools needed (proto-type mold, trim, form and singulation tools). Interface with different material suppliers to finalize the BOM. Leader in the offshore Contract Manufacturing(CM) selection process. Release order and specifications to acquire automated equipments or tools for mass production, perform equipment/tool buy-off prior release to production. Write specifications and procedures for each assembly process, conduct training to operators and technicians prior transfer of technology to qualified CM.

CERTIFICATION/SPECIAL TRAINING:

Steps to Six Sigma Total Customer Satisfaction Essentials of Leadership

Design for Manufacturability Demand Flow Technology(DFT) Situational Leadership

Total Quality Management New Product & Supplier Development Visio

FMEA/Control Plan ISO/QS-9000/APQP/PPAP Adobe Illustrator

Project Mgmt, AMA

EDUCATION:

MAPUA INSTITUTE OF TECHNOLOGY

Bachelor of Science in Industrial Engineering

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